公开(公告)号：US20080136004A1

公开(公告)日：2008-06-12

申请号：US11608404

申请日：2006-12-08

Applicant: Wen-Kun Yang ,  Chun-Hui Yu ,  Chao-Nan Chou ,  Chih-Wei Lin ,  Ching-Shun Huang

Inventor： Wen-Kun Yang ,  Chun-Hui Yu ,  Chao-Nan Chou ,  Chih-Wei Lin ,  Ching-Shun Huang

IPC: H01L23/488 ,  H01L21/56

CPC classification number: H01L24/97 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/24226 ,  H01L2224/24246 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73209 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2224/81 ,  H01L2924/00012

Abstract: To pick and place standard first chip size package on a base with a second chip for obtaining an appropriate stacking chip size package than the original chip size package. The package structure has a larger chip size package than the size of the traditional stacking package. Moreover, the terminal pins of the flip chip package may be located on peripheral of LGA package or on array of BGA package.

Abstract translation: 在第二个芯片的基座上选择和放置标准的第一个芯片尺寸封装，以获得比原始芯片尺寸封装更适合的堆叠芯片尺寸封装。 封装结构具有比传统堆叠封装尺寸更大的芯片尺寸封装。 此外，倒装芯片封装的端子引脚可以位于LGA封装的外围或BGA封装的阵列上。

公开(公告)号：US20080085572A1

公开(公告)日：2008-04-10

申请号：US11538896

申请日：2006-10-05

Applicant: Wen-Kun Yang ,  Chih-Wei Lin ,  Chun-Hui Yu

Inventor： Wen-Kun Yang ,  Chih-Wei Lin ,  Chun-Hui Yu

IPC: H01L21/60

CPC classification number: H01L21/6835 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L2221/68354 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/73267 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701

Abstract: The present invention discloses a semiconductor packaging method, comprises steps of back lapping a processed silicon wafer to a desired thickness. Then, the dice are separated from the processed and lapped wafer into a single die. Then, the dice are picked and placed on a tool, an active surface of the dice is attached on the tool. A molding is performed to mold the dice by molding material. The tool is then removed from the dice to form a small unit. The next step is to arrange a plurality of the small units on a carrier in a matrix from. Then, a build-up layer, a re-distribution layer are formed over the dice, followed by forming solder balls on the dice. Finally, the carrier is removed.

Abstract translation: 本发明公开了一种半导体封装方法，包括将经处理的硅晶片背面研磨成所需厚度的步骤。 然后，将骰子从经处理和研磨的晶片分离成单个模具。 然后，骰子被拾取并放置在工具上，骰子的活动表面附着在工具上。 进行模制以通过模制材料模制骰子。 然后将该工具从骰子中移除以形成小单元。 下一步是将多个小单元布置在矩阵中的载体上。 然后，在骰子上形成堆积层，再分布层，随后在骰子上形成焊球。 最后，载体被移除。

公开(公告)号：US20080044945A1

公开(公告)日：2008-02-21

申请号：US11799923

申请日：2007-05-03

Applicant: Wen-Kun Yang ,  Wen-Bin Sun ,  Hsi-Ying Yuan ,  Chun Hui Yu

Inventor： Wen-Kun Yang ,  Wen-Bin Sun ,  Hsi-Ying Yuan ,  Chun Hui Yu

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  H01L23/5389 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01094 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.

Abstract translation: 公开了一种填充浆料结构和晶片级封装的工艺。 该方法包括填充粘合剂材料以填充多个骰子并覆盖多个骰子。 多个骰子粘附在形成在可移除基底上的共同状态下的粘度的胶图案上。 用粘合剂材料涂覆刚性基材以粘附骰子。 然后，在连接刚性基底之后，多个骰子由特殊的环境离开胶合图案。

公开(公告)号：US07222925B2

公开(公告)日：2007-05-29

申请号：US10948532

申请日：2004-09-22

Applicant: Shu Hui Yu ,  Cheng Kuang Chung

Inventor： Shu Hui Yu ,  Cheng Kuang Chung

IPC: A47B67/02

CPC classification number: F16M13/02

Abstract: A wall-mounted information appliance assembly includes an information appliance (10) defining a recess (132) therein, a pivot base (30), and a screw (40). The recess includes a plurality of spaced indents. A plurality of spaced projecting portions (33) is formed on the pivot base, and the projecting portions are partly engaged in the recess. Each projecting portion includes at least one tooth (35). The screw is for attaching the pivot base to a wall (50). The information appliance is attached to the pivot base, and is switchable between different attachment orientations with the indents of the information appliance being selectively engaged with the teeth of the pivot base.

