公开(公告)号：US20090282673A1

公开(公告)日：2009-11-19

申请号：US12316750

申请日：2008-12-15

申请人： Chih-Ming Huang ,  Chih-Lun Chen

发明人： Chih-Ming Huang ,  Chih-Lun Chen

IPC分类号： G02B7/04

CPC分类号： G02B7/026 ,  G03B13/32 ,  Y10T29/53

摘要： A lens-fastening apparatus for assembling a voice coil motor of a camera module is provided. The voice coil motor has a lens holder. The lens-fastening apparatus includes a guiding plate; a rotation stopping jig having a central and a lateral portions, disposed on the guiding plate, and fit with the lens holder for stopping a rotation of the lens holder; a focusing ring for rotating the lens; a first pressing device pressing the central portion of the rotation stopping jig to fasten the rotation stopping jig on the guiding plate; and a second pressing device pressing the lateral portion of the rotation stopping jig.

摘要翻译： 提供了一种用于组装相机模块的音圈电机的镜头固定装置。 音圈电机具有透镜架。 透镜紧固装置包括导板; 具有中央和外侧部分的旋转止动夹具，设置在所述引导板上，并与所述透镜保持器配合以停止所述透镜保持器的旋转; 用于旋转透镜的聚焦环; 按压所述旋转停止夹具的中心部分的第一按压装置将所述转动停止夹具紧固在所述引导板上; 以及按压旋转停止夹具的侧部的第二按压装置。

公开(公告)号：US20080105941A1

公开(公告)日：2008-05-08

申请号：US11982514

申请日：2007-11-02

申请人： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

发明人： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L31/0203 ,  H01L21/00

CPC分类号： H01L31/0203 ,  H01L23/3128 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The invention provides a sensor-type semiconductor package and fabrication method thereof. The fabrication method includes steps of: attaching a sensor chip to a chip carrier; electrically connecting the sensor chip and a chip carrier via a plurality of bonding wires; mounting a light-permeable body to the sensor chip with an adhesive layer as a partition therebetween, wherein the planar size of the light-permeable body is larger than a predefined planar size of the sensor-type semiconductor package to be formed; forming an encapsulant on the chip carrier for encapsulating the sensor chip and the bonding wires with the upper surface of the light-permeable body being exposed from the encapsulant; and cutting through the light-permeable body, the encapsulant and the chip carrier according to the predefined planar size. Accordingly the contacting area between the cut light-permeable body and the cut encapsulant increased and the bonding therebetween is reinforced.

摘要翻译： 本发明提供一种传感器型半导体封装及其制造方法。 该制造方法包括以下步骤：将传感器芯片附接到芯片载体; 经由多根接合线电连接传感器芯片和芯片载体; 将透光体安装到传感器芯片上，其中粘合剂层作为其间的隔板，其中透光体的平面尺寸大于要形成的传感器型半导体封装的预定平面尺寸; 在所述芯片载体上形成密封剂，用于封装所述传感器芯片，并且所述接合线与所述透光体的上表面暴露于所述密封剂; 并根据预定的平面尺寸切穿透光体，密封剂和芯片载体。 因此，切割的透光体和切割的密封剂之间的接触面积增加，并且增强了它们之间的粘结。

公开(公告)号：US20080075439A1

公开(公告)日：2008-03-27

申请号：US11861838

申请日：2007-09-26

申请人： Chih-Ming Huang

发明人： Chih-Ming Huang

IPC分类号： H02P7/29

CPC分类号： H02P6/08 ,  H02P6/14

摘要： A torque compensation method and system for a DC brushless motor. When the DC brushless motor coupled with an asymmetric load is rotating, the difference between an instant current and an average current of a shunt resister is an index of adjusting control signals within an absolute rotor position for the purpose of approaching the corresponding instant current to the average current.

