公开(公告)号：US20110132642A1

公开(公告)日：2011-06-09

申请号：US12959842

申请日：2010-12-03

申请人： Koji Shinoda ,  Hiroshi Nakagawa

发明人： Koji Shinoda ,  Hiroshi Nakagawa

IPC分类号： H05K1/00

CPC分类号： H05K1/118 ,  H05K1/028 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2203/0195 ,  H05K2203/1572 ,  H05K2203/166 ,  H05K2203/167

摘要： A plurality of protruding substrate portions (12) is extended from positions placed at an interval from each other along a peripheral edge of a wiring substrate (10). Each of the protruding substrate portions (12) is provided with wiring terminals (15), (16) electrically connected to each of a plurality of electrode terminals provided to an electrical instrument substrate. A cut-out part (18) is formed in a peripheral edge (13a) between the protruding substrate portions (12) in the wiring substrate (10).

摘要翻译： 多个突出的基板部分（12）沿着布线基板（10）的周缘彼此间隔开的位置延伸。 每个突出基板部分（12）设置有电连接到设置在电气仪器基板上的多个电极端子中的布线端子（15），（16）。 在配线基板（10）的突出基板部（12）之间的周缘部（13a）上形成切口部（18）。

公开(公告)号：US07912584B2

公开(公告)日：2011-03-22

申请号：US12762687

申请日：2010-04-19

申请人： Yoshiharu Nagatsuka ,  Hiroshi Nakagawa ,  Engaku Ryou

发明人： Yoshiharu Nagatsuka ,  Hiroshi Nakagawa ,  Engaku Ryou

IPC分类号： G06F19/00

CPC分类号： G06F17/5009 ,  B25J9/1671 ,  G05B2219/37428 ,  G05B2219/39407 ,  G05B2219/40341 ,  G05B2219/42304 ,  G06F17/5036 ,  G06F2217/78

摘要： A power consumption estimation apparatus comprising an execution part for executing an operation program of a robot, a velocity calculation part for each axis drive motor of the robot, a torque calculation part for each axis drive motor, a current value calculation part for calculating a current value of each axis drive motor; a mechanical work calculation part; a motor heat amount calculation part; and an amplifier heat amount calculation part for each axis drive motor, an output electric energy calculation part for the robot controller, a controller heat calculation part for the robot controller, and a power consumption calculation part for the robot system based on the mechanical work of each axis drive motor, the amount of heat of each axis drive motor, the amount of heat of the amplifier, and the amount of heat of the robot controller.

摘要翻译： 一种功率消耗估计装置，包括用于执行机器人的操作程序的执行部分，机器人的每个轴驱动电动机的速度计算部分，每个轴驱动电动机的转矩计算部分，用于计算电流的电流值计算部分 每轴驱动电机的值; 机械作业计算部分; 马达热量计算部; 以及用于各轴驱动电动机的放大器热量计算部，机器人控制器的输出电能计算部，机器人控制器的控制器热计算部，以及基于机器人的机械动作的机器人系统的功耗计算部 各轴驱动马达，各轴驱动马达的热量，放大器的热量和机器人控制器的热量。

公开(公告)号：US20110044120A1

公开(公告)日：2011-02-24

申请号：US12860058

申请日：2010-08-20

申请人： Hiroshi Nakagawa ,  Kanji Oishi

发明人： Hiroshi Nakagawa ,  Kanji Oishi

IPC分类号： G11C7/00

CPC分类号： G11C7/1048 ,  G11C7/1066 ,  G11C7/1078 ,  G11C7/1096 ,  G11C7/12 ,  G11C11/4094 ,  G11C11/4096

摘要： A semiconductor device includes a data transmission line and a data transmission line precharge circuit. The data transmission line precharge circuit sets a precharge potential of the data transmission line to a first potential at the time of a first write mode in which data masking is not performed. The data transmission line precharge circuit sets the precharge potential to a potential different from the first potential at the time of a second write mode in which data masking is performed. When data masking is not carried out, precharging to a potential at which data can be written in excellent fashion can be performed. When data masking is carried out, precharging to a potential that inhibits a fluctuation in bit-line potential can be performed.

