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    Titanium oxide sol and process for producing polyalkylene terephthalate therewith
    3.
    发明授权
    Titanium oxide sol and process for producing polyalkylene terephthalate therewith 失效
    氧化钛溶胶及其制备聚对苯二甲酸亚烷基酯的方法

    公开(公告)号：US07759270B2

    公开(公告)日：2010-07-20

    申请号：US11920253

    申请日：2006-05-11

    申请人： Jinichiro Kato ,  Yoshiki Takeda ,  Takafumi Konishi

    发明人： Jinichiro Kato ,  Yoshiki Takeda ,  Takafumi Konishi

    IPC分类号： B01J21/00

    CPC分类号： C08G63/85 ,  C08G63/183

    摘要： An environmentally friendly polymerization catalyst for polyalkylene terephthalate which does not use a heavy metal such as antimony, and a method for producing polyalkylene terephthalate using the catalyst. The catalyst for polymerizing a polyalkylene terephthalate is a titanium oxide sol containing an organic solvent as a dispersion medium, the sol has a light transmittance of not less than 50%, the light transmittance being measured by adjusting a concentration of the titanium oxide in the sol to 0.7 g/L and setting an optical path length to 1 cm in a wavelength range of 400 to 800 nm, and the amount of hydroxyl groups per 1 g of titanium oxide is not less than 1.8 mmol.

    摘要翻译： 用于不使用锑等重金属的聚对苯二甲酸亚烷基酯的环保聚合催化剂，以及使用该催化剂制造聚对苯二甲酸亚烷基酯的方法。 用于聚合聚对苯二甲酸亚烷基酯的催化剂是含有有机溶剂作为分散介质的氧化钛溶胶，所述溶胶的透光率不小于50％，所述透光率通过调节溶胶中的氧化钛的浓度来测量 至0.7g / L，并且在400至800nm的波长范围内将光路长度设置为1cm，并且每1g氧化钛的羟基量不小于1.8mmol。

    Titanium oxide sol and process for producing polyalkylene terephthalate therewith
    4.
    发明申请
    Titanium oxide sol and process for producing polyalkylene terephthalate therewith 失效
    氧化钛溶胶及其制备聚对苯二甲酸亚烷基酯的方法

    公开(公告)号：US20090069529A1

    公开(公告)日：2009-03-12

    申请号：US11920253

    申请日：2006-05-11

    申请人： Jinichiro Kato ,  Yoshiki Takeda ,  Takafumi Konishi

    发明人： Jinichiro Kato ,  Yoshiki Takeda ,  Takafumi Konishi

    IPC分类号： C08G63/16 ,  B01J21/06 ,  B01J23/06 ,  B01J21/08

    CPC分类号： C08G63/85 ,  C08G63/183

    摘要： An object of the present invention is to provide an environmentally friendly polymerization catalyst of polyalkylene terephthalate which does not use a heavy metal such as antimony. Another object of the present invention is to provide the method of producing polyalkylene terephthalate using the catalyst.The inventive titanium oxide sol for a catalyst for polymerizing a polyalkylene terephthalate is a titanium oxide sol containing an organic solvent as a dispersion medium, wherein the titanium oxide in the sol has a concentration of 0.7 g/L, the sol has a light transmittance of not less than 50%, the light transmittance being measured by setting an optical path length to 1 cm in a wavelength range of 400 to 800 nm, and the amount of hydroxyl groups per 1 g of titanium oxide is not less than 1.8 mmol.

    摘要翻译： 本发明的目的是提供一种不使用锑等重金属的聚对苯二甲酸亚烷基酯的环境友好的聚合催化剂。 本发明的另一个目的是提供使用该催化剂生产聚对苯二甲酸亚烷基酯的方法。 本发明的用于聚合聚对苯二甲酸亚烷基酯的催化剂的氧化钛溶胶是含有有机溶剂作为分散介质的氧化钛溶胶，其中溶胶中的氧化钛的浓度为0.7g / L，溶胶的透光率为 不小于50％时，透光率通过将光路长度设定为1〜400cm的波长范围而测定，每1g氧化钛的羟基量不低于1.8mmol。

    Method of production of circuit board utilizing electroplating
    5.
    发明申请
    Method of production of circuit board utilizing electroplating 有权
    电镀电路板生产方法

    公开(公告)号：US20060223223A1

    公开(公告)日：2006-10-05

    申请号：US11396203

    申请日：2006-03-30

    申请人： Hideyasu Okazawa ,  Yoshiki Takeda

    发明人： Hideyasu Okazawa ,  Yoshiki Takeda

    IPC分类号： C25D5/18

    CPC分类号： H05K3/243 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/427 ,  H05K2203/0542 ,  H05K2203/0723 ,  H05K2203/1394 ,  Y10T29/49165 ,  H01L2924/00014

    摘要： A method of production of a circuit board utilizing electroplating which prevents signal reflection and noise due to unnecessary parts in the circuit patterns when electroplating to form circuit patterns on the board to thereby improve the electrical properties and realize higher density layout of the circuit patterns, including the steps of forming a first electroless plating layer and an overlying first plating resist on a metal foil-clad insulating board, feeding power to the first electroless plating layer to form a first electroplating layer over the first electroless plating layer in resist openings; removing the first plating resist; removing the exposed first electroless plating layer and metal foil to expose the insulating board; forming a second electroless plating layer over the exposed parts of the board and the circuit patterns; forming a second plating resist over that; removing the second electroless plating layer at the resist openings; feeding power to the second electroless plating layer under the second plating resist to form a second electroplating layer over the circuit patterns in the resist openings; removing the second plating resist; and removing the exposed second electroless plating layer.