摘要翻译： 一种用于直流无刷电机的转矩补偿方法和系统。 当与非对称负载耦合的DC无刷电动机旋转时，分流电阻器的瞬时电流和平均电流之间的差异是在绝对转子位置内调整控制信号的指标，以便接近对应于瞬时电流 平均电流。

公开(公告)号：US07339280B2

公开(公告)日：2008-03-04

申请号：US10319211

申请日：2002-12-13

申请人： Jui-Yu Chuang ,  Lien-Chi Chan ,  Chih-Ming Huang

发明人： Jui-Yu Chuang ,  Lien-Chi Chan ,  Chih-Ming Huang

IPC分类号： H01L23/29

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package with a lead frame as a chip carrier and a method for fabricating the same are provided. The lead frame includes a die pad and a plurality of leads properly spaced apart from the die pad, each lead being composed of an inner lead portion and an outer lead portion, wherein the inner lead portion is directed toward the die pad, and the outer lead portion has a terminal. At least a chip is mounted on the die pad, and a first encapsulant is formed for encapsulating the chip, die pad and inner lead portions. An injection-molded second encapsulant is formed for encapsulating the first encapsulant and outer lead portions, but exposing the terminals of the outer lead portions. The second encapsulant made by injection molding can prevent resin flash over the exposed terminals, thereby assuring electrical-connection quality of the semiconductor package.

摘要翻译： 提供了具有引线框架作为芯片载体的半导体封装及其制造方法。 引线框架包括管芯焊盘和与管芯焊盘适当间隔开的多个引线，每个引线由内引线部分和外引线部分组成，其中内引线部分指向管芯焊盘，外引线 引线部分具有端子。 至少芯片安装在管芯焊盘上，形成第一密封剂以封装芯片，管芯焊盘和内引线部分。 形成注射成型的第二密封剂，用于封装第一密封剂和外引线部分，但暴露外引线部分的端子。 通过注射成型制成的第二密封剂可以防止树脂在暴露的端子上闪烁，从而确保半导体封装的电连接质量。

公开(公告)号：US20070202633A1

公开(公告)日：2007-08-30

申请号：US11651708

申请日：2007-01-09

申请人： Wen-Tsung Tseng ,  Fang-Lin Tsai ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao ,  Chih-Ming Huang

发明人： Wen-Tsung Tseng ,  Fang-Lin Tsai ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao ,  Chih-Ming Huang

IPC分类号： H01L21/00

CPC分类号： H01L21/4882 ,  H01L23/3675 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A semiconductor package and a method for fabricating the same are provided. The method includes providing a substrate having recognition points and a heat sink having openings, and placing the heat sink on the substrate with the recognition points being exposed through the openings; using a checking system to inspect the recognition points through the openings so as to ensure that the heat sink is placed at a predetermined position on the substrate; and attaching the heat sink to the substrate via an adhesive. By the above semiconductor package and method, there is no need to form positioning holes in the substrate such that any adverse effect on the circuit layout and reliability of the semiconductor package is avoided, and any positional shifting of the heat sink relative to the substrate can be determined in a real time manner.

摘要翻译： 提供半导体封装及其制造方法。 该方法包括提供具有识别点的基板和具有开口的散热器，并且将散热器放置在基板上，识别点通过开口露出; 使用检查系统通过开口检查识别点，以确保散热器被放置在基板上的预定位置; 以及通过粘合剂将散热器附接到基板。 通过上述半导体封装和方法，不需要在衬底中形成定位孔，从而避免对半导体封装的电路布局和可靠性的任何不利影响，并且散热片相对于衬底的任何位置偏移可以 以实时的方式确定。

公开(公告)号：US07173828B2

公开(公告)日：2007-02-06

申请号：US10674317

申请日：2003-09-29

申请人： Ying-Ren Lin ,  Chih-Ming Huang ,  Ho-Yi Tsai

发明人： Ying-Ren Lin ,  Chih-Ming Huang ,  Ho-Yi Tsai

IPC分类号： H05K1/11

CPC分类号： H05K1/111 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/17 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16106 ,  H01L2224/16237 ,  H01L2224/17051 ,  H01L2224/17106 ,  H01L2924/01087 ,  H01L2924/15311 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2224/17104 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A ground pad structure for preventing solder extrusion and a semiconductor package having the ground pad structure are disclosed, wherein the ground pad structure has the ground pads located along the circumference of its ground plane be formed in a non-solder mask defined manner. Accordingly, a good grounding quality is maintained, and the occurrence of the electrical bridging among the adjacent conductive traces can be avoided as the extrusion of the molten solder bumps from the ground pads located along the ground pad structure's circumference toward their adjacent conductive traces is effectively prevented.