摘要翻译： 半导体器件包括数据传输线和数据传输线预充电电路。 数据传输线预充电电路在没有执行数据屏蔽的第一写入模式时将数据传输线的预充电电位设置为第一电位。 数据传输线预充电电路在执行数据屏蔽的第二写入模式时将预充电电位设置为不同于第一电位的电位。 当不执行数据屏蔽时，可以执行预充电到可以以优良方式写入数据的电位。 当执行数据屏蔽时，可以执行预充电到抑制位线电位波动的电位。

公开(公告)号：US20100197201A1

公开(公告)日：2010-08-05

申请号：US12670292

申请日：2008-07-28

申请人： Yutaka Nomura ,  Masato Fukasawa ,  Hiroshi Nakagawa

发明人： Yutaka Nomura ,  Masato Fukasawa ,  Hiroshi Nakagawa

IPC分类号： B24B1/00 ,  C09K13/00 ,  C09K13/06

CPC分类号： H01L21/3212 ,  C09G1/02 ,  C09K3/1463

摘要： Disclosed is a metal-polishing liquid comprising: a metal-oxide-dissolving agent; a metal-oxidizing agent; a metal anticorrosive; a water-soluble polymer having a weight-average molecular weight of 8,000 or higher and having an anionic functional group and a nonionic functional group; and water, and having a pH within the range of 2.5 or higher but 5.0 or less. The metal-polishing liquid is effective in reducing the frictional force in polishing which generates during CMP. And is highly effective in flattening the surface of a work to be polished.

摘要翻译： 公开了一种金属抛光液，其包含：金属氧化物溶解剂; 金属氧化剂; 金属防腐; 重均分子量为8000以上且具有阴离子官能团和非离子官能团的水溶性聚合物; 和水，并且pH在2.5以上至5.0以下的范围内。 金属抛光液有效减少在CMP期间产生的抛光摩擦力。 并且对于要抛光的工件的表面变平，是非常有效的。

公开(公告)号：US20100001229A1

公开(公告)日：2010-01-07

申请号：US12547802

申请日：2009-08-26

申请人： Hiroshi Nakagawa ,  Toranosuke Ashizawa ,  Takenori Narita ,  Masaya Nishiyama

发明人： Hiroshi Nakagawa ,  Toranosuke Ashizawa ,  Takenori Narita ,  Masaya Nishiyama

IPC分类号： C09K13/00

CPC分类号： C09K3/1463 ,  C09G1/02 ,  H01L21/3212

摘要： The present invention provides a CMP slurry for silicon film, and by using such the slurry, polishing rates and polishing rate ratios of a silicon film, a silicon nitride film and a silicon oxide film required for performing CMP are obtained. In the CMP, a single slurry is used for forming a contact plug in self-alignment manner to decrease costs for producing semiconductor elements and improve yield. The slurry comprises abrasive grains, a cationic surfactant and water and has a pH value of 6.0 to 8.0.

摘要翻译： 本发明提供了一种用于硅膜的CMP浆料，并且通过使用这样的浆料，获得了执行CMP所需的硅膜，氮化硅膜和氧化硅膜的抛光速率和抛光速率比。 在CMP中，使用单个浆料以自对准方式形成接触塞，以降低制造半导体元件的成本并提高产量。 浆料包含磨粒，阳离子表面活性剂和水，pH值为6.0〜8.0。

公开(公告)号：US07538224B2

公开(公告)日：2009-05-26

申请号：US10561415

申请日：2004-06-10

申请人： Shinji Nara ,  Hiroshi Nakagawa ,  Yutaka Kanda ,  Takayuki Nakashima ,  Shiro Soga ,  Jiro Kajita ,  Jun-ichi Saito ,  Yukimasa Shiotsu ,  Shiro Akinaga

发明人： Shinji Nara ,  Hiroshi Nakagawa ,  Yutaka Kanda ,  Takayuki Nakashima ,  Shiro Soga ,  Jiro Kajita ,  Jun-ichi Saito ,  Yukimasa Shiotsu ,  Shiro Akinaga

