摘要:
A semiconductor circuit device having a triple-well structure wherein a predetermined potential level is supplied to a top well without a contact region formed in the top well is disclosed. In an N-type ion implantation step for forming an N-type well region (1) in a P-type semiconductor substrate (5), a mask of a predetermined configuration is used so that ions are not implanted into a region of a portion which is to serve as a bottom portion (1B) of the well region (1). Then, the N-type well region (1) is formed which is shaped such that a portion (6) having P-type properties remains partially in the bottom portion (1B). The P-type portion (6) establishes electrical connection between a P-type well region (2) and the semiconductor substrate (5) to permit the potential applied to a contact region (4) to be supplied to the well region (2) therethrough. The portion (6) may include a plurality of portions (6) which allow uniform potential supply. This structure may be applied to basic cells of a memory cell array block.
摘要:
Memory mats provided in four regions formed by dividing a semiconductor chip are each further divided into a plurality of memory arrays along the longer side direction of the chip, row related circuits are provided between the memory arrays along the shorter side direction of the chip, and column decoders are provided along the longer side direction of the chip. An internal control signal from a master control circuit in the central part of the chip is transmitted in the central region with respect to the shorter side direction of the chip, buffer circuits are provided to an internal control signal transmission bus, and an internal signal is transmitted to the row related circuit and the column decoder by the buffer circuit. The length of the signal line to drive is shortened, and therefore the signal can be transmitted at a high speed, thus enabling high speed accessing. Thus, signal propagation delay can be reduced even if the chip size increases.
摘要:
When address signal bits and/or data bits in a predetermined pattern are accessed a predetermined number of times successively, a test mode can be set. By using address signal bits and/or data bits as a test command for designating a test content, a test content is specified. A semiconductor memory device with an interface compatible with an interface of a normal static random access memory is provided.
摘要:
A refresh circuit performs directive operation for the execution of refresh operation in response to a cycle signal cyclically output from a timer circuit provided in a command-signal activating circuit. To execute testing, a stop signal generated in response to an external signal is activated, the activated stop signal is input to an AND gate, and the cycle signal is thereby invalidated. This causes the refresh operation to terminate, thereby enabling this semiconductor memory device to refresh characteristic testing to be performed.
摘要:
An output buffer includes first current driving units connected in parallel between a power-supply voltage and an output node; second current driving units connected in parallel between a ground voltage and an output node; a plurality of operation selection circuits setting the respective first and second current driving units to be in either activated or inactivated state in a non-volatile manner; first signal transmission circuits arranged respectively corresponding to the first current driving circuits and each transmitting the level of output data with a similar first propagation time period; and second signal transmission circuits arranged respectively corresponding to the second current driving units and each transmitting the level of the output data with a similar second propagation time period.
摘要:
A variable impedance power supply line and a variable impedance ground line supplying voltages VCL1 and VSL1, respectively, are set to a low impedance state in a stand-by cycle and in a row related signal set period, and to a high impedance state in a column circuitry valid time period. Variable impedance power supply line and variable impedance ground line supplying voltages VCL2 and VSL2, respectively, are set to a high impedance state in the stand-by cycle, and low impedance state in the active cycle and in the row related signal reset time period. Inverters operate as operating power supply voltage of voltages VCL1 and VSL2 or voltages VCL2 and VSL1, in accordance with a logic level of an output signal in the stand-by cycle and in the active cycle. Thus a semiconductor memory device is provided in which subthreshold current in the stand-by cycle and active DC current in the active cycle can be reduced.
摘要:
On a surface of a semiconductor chip having a longer side and a shorter side, a line of a plurality of first pads and a line of a plurality of second pads are arranged in the shape of a cross. Upon multibit expansion, increase in length of the longer side of semiconductor chip can be suppressed even though the number of pads is increased by additionally providing the second pad. In addition, there is no need to reduce the pitch between pads. Thus, a semiconductor memory device allowing multibit expansion is provided without an increase in size of the chip and the pad or reduction in pitches between pads and between pins.
摘要:
Current is reduced in driving a word line in stress acceleration testing such as burn-in, and the time required for the stress acceleration testing is reduced. For an address signal applied from an address buffer, a predetermined internal address signal bit is degenerated and a remaining address signal bit is rendered valid in response to an activation of a stress acceleration mode designation signal to simultaneously drive a desired number of word lines of all word lines to selected state. Any number of word lines can be simultaneously selected and hence current flowing in driving word lines can be reduced in the stress acceleration mode. In the stress acceleration mode of operation, bit line voltage and cell plate voltage are changed, and a current required for driving a plurality of word lines into a selected state is limited.
摘要:
The level shifter circuit of an internal down converter includes a P channel MOS transistor constituting a resistance component, and a resistor constituting a resistance component. The temperature coefficient of resistance component is set larger than the temperature coefficient of resistance component so that the output voltage of level shifter circuit has a negative temperature characteristic. If a reference voltage generated by reference voltage generation circuit decreases when operating at a high temperature, the output voltage of level shifter circuit decreases as well. Thus, change in an internal voltage due to change in the operation temperature can be compensated.
摘要:
An input signal phase compensation circuit having a monitor mode and a normal operation mode includes a mode switching circuit, a logic gate receiving an internal data signal, a delay circuit connected to the logic gate, and a phase comparator comparing, in the monitor mode, phases of a signal output from the delay circuit and a clock signal, and determining time for delaying an internal clock signal in a variable delay circuit so as to match phases of the both signals. In the normal operation mode, the time is fixed, and data is obtained at phase compensated timing.