摘要翻译： 公开了一种用于防止焊料挤出的接地焊盘结构和具有接地焊盘结构的半导体封装，其中接地焊盘结构具有沿其接地平面的圆周定位的接地焊盘以非阻焊掩模定义的方式形成。 因此，保持良好的接地质量，并且可以避免相邻导电迹线之间的电桥接的发生，因为熔融焊料凸块从沿着接地焊盘结构的圆周朝向其相邻导电迹线的接地焊盘的挤出是有效的 防止了

公开(公告)号：US20050023704A1

公开(公告)日：2005-02-03

申请号：US10674317

申请日：2003-09-29

申请人： Ying-Ren Lin ,  Chih-Ming Huang ,  Ho-Yi Tsai

发明人： Ying-Ren Lin ,  Chih-Ming Huang ,  Ho-Yi Tsai

IPC分类号： H01L23/498 ,  H01L23/50 ,  H05K1/11 ,  H05K3/28 ,  H05K3/34 ,  H05K7/14 ,  H01L23/48

CPC分类号： H05K1/111 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/17 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16106 ,  H01L2224/16237 ,  H01L2224/17051 ,  H01L2224/17106 ,  H01L2924/01087 ,  H01L2924/15311 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2224/17104 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A ground pad structure for preventing solder extrusion and a semiconductor package having the ground pad structure are disclosed, wherein the ground pad structure has the ground pads located along the circumference of its ground plane be formed in a non-solder mask defined manner. Accordingly, a good grounding quality is maintained, and the occurrence of the electrical bridging among the adjacent conductive traces can be avoided as the extrusion of the molten solder bumps from the ground pads located along the ground pad structure's circumference toward their adjacent conductive traces is effectively prevented.

摘要翻译： 公开了一种用于防止焊料挤出的接地焊盘结构和具有接地焊盘结构的半导体封装，其中接地焊盘结构具有沿其接地平面的圆周定位的接地焊盘以非阻焊掩模定义的方式形成。 因此，保持良好的接地质量，并且可以避免相邻导电迹线之间的电桥接的发生，因为熔融焊料凸块从沿着接地焊盘结构的圆周朝向其相邻导电迹线的接地焊盘的挤出是有效的 防止了

公开(公告)号：US08420430B2

公开(公告)日：2013-04-16

申请号：US12769087

申请日：2010-04-28

申请人： Chi-Hsin Chiu ,  Chih-Ming Huang ,  Chang-Yueh Chan ,  Hsin-Yi Liao ,  Chun-Chi Ke

发明人： Chi-Hsin Chiu ,  Chih-Ming Huang ,  Chang-Yueh Chan ,  Hsin-Yi Liao ,  Chun-Chi Ke

IPC分类号： H01L21/56 ,  H01L21/60

CPC分类号： B81B7/0064 ,  B81B7/007 ,  B81B2207/095 ,  H01L21/56 ,  H01L23/315 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A fabrication method of a package structure having at least an MEMS element is provided, including: preparing a wafer having electrical connection pads and the at least an MEMS element; disposing lids for covering the at least an MEMS element, the lids having a metal layer formed thereon; electrically connecting the electrical connection pads and the metal layer with bonding wires; forming an encapsulant for covering the lids, bonding wires, electrical connection pads and metal layer; removing portions of the encapsulant to separate the bonding wires each into first and second sub-bonding wires, wherein top ends of the first and second sub-bonding wires are exposed, the first sub-bonding wires electrically connecting to the electrical connection pads, and the second sub-bonding wires electrically connecting to the metal layer; forming metallic traces on the encapsulant for electrically connecting to the first sub-bonding wires; forming bumps on the metallic traces; and performing a singulation process.