IPC分类号： C07D211/22 ,  C07C49/303

CPC分类号： C07D211/42 ,  A61K31/12 ,  A61K31/165 ,  A61K31/216 ,  A61K31/40 ,  A61K31/4406 ,  A61K31/4409 ,  A61K31/445 ,  A61K31/451 ,  A61K31/495 ,  A61K31/506 ,  A61K31/5375 ,  A61K31/5377 ,  C07C49/84 ,  C07C69/738 ,  C07C205/45 ,  C07C235/78 ,  C07D207/08 ,  C07D207/12 ,  C07D207/27 ,  C07D211/22 ,  C07D211/52 ,  C07D211/54 ,  C07D211/58 ,  C07D211/60 ,  C07D211/62 ,  C07D213/40 ,  C07D213/50 ,  C07D217/06 ,  C07D239/42 ,  C07D241/08 ,  C07D295/088 ,  C07D295/185 ,  C07D307/46 ,  C07D307/52 ,  C07D307/54 ,  C07D317/60 ,  C07D333/22 ,  C07D333/24 ,  C07D409/10

摘要： The present invention provides Hsp90 family protein inhibitors comprising, as an active ingredient, a benzoyl compound represented by general formula (I): (wherein n represents an integer of 0 to 10; R1 represents substituted or unsubstituted lower alkoxy, substituted or unsubstituted lower alkoxycarbonyl, CONR7R8 or the like; R2 represents substituted or unsubstituted aryl, a substituted or unsubstituted aromatic heterocyclic group or the like; R3 and R5, which may be the same or different, each represent a hydrogen atom, substituted or unsubstituted lower alkyl, substituted or unsubstituted lower alkenyl or the like; and R4 and R6, which may be the same or different, each represent a hydrogen atom, halogen, substituted or unsubstituted lower alkyl, substituted or unsubstituted aryl or the like) or a prodrug thereof, or a pharmaceutically acceptable salt of said benzoyl compound or said prodrug.

摘要翻译： 本发明提供Hsp90家族蛋白质抑制剂，其包含作为活性成分的通式（I）表示的苯甲酰基化合物：（其中n表示0〜10的整数; R 1表示取代或未取代的低级烷氧基，取代或未取代的低级烷氧基羰基 ，CONR7R8等; R2表示取代或未取代的芳基，取代或未取代的芳族杂环基等; R3和R5可相同或不同，分别表示氢原子，取代或未取代的低级烷基，取代或未取代的 未取代的低级烯基等;以及可以相同或不同的R 4和R 6各自表示氢原子，卤素，取代或未取代的低级烷基，取代或未取代的芳基等）或其前药，或药学上 所述苯甲酰化合物或所述前药的可接受的盐。

公开(公告)号：US20090104766A1

公开(公告)日：2009-04-23

申请号：US12225741

申请日：2007-03-30

申请人： Yoshihiro Gomi ,  Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hirotaka Oosato

发明人： Yoshihiro Gomi ,  Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hirotaka Oosato

IPC分类号： H01L21/443

CPC分类号： C23C14/541 ,  B23K1/0016 ,  B23K3/0607 ,  C23C14/042 ,  C23C14/228 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079

摘要： The present invention provides a method of forming a micro metal bump, which is capable of stably and industrially forming a micro metal bump, by a gas deposition process, at a prescribed position of a metal part formed on one side surface of a substrate. The method comprises the steps of: forming a straight hole (34) in a mask layer (30) covering one side surface of a substrate (10) on which a wiring pattern (12) is formed, wherein a prescribed position of the wiring pattern (12) is exposed in a bottom surface of the straight hole and the straight hole has an inner wall perpendicular to the one side surface of the substrate (10) and a sharp top opening portion; providing a metal plate, whose area is larger than that of the substrate (10), on the other side surface of the substrate (10) as a heat sink; placing the substrate (10) and the metal plate in a vacuum; forming a tapered metal bump (14) on the exposed surface of the wiring pattern (12), which is exposed in the bottom surface of the straight hole (34), by a gas deposition process, in which metal nanoparticles obtained by evaporating a metal are ejected from a nozzle together with a carrier gas so as to deposit on the prescribed position, with cooling the substrate (10) to a temperature lower than upper temperature limit of resin constituting the mask layer (30), by the metal plate as the heat sink, so as to retain a configuration of the straight hole (34); and removing the mask layer (30) from the one side surface of the substrate so as to complete the tapered metal bump (14) at the prescribed position of the wiring pattern (12).

