公开(公告)号：US20040123651A1

公开(公告)日：2004-07-01

申请号：US10717803

申请日：2003-11-19

Applicant: Xerox Corporation

Inventor： Thomas Hantschel ,  Eugene M. Chow ,  David K. Fork

IPC: G01N013/10 ,  G01B007/34

CPC classification number: G01Q70/10 ,  G01Q70/06 ,  G01Q70/16 ,  G01R1/06727 ,  Y10S977/873

Abstract: Scanning probe systems, which include scanning probe microscopes (SPMs), atomic force microscope (AFMs), or profilometers, are disclosed that use cantilevered spring (e.g., stressy metal) probes formed on transparent substrates. When released, a free end bends away from the substrate to form the cantilevered spring probe, which has an in-plane or out-of-plane tip at its free end. The spring probe is mounted in a scanning probe system and is used to scan or otherwise probe a substrate surface. The probes are used for topography, electrical, optical and thermal measurements.

Abstract translation: 公开了扫描探针系统，其包括扫描探针显微镜（SPM），原子力显微镜（AFM）或轮廓仪，其使用形成在透明基底上的悬臂弹簧（例如，应力金属）探针。 当释放时，自由端从基板弯曲以形成悬臂弹簧探针，其在其自由端具有平面内或平面外的尖端。 弹簧探针安装在扫描探针系统中，用于扫描或以其他方式探测衬底表面。 探头用于地形，电气，光学和热测量。

公开(公告)号：US20020125980A1

公开(公告)日：2002-09-12

申请号：US10004819

申请日：2001-12-07

Applicant: Xerox Corporation

Inventor： David K. Biegelsen ,  Christopher L. Chua ,  David K. Fork

IPC: H01F005/00

CPC classification number: H01F17/0006 ,  H01F17/0033 ,  H01F41/041 ,  H01F2027/2814 ,  H01G5/18 ,  H01G5/38 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/48091 ,  H01L2924/014 ,  H01L2924/19042 ,  H05K3/4092 ,  H01L2924/00014

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. Alternately, the loop winding can be formed of two elastic members in which the free ends are joined in mid-air. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

公开(公告)号：US20030182993A1

公开(公告)日：2003-10-02

申请号：US10112215

申请日：2002-03-29

Applicant: Xerox Corporation

Inventor： Thomas Hantschel ,  Eugene M. Chow ,  David K. Fork

IPC: G01N023/00

CPC classification number: G01Q70/10 ,  G01Q70/06 ,  G01Q70/16 ,  G01R1/06727 ,  Y10S977/873

Abstract: Scanning probe systems, which include scanning probe microscopes (SPMs), atomic force microscope (AFMs), or profilometers, are disclosed that use cantilevered spring (e.g., stressy metal) probes formed on transparent substrates. When released, a free end bends away from the substrate to form the cantilevered spring probe, which has an in-plane or out-of-plane tip at its free end. The spring probe is mounted in a scanning probe system and is used to scan or otherwise probe a substrate surface. A laser beam is directed through the transparent substrate onto the probe to measure tip movement during scanning or probing. Other detection schemes can also be used (e.g., interferometry, capacitive, piezoresistive). The probes are used for topography, electrical, optical and thermal measurements. The probes also allow an SPM to operate as a depth gauge.

公开(公告)号：US20020110758A1

公开(公告)日：2002-08-15

申请号：US09780165

申请日：2001-02-09

Applicant: Xerox Corporation

Inventor： David K. Fork ,  Christopher L. Chua

IPC: G03C005/00

CPC classification number: H01F17/0033 ,  H05K1/165 ,  H05K3/4092

Abstract: Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. Structures and methods for adjusting the coil diameter after spring release, if necessary, are also disclosed. In one method the radius of curvature of the released elastic members is controlled by depositing a layer of a reflow material and reflowing the layer after release. The high yield structures may be used in numerous electronic applications such as filter circuits.

Abstract translation: 描述了用于提高包括弹簧和线圈在内的平面外微结构结构的产量的几种方法和结构。 还公开了如果需要，在弹簧释放之后调节线圈直径的结构和方法。 在一种方法中，释放的弹性构件的曲率半径通过沉积回流材料层并在释放之后回流来控制。 高产量结构可用于许多电子应用中，例如滤波电路。

公开(公告)号：US20030027081A1

公开(公告)日：2003-02-06

申请号：US10154555

申请日：2002-05-23

Applicant: Xerox Corporation

Inventor： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC: H01R009/03 ,  G03C005/00

CPC classification number: H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract translation: 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

公开(公告)号：US20020013070A1

公开(公告)日：2002-01-31

申请号：US09923600

申请日：2001-08-06

Applicant: Xerox Corporation

Inventor： David K. Fork ,  Jackson Ho ,  Rachel King-ha Lau ,  JengPing Lu

IPC: H05K001/00

CPC classification number: G01R1/06716 ,  B81B2203/0118 ,  B81C1/00484 ,  B81C2201/0136 ,  B81C2203/058 ,  G01R1/06727 ,  G01R1/07342 ,  G01R3/00 ,  H01L23/49811 ,  H01L2924/0002 ,  H01R4/48 ,  H01R12/57 ,  H05K3/4092 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4914 ,  H01L2924/00

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.