摘要翻译： 提供具有至少MEMS元件的封装结构的制造方法，包括：制备具有电连接焊盘和所述至少MEMS元件的晶片; 设置用于覆盖所述至少一个MEMS元件的盖，所述盖具有在其上形成的金属层; 电连接焊盘和金属层与接合线; 形成用于覆盖盖子，接合线，电连接垫和金属层的密封剂; 去除所述密封剂的部分以将所述接合线分别分离成第一和第二子接合线，其中所述第一和第二次接合线的顶端被暴露，所述第一子接合线电连接到所述电连接焊盘，以及 所述第二子接合线电连接到所述金属层; 在所述密封剂上形成用于电连接到所述第一子接合线的金属迹线; 在金属痕迹上形成凸块; 并执行单独处理。

公开(公告)号：US20090284851A1

公开(公告)日：2009-11-19

申请号：US12353750

申请日：2009-01-14

申请人： Chih-Ming Huang ,  Chih-Lun Chen

发明人： Chih-Ming Huang ,  Chih-Lun Chen

IPC分类号： G02B7/02

CPC分类号： G02B7/08 ,  G03B3/10

摘要： A device for locking lens and a method for the same are provided. The device is used in a voice-coil motor of a photographing module of a cell phone. The voice-coil motor has a lens-stand for a lens being turned to a locking depth inside. The device includes a circumgyration-stop instrument having a first sustaining surface, and a focusing ring having a turning end. A turn-locking length of the turning end is equal to the locking depth inside. The device includes a circumgyration-stop preventing a pressure being persisted to apply on the lens as the focusing ring finishes the turn of the lens. The first turn-stop surface props the first sustaining surface as the focusing ring is turned to an extremity of the turn-locking length. The focusing ring accordingly escapes the circumgyration-stop instrument for finishing the focusing of the lens in the lens-stand.

摘要翻译： 提供一种用于锁定镜头的装置及其方法。 该装置用于手机拍摄模块的音圈电机。 音圈电机具有用于透镜转向内部锁定深度的透镜架。 该装置包括具有第一维持表面的旋转停止装置和具有转向端的聚焦环。 转向端的转向锁定长度等于内部的锁定深度。 该装置包括环绕止动件，防止当聚焦环完成透镜转动时持续施加在透镜上的压力。 当聚焦环转到转向锁定长度的末端时，第一个转动表面支撑第一个维持表面。 聚焦环相应地逃避了旋转停止仪器，以完成镜头在镜头架中的聚焦。

公开(公告)号：US20090014860A1

公开(公告)日：2009-01-15

申请号：US12011832

申请日：2008-01-29

申请人： Chung-Lun Liu ,  Jung-Pin Huang ,  Chin-Huang Chang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

发明人： Chung-Lun Liu ,  Jung-Pin Huang ,  Chin-Huang Chang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L25/0652 ,  H01L25/18 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/00012

摘要： A multi-chip stack structure and a manufacturing method thereof are provided. The fabrication method includes the steps of: providing a chip carrier having a first surface and a second surface opposing thereto and at least a first chip and a second chip mounted on the first surface; electrically connecting the chips to the chip carrier by a plurality of bonding wires; and stacking at least a third chip on the first and second chips by a film deposed therebetween, wherein the third chip is stepwise stacked on the first chip and at least a part of the bonding wire connected to the second chip is covered by the film, and electrically connecting the third chip and the chip carrier by a bonding wire, thereby enabling a plurality of chips to be stacked on the chip carrier to enhance the electrical performance of electronic products.

摘要翻译： 提供了一种多芯片堆叠结构及其制造方法。 该制造方法包括以下步骤：提供具有与其相对的第一表面和第二表面的芯片载体和至少安装在第一表面上的第一芯片和第二芯片; 通过多个接合线将芯片电连接到芯片载体上; 并且通过其间放置的膜将第一和第二芯片上的至少第三芯片堆叠起来，其中第三芯片逐步堆叠在第一芯片上，并且连接到第二芯片的键合线的至少一部分被膜覆盖， 并通过接合线电连接第三芯片和芯片载体，从而能够将多个芯片堆叠在芯片载体上，以增强电子产品的电气性能。