Abstract translation: 壁挂式信息设备组件包括在其中限定凹部（132）的信息设备（10），枢轴座（30）和螺钉（40）。 凹部包括多个间隔开的凹口。 多个间隔开的突出部分（33）形成在枢转底座上，并且突出部分部分地接合在凹部中。 每个突出部分包括至少一个齿（35）。 螺钉用于将枢转底座附接到墙壁（50）。 信息装置附接到枢转底座，并且可在不同的附接方向之间切换，信息装置的凹口与枢转底座的齿选择性地接合。

公开(公告)号：US20070056712A1

公开(公告)日：2007-03-15

申请号：US11491896

申请日：2006-07-25

Applicant: Min-Hui Yu ,  Horng-Jou Wang ,  Chi-Feng Lin ,  Chin-Ming Chen

Inventor： Min-Hui Yu ,  Horng-Jou Wang ,  Chi-Feng Lin ,  Chin-Ming Chen

IPC: F28D15/00

CPC classification number: F28D15/0233 ,  F28D15/046 ,  F28F3/048 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation module includes a heat pipe and at least one fin, which is connected to and disposed on an external surface of the heat pipe. The heat pipe includes a casing, a wick and a working fluid. The casing has an accommodating space and a bottom portion. The bottom portion has an uneven surface facing the accommodating space. The wick is disposed over the uneven surface of the bottom portion and the working fluid is filled within the casing.

Abstract translation: 散热模块包括热管和至少一个翅片，其连接并设置在热管的外表面上。 热管包括壳体，芯和工作流体。 壳体具有容纳空间和底部。 底部具有面向容纳空间的不平坦表面。 芯体设置在底部的不平坦表面上，并且工作流体填充在壳体内。

公开(公告)号：US20070008701A1

公开(公告)日：2007-01-11

申请号：US11263830

申请日：2005-11-02

Applicant: Chin-Ming Cheng ,  Min-Hui Yu ,  Chi-Feng Lin ,  Chin-Ming Chen

Inventor： Chin-Ming Cheng ,  Min-Hui Yu ,  Chi-Feng Lin ,  Chin-Ming Chen

IPC: H05K7/20

CPC classification number: H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat-dissipating device. The heat-dissipating device includes a base, a plurality of heat-dissipating fins, and a fan. The heat-dissipating fins are disposed around the base. The base includes a first end surface and a second end surface. The first end surface contacts a heat source. The fan is disposed on the second end surface. An airflow space is formed between the heat-dissipating fins and the first end surface for airflow to pass through.

Abstract translation: 散热装置。 散热装置包括基座，多个散热翅片和风扇。 散热片设置在基座周围。 底座包括第一端面和第二端面。 第一端面接触热源。 风扇设置在第二端面上。 在散热片与第一端面之间形成气流通过气流通过。

公开(公告)号：US20060164809A1

公开(公告)日：2006-07-27

申请号：US11295530

申请日：2005-12-07

Applicant: Min-Hui Yu ,  Ming-Te Chuang ,  Chi-Feng Lin ,  Chin-Ming Chen

Inventor： Min-Hui Yu ,  Ming-Te Chuang ,  Chi-Feng Lin ,  Chin-Ming Chen

IPC: H05K7/20

CPC classification number: H01L23/427 ,  F28D15/0233 ,  F28D15/043 ,  F28F1/16 ,  F28F1/40 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation module includes a first annular wall, a second annular wall, at least one porous structure, at least one first heat conductive structure and second heat conductive structure. The second annular wall with respect to the first annular wall, and the first annular wall and the second annular wall are jointed to form a closed chamber. The porous structure is disposed on an inner surface of the closed chamber. The first heat conductive structure is externally connected to the first annular wall and the second heat conductive structure is internally connected to the second annular wall.