Abstract translation: 通过使用单个掩模通过形成弹簧金属和释放材料层来将含有接触垫或金属通孔的弹性结构光刻制造到衬底上的有效方法。 具体地说，使用光致抗蚀剂掩模或电镀金属图案或使用剥离处理技术，释放材料垫与弹簧金属手指自对准。 然后使用释放掩模释放弹簧金属指，同时保持将弹簧金属指的锚固部分固定到基底的释放材料的一部分。 当释放材料是导电的（例如钛）时，该释放材料部分直接位于接触垫或金属通孔上方，并且用作在完成的弹簧结构中的弹簧金属指的导管。 当释放材料不导电时，形成金属带以将弹簧金属指连接到接触垫或金属通孔，并且还将弹簧金属指状物进一步锚定到基底。

公开(公告)号：US20030211761A1

公开(公告)日：2003-11-13

申请号：US10417544

申请日：2003-04-16

Applicant: Xerox Corporation

Inventor： David K. Fork ,  Ping Mei ,  Koenraad F. Van Schuylenbergh

IPC: H05K001/00 ,  H01R012/00

CPC classification number: H01L27/08 ,  H01F17/0033 ,  H01F41/041 ,  H01L21/4853 ,  H01L23/5227 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/4092 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  H01L2924/00

Abstract: Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the springs used to form out-of-plane structures are constrained via a tether to avoid bunching and entanglement. The high yield structure may be used in numerous electronic applications such as filter circuits.

公开(公告)号：US20030179064A1

公开(公告)日：2003-09-25

申请号：US10387203

申请日：2003-03-11

Applicant: Xerox Corporation

Inventor： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC: H01F005/00

CPC classification number: H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract translation: 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

公开(公告)号：US20020110757A1

公开(公告)日：2002-08-15

申请号：US09780163

申请日：2001-02-09

Applicant: Xerox Corporation

Inventor： David K. Fork ,  Ping Mei ,  Koenraad F. Van Schuylenbergh

IPC: H01F005/00 ,  G03F007/00 ,  H01F027/28 ,  H01G002/00

CPC classification number: H01L27/08 ,  H01F17/0033 ,  H01F41/041 ,  H01L21/4853 ,  H01L23/5227 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/4092 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  H01L2924/00

Abstract: Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the springs used to form out-of-plane structures are constrained via a tether to avoid bunching and entanglement. The high yield structure may be used in numerous electronic applications such as filter circuits.

Abstract translation: 描述了用于提高包括弹簧和线圈在内的平面外微结构结构的产量的几种方法和结构。 在一种方法中，用于形成平面外结构的弹簧通过绳索受到约束，以避免聚束和缠结。 高产量结构可用于许多电子应用中，例如滤波电路。

公开(公告)号：US20010053620A1

公开(公告)日：2001-12-20

申请号：US09794101

申请日：2001-02-28

Applicant: Xerox Corporation

Inventor： Christopher L. Chua ,  David K. Fork ,  Patrick G. Kim ,  Linda Romano

IPC: H05K001/00 ,  H01R012/00 ,  H01R013/44

CPC classification number: H05K3/325 ,  H01L21/563 ,  H01L24/10 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01R4/04 ,  H01R12/52 ,  H01L2924/00

Abstract: A method and apparatus for interconnecting at least two devices. Each of the interconnected devices includes a contact structure for electrically and/or physically interconnecting the devices. Preferably, the contact structure for at least one of the devices includes a spring contact. An adhesive, such as a UV-curable adhesive, is applied to at least a portion of one of the devices, and once the adhesive is applied, the devices are assembled, i.e., brought into sufficient proximity so that the contact structures interconnect the devices. The adhesive can be applied directly to contact structures of one of the devices and/or can be applied to other portions of the devices so that the adhesive flows around the contact structures during assembly. The adhesive is then cured to bond the devices together. Applying the adhesive before assembling the devices prevents interference with the interconnection between the contact structures, especially if the contact structures include spring contacts to be electrically connected with corresponding contact pads.

Abstract translation: 一种用于互连至少两个装置的方法和装置。 互连设备中的每一个包括用于电和/或物理互连设备的接触结构。 优选地，用于至少一个装置的接触结构包括弹簧接触件。 将诸如UV可固化粘合剂的粘合剂施加到装置中的一个的至少一部分，并且一旦施加了粘合剂，则将这些装置组装，即使其具有足够的接近性，使得接触结构将装置 。 粘合剂可以直接施加到装置中的一个的接触结构和/或可以施加到装置的其它部分，使得粘合剂在组装期间流过接触结构。 然后固化粘合剂以将装置粘合在一起。 在组装设备之前应用粘合剂可以防止接触结构之间的互连干扰，特别是如果接触结构包括与相应接触垫电连接的弹簧触点。