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公开(公告)号：US11806673B2
公开(公告)日：2023-11-07
申请号：US17791991
申请日：2021-01-25
Applicant: Toray Industries, Inc.
Inventor： Shun Shimura , Masayuki Hanakawa , Kenta Iwai
Abstract: The present invention relates to a method of filtering an oil, the method including the following steps (A) and (B): (A) allowing a hydrophobic gas to permeate through a porous membrane including a hydrophobic polymer as a main component; and (B) allowing an oil to permeate through the porous membrane, in which the step (B) is performed after the hydrophobic gas that has permeated through the porous membrane is confirmed to have a relative humidity of 0 to 60% in the step (A).
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公开(公告)号：US20230339222A1
公开(公告)日：2023-10-26
申请号：US18010644
申请日：2021-06-25
Applicant: TORAY INDUSTRIES, INC.
Inventor： Takashi OCHI , Yoshikazu KONO
CPC classification number: B32B27/20 , B32B27/12 , B32B38/08 , B32B33/00 , B32B1/00 , B32B37/20 , B32B38/0004 , B32B27/08 , B32B2264/108 , B32B2264/303 , B32B2307/202 , B32B2305/076 , B32B2038/0076 , B32B2262/106
Abstract: A fiber-reinforced composite material including reinforcing fiber layers and a resin layer sandwiched therebetween, wherein conductive particles having a sphericity of 85% or more are disposed in the resin layer, and the fiber-reinforced composite material has a portion where upper and lower reinforcing fiber layers are connected by one conductive particle and has a portion where a conductive particle is sunk in a reinforcing fiber layer. Provided is a fiber-reinforced composite material having sufficient electrical conductivity in a thickness direction with a small addition amount of conductive particles.
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公开(公告)号：US11800656B2
公开(公告)日：2023-10-24
申请号：US16325342
申请日：2017-09-25
Applicant: TORAY INDUSTRIES, INC.
Inventor： Mitsushige Hamaguchi , Takashi Fujioka , Masato Honma
IPC: H05K5/02 , B32B5/28 , B29B7/90 , B29B9/06 , B29B9/14 , B29C45/14 , B32B5/02 , B32B27/12 , B32B27/20 , B29K63/00 , B29L31/34
CPC classification number: H05K5/0217 , B29B7/90 , B29B9/06 , B29B9/14 , B29C45/14336 , B32B5/022 , B32B5/28 , B32B27/12 , B32B27/20 , B29K2063/00 , B29K2713/00 , B29L2031/34 , B32B2457/00
Abstract: The invention aims to provide an electronic device housing that can maintain the antenna performance without deteriorating the radio communication performance, ensures uniform characteristics as one molded electronic device housing in spite of consisting of a plurality of members, and show excellent features in terms of the degree of warpage and dimensional accuracy as well as small deformation in high temperature environments and high mass productivity. The electronic device housing consists mainly of a fiber reinforcing member (a) and a fiber reinforcing member (b), the fiber reinforcing member (a) containing a resin (a1) and a fiber (a2), the fiber reinforcing member (b) containing a resin (b1) and a fiber (b2), the fiber reinforcing member (a) and the fiber reinforcing member (b) being joined directly without the existence of another layer at the joining face between the fiber reinforcing member (a) and the fiber reinforcing member (b), and the fiber reinforcing member (a) and the fiber reinforcing member (b) fulfilling a specific relation in terms of linear expansion coefficient and/or bending elastic modulus.
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公开(公告)号：US11794419B2
公开(公告)日：2023-10-24
申请号：US17598504
申请日：2020-03-09
Applicant: Toray Industries, Inc.
Inventor： Yusuke Yamanaka , Takafumi Hashimoto , Tetsuya Motohashi , Yasukazu Ono
IPC: B29C70/12 , B29B15/10 , B29C70/42 , C08J5/04 , B29K101/10 , B29K105/12 , B29K307/04
CPC classification number: B29C70/12 , B29B15/105 , B29C70/42 , C08J5/042 , B29K2101/10 , B29K2105/12 , B29K2307/04
Abstract: A fiber-reinforced resin molding material molded product includes a fiber-reinforced resin molding material prepared by impregnating chopped fiber bundles obtained by cutting a reinforcing fiber bundle with a matrix resin, wherein in a region excluding 30 mm from an edge of the molded product, when an arbitrary rectangular region having an area of 40 mm2 or more and defined by a thickness of the molded product and a width in a direction perpendicular to a thickness direction of the molded product is set in a cross section in an arbitrary thickness direction of the molded product, with respect to a bundle thickness of the chopped fiber bundles present in the set rectangular region.