Abstract translation: 散热模块包括第一环形壁，第二环形壁，至少一个多孔结构，至少一个第一导热结构和第二导热结构。 相对于第一环形壁的第二环形壁和第一环形壁和第二环形壁被接合以形成封闭的腔室。 多孔结构设置在封闭室的内表面上。 第一导热结构外部连接到第一环形壁，第二导热结构内部连接到第二环形壁。

公开(公告)号：US20050196438A1

公开(公告)日：2005-09-08

申请号：US10836331

申请日：2004-05-03

Applicant: Wen-Che Wang ,  Hui-Yu Chen ,  Chih-Chiang Yang

Inventor： Wen-Che Wang ,  Hui-Yu Chen ,  Chih-Chiang Yang

IPC: A61K9/20

CPC classification number: A61K9/2018 ,  A61K9/0056 ,  A61K9/2077 ,  A61K31/167 ,  A61K31/426 ,  A61K31/44

Abstract: A fast dissolving tablet. The fast dissolving tablet comprises a pharmaceutically active ingredient, a starch, a hydrophilic polymer, a surfactant, and excipients. A method of preparing the fast dissolving tablet is also disclosed.

Abstract translation: 快速溶解片剂 快速溶解片剂包含药物活性成分，淀粉，亲水性聚合物，表面活性剂和赋形剂。 还公开了制备快速溶解片剂的方法。

公开(公告)号：US06819014B2

公开(公告)日：2004-11-16

申请号：US10102804

申请日：2002-03-22

Applicant: Chung Ping Kevin Lo ,  Hui Yu

Inventor： Chung Ping Kevin Lo ,  Hui Yu

IPC: H01H954

CPC classification number: H01H47/223 ,  H01F7/1811 ,  H01H47/32 ,  H01H2300/03 ,  Y02B70/3241 ,  Y02B90/224 ,  Y04S20/14 ,  Y04S20/227 ,  Y10T307/944

Abstract: This invention relates to an electrical power switch which is a two-terminal electrical power switch having a line-powered switching control mechanism. The electrical power switch is provided with first and second shunt circuits between the terminals of the power outlet. This switch for power to operate through the outlet is included in a first shunt circuit that also contains a power supply operating from current flowing through the switch when in the “ON” condition. This first power supply can power a control means to control the operative state of the switch while current flows through. When the switch is in the “OFF” state, a second power supply contained in a second shunt circuit provides power to the control means.

Abstract translation: 本发明涉及一种具有线路供电切换控制机构的双端电力开关的电力开关。 电源开关在电源插座的端子之间设有第一和第二分流电路。 用于通过插座操作的电源的开关包括在第一并联电路中，该第一并联电路还包含当处于“接通”状态时从流过开关的电流工作的电源。 当电流流过时，该第一电源可为控制装置供电以控制开关的操作状态。 当开关处于“关”状态时，包含在第二分路电路中的第二电源向控制装置提供电力。

公开(公告)号：US06489829B1

公开(公告)日：2002-12-03

申请号：US09834582

申请日：2001-04-12

Applicant: Tim Wen Hui Yu

Inventor： Tim Wen Hui Yu

IPC: H03K1716

CPC classification number: H03K17/163 ,  H03K17/167

Abstract: Circuits and methods to turn-on a power MOSFET switch while limiting rush current delivered to a load are disclosed. In an exemplary embodiment, a sense circuit senses when the power MOSFET is enhanced by a first level and a second level. A control circuit controls application of three drive forces to the gate of the power MOSFET in response to the sense circuit. The first drive force adjusts the voltage applied to the gate at a first rate. The second drive force adjusts the voltage applied to the gate at a second rate less than the first rate. The third drive force adjusts the voltage applied to the gate at a third rate greater than the second rate. The circuit utilizes most of the allotted turn-on time to linearly control the power MOSFET enhancement, providing optimal slew rate control and limiting the rush current delivered to the load.

Abstract translation: 公开了在限制输送到负载的冲击电流的同时接通功率MOSFET开关的电路和方法。 在示例性实施例中，感测电路感测功率MOSFET何时被增强了第一电平和第二电平。 控制电路响应于感测电路来控制对功率MOSFET的栅极的三个驱动力的应用。 第一驱动力以第一速率调节施加到门的电压。 第二驱动力以小于第一速率的第二速率调节施加到门的电压。 第三驱动力以大于第二速率的第三速率调节施加到栅极的电压。 该电路利用大部分分配的导通时间线性控制功率MOSFET增强，提供最佳的转换速率控制，并限制输送到负载的冲击电流。