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公开(公告)号:US20230335697A1
公开(公告)日:2023-10-19
申请号:US18028659
申请日:2021-10-05
Applicant: TORAY INDUSTRIES, INC.
Inventor: Keika HASHIMOTO , Yuki MASUDA
IPC: H01L33/62 , H01L25/075 , H01L33/56 , H01L33/46
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/56 , H01L33/46 , H01L2933/0066 , H01L2933/005
Abstract: LED display devices emit light in all directions. Therefore, light is absorbed by peripheral insulating films for insulation of wiring, protective films, partition walls, and the like, and the light-extraction efficiency of a display becomes reduced, resulting in insufficient luminance. According to the present invention, such a problem is solved. This display device comprises at least: a metal wiring; a cured film; and a plurality of light-emitting elements. Each of the light-emitting elements is equipped with a pair of electrode terminals on one surface thereof. The pair of electrode terminals are connected to a plurality of strands of the metal wiring extending in the cured film. The plurality of strands of the metal wiring are configured to maintain electrical insulating properties due to the cured film. The cured film is obtained by curing a resin composition containing a resin (A). The transmittance of the cured film with respect to light having a wavelength of 450 nm is 80-100% at a thickness standard of 5 μm of the cured film.
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公开(公告)号:US20240038819A1
公开(公告)日:2024-02-01
申请号:US18028664
申请日:2021-10-05
Applicant: TORAY INDUSTRIES, INC.
Inventor: Keika HASHIMOTO , Yuki MASUDA , Takuma NISHIMURA
CPC classification number: H01L27/156 , H01L33/62 , H01L33/56 , H01L33/60 , H01L2933/005 , H01L2933/0066
Abstract: Problems have been presented in terms of the step flatness of cured films used, inter alia, as wiring-insulating insulation films or protective films formed so as to cover metal wirings or light-emitting elements such as LEDs. The present invention overcomes problems relating to the incidence of wiring defects such as short-circuiting and defects associated with light-emitting element connection, and problems relating to the light-emission fault rate when this display device has been produced. The present invention is a display device having at least a metal wiring, a cured film, and a plurality of light-emitting elements, wherein a pair of electrode terminals are provided on one surface of each of the light-emitting elements. The pair of electrode terminals are connected to a plurality of the metal wirings extending in the cured film. The metal wirings are configured so that electrical insulation properties are maintained by the cured film. The metal wirings have a plurality of metal wirings (K1) extending in the thickness direction of the cured film, and a plurality of metal wirings (K2) that are connected to the metal wiring (K1) and that extend in a planar direction perpendicular to the thickness direction of the cured film. The cured film is obtained by curing a resin composition containing resin (A) and has a cured film that is in contact with some of the surfaces of the metal wirings (K2). The display device has at least a region (G) in which the line spacing H1 between two of the metal wirings (K2) that are adjacent to one another is 1-20 μm. In the region (G), the ratio H3/H2 is 1.4-4.0, and the step flattening rate P (%) expressed by (Formula 1) is 70-99%, where H2 (μm) is the thickness of the metal wirings (K2), H3 (μm) is the thickness of the cured film, and H4 (μm) is the depth of a step in the cured film that was formed in the region (G). (Formula 1) P (%)=(1−(H4/H2))×100
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公开(公告)号:US20240297157A1
公开(公告)日:2024-09-05
申请号:US18569050
申请日:2022-04-15
Applicant: TORAY INDUSTRIES, INC.
Inventor: Takayuki KANEKI , Yu SHOJI , Keika HASHIMOTO
IPC: H10K59/124 , H10K59/131
CPC classification number: H10K59/124 , H10K59/131
Abstract: The purpose of the present invention is to obtain an insulation film with high reliability, the insulation film and a wiring line being not susceptible to the occurrence of a crack due to thermal stress difference between the insulation film for wiring insulation or a protective film and inorganic materials, namely a metal wiring line, an inorganic light emitting diode chip and a substrate. In order to achieve the purpose, the present invention provides a display device which comprises at least a metal wiring line, a cured film, an inorganic insulation film and a plurality of light emitting elements, wherein: the cured film is obtained by curing a resin composition that contains a resin (A); each of the light emitting elements is an inorganic light emitting diode that is provided with a pair of electrode terminals on either surface; the pair of electrode terminals are connected to a plurality of the metal wiring lines that extend in the inorganic insulation film and the cured film; the display device is configured such that electrical insulation is maintained among the plurality of metal wiring lines by means of the cured film and the inorganic insulation film; the display device comprises a plurality of the cured films; and the inorganic insulation film is arranged so as to be in contact with at least a part of the interlayer between the plurality of cured films.
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公开(公告)号:US20190250511A1
公开(公告)日:2019-08-15
申请号:US16329441
申请日:2017-08-30
Applicant: TORAY INDUSTRIES, INC.
Inventor: Yuki MASUDA , Keika HASHIMOTO , Ryoji OKUDA
IPC: G03F7/039 , C08G73/14 , C09D179/08 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , H01L51/00 , H01L23/00 , H01L27/12 , H01L27/32 , H01L51/56
CPC classification number: G03F7/039 , C08G69/26 , C08G73/06 , C08G73/10 , C08G73/14 , C08J5/18 , C09D179/08 , G03F7/004 , G03F7/023 , G03F7/16 , G03F7/162 , G03F7/168 , G03F7/2004 , G03F7/322 , G03F7/40 , H01L24/03 , H01L24/05 , H01L24/13 , H01L27/1248 , H01L27/3258 , H01L51/0018 , H01L51/0035 , H01L51/0043 , H01L51/56 , H01L2224/02331 , H01L2224/0239 , H01L2224/024 , H01L2224/03002 , H01L2224/03462 , H01L2224/0362 , H01L2224/13024 , H01L2227/323 , H01L2924/01029
Abstract: The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.