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公开(公告)号：US11794385B2
公开(公告)日：2023-10-24
申请号：US16641447
申请日：2018-08-24
Applicant: Toray Industries, Inc.
Inventor： Takafumi Suzuki , Yuichiro Sento , Naokichi Imai , Mitsushige Hamaguchi , Masato Honma
CPC classification number: B29C45/0025 , B29C45/14631 , B32B27/08 , C08J5/24 , B32B2262/10 , B32B2307/546 , B32B2307/7376 , C08J2363/00 , Y10T428/24994 , Y10T428/249933
Abstract: The following configuration is adopted for the purpose of solving reduction in strength and rigidity at a weldline which is a problem of an injection molding body, and enabling free design such as thin wall molding or complex shape molding of the injection molding body. That is, there is provided
an integrally molded body in which a substrate for reinforcement (a) having a discontinuous fiber (a1) and a resin (a2) and an injection molding body (b) having a discontinuous fiber (b1) and a resin (b2) are integrated, the substrate for reinforcement (a) covering a part or all of a weldline of the injection molding body (b) to be integrated with the injection molding body (b),
the ratio of thickness Ta of the substrate for reinforcement (a) to thickness T of a weldline part of the integrally molded body satisfying relational expression:
in a case of Ea≠Ebw,
Ta/T≤((Ebw−√(Ea·Ebw))/(Ebw−Ea))
in a case of Ea=Ebw,
Ta/T≤0.5
wherein, Ta: Thickness of substrate for reinforcement (a),
T: Thickness of weldline part of integrally molded body,
Ea: Flexural modulus of substrate for reinforcement (a) in width direction of weldline, and
Ebw: Flexural modulus of weldline of injection molding body (b) in width direction of weldline.-
Patent Agency Ranking
公开(公告)号：US11794150B2
公开(公告)日：2023-10-24
申请号：US17786707
申请日：2020-12-23
Applicant: Toray Industries, Inc.
Inventor： Hiroki Eimura , Koichi Takada , Marina Otsuka , Masayuki Hanakawa
IPC: B01D69/02 , B01D65/08 , B01D67/00 , B01D69/08 , B01D71/22 , B01D71/34 , B01D71/40 , B01D71/44 , B01D71/48 , B01D71/52 , B01D71/56 , B01D71/66
CPC classification number: B01D69/02 , B01D65/08 , B01D67/0009 , B01D67/0083 , B01D69/08 , B01D71/22 , B01D71/34 , B01D71/40 , B01D71/44 , B01D71/48 , B01D71/52 , B01D71/56 , B01D71/66 , B01D2323/12 , B01D2325/022 , B01D2325/0283 , B01D2325/04 , B01D2325/20 , B01D2325/24
Abstract: The present invention relates to a separation membrane including a thermoplastic polymer selected from a cellulose ester and a polyamide, in which, when regions obtained by dividing a cross-sectional surface perpendicular to a longitudinal direction of the separation membrane into 5 at an equal interval are defined as regions 1 to 5, all the regions 1 to 5 have a number average pore diameter changing rate αi of −0.25 to 0.25, and at least one of the regions 1 to 5 is a region P that satisfies conditions (a) and (b): (a) a value of area average pore diameter Ds/number average pore diameter Dn is 2.50 to 6.00; and (b) a number average W of fine pores that are located at a distance smaller than La from a center of respective coarse pores is 10 to 30.
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公开(公告)号：US20230335697A1
公开(公告)日：2023-10-19
申请号：US18028659
申请日：2021-10-05
Applicant: TORAY INDUSTRIES, INC.