    摘要翻译： 一种利用电镀制造电路板的方法，当电镀形成电路图案时，防止由电路图形中的不必要部分引起的信号反射和噪声，从而改善电性能并实现电路图案的更高密度布局，包括 在金属箔包覆绝缘板上形成第一无电镀层和上覆第一电镀抗蚀剂的步骤，向第一无电镀层供电，在抗蚀剂开口中的第一化学镀层上形成第一电镀层; 去除第一电镀抗蚀剂; 去除暴露的第一化学镀层和金属箔以露出绝缘板; 在所述板的暴露部分和所述电路图案上形成第二无电镀层; 形成第二电镀抗蚀剂; 在抗蚀剂开口处去除第二无电镀层; 向第二电镀抗蚀剂下面的第二化学镀层供电，以在抗蚀剂开口中的电路图形上形成第二电镀层; 去除第二电镀抗蚀剂; 以及去除暴露的第二无电镀层。

    Semiconductor package having a heat slug
    6.
    发明授权
    Semiconductor package having a heat slug 失效
    具有散热片的半导体封装

    公开(公告)号：US5905634A

    公开(公告)日：1999-05-18

    申请号：US929812

    申请日：1997-09-15

    申请人： Yoshiki Takeda ,  Takemi Machida ,  Fumio Kuraishi

    发明人： Yoshiki Takeda ,  Takemi Machida ,  Fumio Kuraishi

    IPC分类号： H01L21/50 ,  H01L23/13 ,  H01L23/31 ,  H01L23/36 ,  H01L23/488 ,  H01L23/498 ,  H05K7/20

    CPC分类号： H01L23/49822 ,  H01L21/50 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/488 ,  H01L2224/49109 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/19041

    摘要： A semiconductor package uses no thermosetting adhesive for mounting a heat slug thereon, which adhesive requires a strict control during the storage and the production thereof. A semiconductor package comprises a circuit board having respective surfaces and an opening; a conductive layer formed on one of the surfaces of the circuit board so that the conductive layers are retracted from a peripheral edge of the opening by a certain distance; a heat slug attached to the one surface of the circuit board by means of solder so that the opening is closed at the one surface and opened at the other surface to form a cavity within which a semiconductor element mounting area is defined; and the heat slug is provided with a groove along a periphery of the semiconductor element mounting area and adjacent the peripheral edge of the opening.

    摘要翻译： 半导体封装不使用热固性粘合剂来在其上安装散热块，该粘合剂在储存和生产期间需要严格的控制。 半导体封装包括具有相应表面和开口的电路板; 形成在所述电路板的一个表面上的导电层，使得所述导电层从所述开口的周边边缘缩回一定距离; 散热片通过焊料附接到电路板的一个表面，使得开口在一个表面处封闭并在另一个表面处开口以形成其中限定了半导体元件安装区域的空腔; 并且散热块沿着半导体元件安装区域的周边设置有与开口的周缘相邻的凹槽。

    Process for manufacturing metal plane support for multi-layer lead frames
    8.
    发明授权
    Process for manufacturing metal plane support for multi-layer lead frames 失效
    多层引线框架的金属平面支撑制造工艺

    公开(公告)号：US5854094A

    公开(公告)日：1998-12-29

    申请号：US724429

    申请日：1996-10-01

    申请人： Hirofumi Fujii ,  Yoshiki Takeda ,  Mitsuharu Shimizu

    发明人： Hirofumi Fujii ,  Yoshiki Takeda ,  Mitsuharu Shimizu

    IPC分类号： H01L21/48 ,  H01L23/495 ,  H01L21/71

    CPC分类号： H01L21/4821 ,  H01L23/49527 ,  H01L2924/0002

    摘要： A process for manufacturing a metal plane support for making multi-layer lead frames adapted to be used for semiconductor devices. The lead frame support is made of a single thin metal strip having a plurality of lead frames continuously arranged in the longitudinal direction, the metal plane support is also made of a single thin metal strip and includes a plurality of metal planes, such as power supply planes, ground planes of the like, continuously arranged in the longitudinal direction corresponding to said plurality of lead frames. A pair of side rails are extending in the longitudinal direction for supporting the metal planes therebetween. The metal planes are connected to the rails via separating portions for removing the rails from the metal planes, after the metal planes are adhered to the corresponding lead frames.

    摘要翻译： 一种用于制造用于制造适于用于半导体器件的多层引线框的金属平面支撑件的方法。 引线框架支架由具有沿纵向连续布置的多个引线框架的单个薄金属条制成，金属平面支撑件也由单个薄金属条制成，并且包括多个金属平面，例如电源 平面，类似的接地平面，沿着与所述多个引线框架对应的纵向方向连续布置。 一对侧轨在纵向方向上延伸以支撑它们之间的金属平面。 在金属平面粘附到相应的引线框架之后，金属平面通过用于从金属平面移除轨道的分离部分连接到轨道。