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公开(公告)号:US20170299965A1
公开(公告)日:2017-10-19
申请号:US15517093
申请日:2015-10-01
Applicant: TORAY INDUSTRIES, INC.
Inventor: Keika HASHIMOTO , Kazuto MIYOSHI , Masao TOMIKAWA
CPC classification number: G03F7/40 , C08L101/02 , C09D179/08 , G03F7/0046 , G03F7/0226 , G03F7/0233 , G03F7/0236 , G03F7/037 , G03F7/0387 , H01L21/027 , H01L27/3246 , H01L27/3258 , H01L29/786 , H01L51/529
Abstract: A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 μm after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.
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公开(公告)号:US20230369271A1
公开(公告)日:2023-11-16
申请号:US18246739
申请日:2021-10-05
Applicant: TORAY INDUSTRIES, INC.
Inventor: Keika HASHIMOTO , Yuki MASUDA , Yu SHOJI
IPC: H01L23/00 , H01L25/16 , H01L21/48 , H01L23/538 , H01L27/12
CPC classification number: H01L24/20 , H01L25/167 , H01L21/4857 , H01L23/5383 , H01L23/5385 , H01L25/162 , H01L27/1259 , H01L24/19 , H01L27/1248 , H01L2224/2101 , H01L2224/2105 , H01L2224/215 , H01L2924/01029 , H01L2224/19
Abstract: The present invention addresses the problem of degradation of design of an LED display device due to insufficient concealment of wiring by an insulating film for peripheral wiring insulation, a protection film, an isolating wall and the like. This display device comprises at least metal wires, a cured film, and a plurality of light emitting elements, the light emitting elements having a pair of electrode terminals on one surface thereof, the pair of electrode terminals connecting to a plurality of the metal wires extending in the cured film, the plurality of the metal wires being configured to retain an electrical insulating property due to the cured film, wherein the cured film is a film obtained by curing a resin composition comprising an (A) resin, wherein the transmittance of light of a wavelength 450 nm at a thickness reference 5 μm of the cured film is 0.1% to 79% inclusive.
The present invention addresses the problem of degradation of design of an LED display device due to insufficient concealment of wiring by an insulating film for peripheral wiring insulation, a protection film, an isolating wall and the like. This display device comprises at least metal wires, a cured film, and a plurality of light emitting elements, the light emitting elements having a pair of electrode terminals on one surface thereof, the pair of electrode terminals connecting to a plurality of the metal wires extending in the cured film, the plurality of the metal wires being configured to retain an electrical insulating property due to the cured film, wherein the cured film is a film obtained by curing a resin composition comprising an (A) resin, wherein the transmittance of light of a wavelength 450 nm at a thickness reference 5 μm of the cured film is 0.1% to 79% inclusive.-
公开(公告)号:US20210116810A1
公开(公告)日:2021-04-22
申请号:US17252934
申请日:2019-07-25
Applicant: TORAY INDUSTRIES, INC.
Inventor: Keika HASHIMOTO , Yuki MASUDA , Yuki TAKEYAMA
IPC: G03F7/038 , C08L79/08 , C08L61/34 , C08J5/18 , G03F7/039 , C08G73/10 , H01L23/00 , H01L23/31 , H01L23/538 , H01L21/48 , H01L49/02 , H01L27/12
Abstract: Provided is a resin composition which makes it possible to improve the resistance to a flux to be used in soldering and the resistance to reflow, and which, when used as a photosensitive resin composition, can be cured into a film capable of being imparted with such thick film processability that the film can be processed with high sensitivity even when the thickness of the film is as high as 15 μm or more. A resin composition comprising (A) a resin having a structural unit represented by general formula (1) and/or general formula (2), (B) a phenolic resin and (C) an antioxidant agent, wherein the phenolic resin (B) contains a structure represented by general formula (3).
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公开(公告)号:US20180011404A1
公开(公告)日:2018-01-11
申请号:US15712864
申请日:2017-09-22
Applicant: TORAY INDUSTRIES, INC.
Inventor: Keika HASHIMOTO , Satoshi KAMEMOTO , Kazuto MIYOSHI
CPC classification number: G03F7/0387 , C08G8/12 , C08G69/26 , C08G73/1007 , C08G73/1017 , C08G73/1039 , C08G73/106 , C08G73/1082 , C08G73/14 , C08G73/22 , C08G77/14 , C09D179/08 , C09D183/06 , G03F7/0007 , G03F7/0226 , G03F7/0233 , G03F7/027 , G03F7/0757 , G03F7/105 , H01L27/3244 , H01L27/3274 , H01L51/5284 , C08L61/06
Abstract: The invention aims to provide a photosensitive colored resin composition and a heat resistant colored resin film produced therefrom that has the function of absorbing light in the shorter visible wavelength range with high sensitivity to serve effectively as planarizing film, insulation layer, and barrier rib used in organic luminescence apparatuses and display elements and the function of reducing external light reflection. The photosensitive colored resin composition includes an alkali-soluble resin (a), a photosensitive compound (b), and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm, the photosensitive compound (b) containing a photosensitive compound (b1), the photosensitive compound (b1) being such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or less is located within the wavelength range of 350 nm or more and 390 nm or less.
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