Inventor： Keika HASHIMOTO , Yuki MASUDA
IPC: H01L33/62 , H01L25/075 , H01L33/56 , H01L33/46
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/56 , H01L33/46 , H01L2933/0066 , H01L2933/005
Abstract: LED display devices emit light in all directions. Therefore, light is absorbed by peripheral insulating films for insulation of wiring, protective films, partition walls, and the like, and the light-extraction efficiency of a display becomes reduced, resulting in insufficient luminance. According to the present invention, such a problem is solved. This display device comprises at least: a metal wiring; a cured film; and a plurality of light-emitting elements. Each of the light-emitting elements is equipped with a pair of electrode terminals on one surface thereof. The pair of electrode terminals are connected to a plurality of strands of the metal wiring extending in the cured film. The plurality of strands of the metal wiring are configured to maintain electrical insulating properties due to the cured film. The cured film is obtained by curing a resin composition containing a resin (A). The transmittance of the cured film with respect to light having a wavelength of 450 nm is 80-100% at a thickness standard of 5 μm of the cured film.
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公开(公告)号：US20230323603A1
公开(公告)日：2023-10-12
申请号：US18014857
申请日：2021-07-08
Applicant: Toray Industries, Inc.
Inventor： Tomoko Takano , Hideaki Karasaki , Taira Omori
IPC: D21H21/34 , D21H17/37 , D21H17/36 , D21H23/24 , H01Q17/00 , D21H17/67 , D21H27/00 , D21H17/00 , D21H17/10 , D21H23/04
CPC classification number: D21H21/34 , D21H17/10 , D21H17/36 , D21H17/37 , D21H17/675 , D21H17/74 , D21H23/04 , D21H23/24 , D21H27/00 , H01Q17/00 , G01R29/0821
Abstract: An object of the present invention is to provide, in particular, flame-resistant paper for a radio wave absorber member, the flame-resistant paper being unlikely to break during the production process and having favorable producibility in addition to being suitable for a radio wave absorber member and having high flame resistance. The flame-resistant paper for a radio wave absorber member according to the present invention contains pulp, aluminum hydroxide, guanidine phosphate, a binder, and a conductive substance, in which the content of the pulp is 5 to 20 mass%, the content of the aluminum hydroxide is 40 to 70 mass%, the content of the guanidine phosphate is 10 to 20 mass%, the content of the binder is 5 to 10 mass%, and the content of the conductive substance is 0.1 to 12 mass%.
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公开(公告)号：US20230323569A1
公开(公告)日：2023-10-12
申请号：US18042205
申请日：2021-08-16
Applicant: Toray Industries, Inc.
Inventor： Tomohiko Matsuura , Masato Masuda , Shinya Kawahara , Kojiro Inada
CPC classification number: D01F8/14 , D01F1/08 , D10B2331/04
Abstract: A composite fiber includes: two or more kinds of polymers that have different dissolution rates in a solvent and are laminated in a direction from a fiber center to a fiber surface in a fiber cross section, in which an innermost layer including the fiber center includes an easily soluble polymer, and two kinds of hardly soluble polymers having different melting points are unevenly distributed in at least one layer other than the innermost layer.
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公开(公告)号：US20230323115A1
公开(公告)日：2023-10-12
申请号：US18021701
申请日：2021-10-18
Applicant: TORAY INDUSTRIES, INC.
Inventor： Taisuke KOGAWA , Jiao LU , Koji KADOWAKI , Masataka NAKAMURA
IPC: C08L67/04
CPC classification number: C08L67/04 , C08L2205/025 , C08L2201/06
Abstract: Disclosed is a polymer composition including a polyester copolymer and a biodegradable polymer, wherein the polyester copolymer includes two types of ester bond-forming monomer residues as main structural units, when the two types of ester bond-forming monomers are defined as “monomer A” and “monomer B”, respectively, the polyester copolymer satisfies (1) to (3) below, the biodegradable polymer has a melting point of 100° C. or higher, and the biodegradable polymer is included in an amount of 0.1% by weight or more and less than 30% by weight in 100% by weight of the total of the polyester copolymer and the biodegradable polymer. The present invention provides a polymer composition having low Young's modulus and high tensile strength. (1) An R value represented by the following formula is 0.45 or more and 0.99 or less. R=[AB]/(2[A][B])×100, where [A]: molar fraction (%) of monomer A residues in the polyester copolymer, [B]: molar fraction (%) of monomer B residues in the polyester copolymer, and [AB]: molar fraction (%) of a structure in which monomer A residues and monomer B residues are adjacent to each other (A-B and B-A) in the polyester copolymer. (2) A crystallization rate of monomer A residues and a crystallization rate of monomer B residues are less than 14%. (3) A melting point is lower than 100° C. or a clear melting point does not exist.
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