摘要翻译： 本发明提供一种通过气相沉积工艺在形成在基板的一个侧表面上的金属部件的规定位置上形成能够稳定地和工业上形成微小金属凸块的微型金属凸块的方法。 该方法包括以下步骤：在覆盖其上形成有布线图案（12）的基板（10）的一个侧表面的掩模层（30）中形成直孔（34），其中布线图案 （12）暴露在直孔的底面上，直孔具有与基板（10）的一个侧面垂直的内壁和尖锐的开口部; 在作为散热器的基板（10）的另一侧表面上设置面积比基板（10）的面积大的金属板; 将基板（10）和金属板放置在真空中; 在通过气相沉积工艺暴露在直孔（34）的底表面中的布线图案（12）的暴露表面上形成锥形金属凸块（14），其中通过蒸发金属 与载气一起从喷嘴喷射，以便沉积在规定位置，通过金属板作为基板（10）冷却至低于构成掩模层（30）的树脂的上限温度的温度 散热器，以保持直孔（34）的构造; 以及从所述基板的一个侧表面去除所述掩模层（30），以在所述布线图案（12）的规定位置处完成所述锥形金属凸块（14）。

公开(公告)号：US20090033636A1

公开(公告)日：2009-02-05

申请号：US12181558

申请日：2008-07-29

申请人： Naoki TOYOTA ,  Hiroshi Nakagawa

发明人： Naoki TOYOTA ,  Hiroshi Nakagawa

IPC分类号： G06F3/044

CPC分类号： G06F3/044 ,  H03K17/9622 ,  H03K2217/960755

摘要： In a touch panel input device of the invention, in response to an approaching finger, electrostatic capacitance between each of a plurality of sensor electrodes and the finger varies, and the input device includes a plurality of sensor electrodes disposed planarly in spaced relation, and a nonconductive member to be placed on the sensor electrodes. The nonconductive member includes a plurality of first blocks adapted to contact with at least associated central parts of the sensor electrodes, and a plurality of second blocks provided between the first blocks. The second blocks have a lower permittivity than that of the first blocks.

摘要翻译： 在本发明的触摸面板输入装置中，响应于接近的手指，多个传感器电极和手指中的每一个之间的静电电容变化，并且输入装置包括平面间隔设置的多个传感器电极， 不导电构件放置在传感器电极上。 非导电构件包括适于与传感器电极的至少相关联的中心部分接触的多个第一块和设置在第一块之间的多个第二块。 第二块具有比第一块更低的介电常数。

公开(公告)号：US07414422B2

公开(公告)日：2008-08-19

申请号：US11108861

申请日：2005-04-19

申请人： Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Kazuhiko Tokoro ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hiroyuki Fujita ,  Kenichi Kobayashi

发明人： Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Kazuhiko Tokoro ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hiroyuki Fujita ,  Kenichi Kobayashi

IPC分类号： G01R31/26

CPC分类号： G01R31/2822 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package through the printed wiring board; and analyzing means for analyzing a signal detected by the output signal detecting means, wherein by contacting the contact electrode of the contact probe with an electrode pad formed on the LSI chip, the evaluation signal is inputted to the LSI chip not through metallic wiring within the LSI package.

摘要翻译： 一种用于测量和评估通过其内部形成有包含金属布线的LSI封装的一侧上的I / O端子的电极焊盘的系统的封装中的高速/高频特性的系统级封装测试检查装置， 在LSI芯片和LSI封装之间的电连接和LSI芯片之间的电连接被实现的同时，多个LSI芯片被堆叠在多个层中，该系统的封装测试检查装置包括：印刷布线基板， 连接系统内置的I / O端子，实现高速和高频信号的传输; 用于驱动LSI芯片的LSI芯片驱动装置; 具有接触电极并用于发送高频信号的接触探针; 评估信号发生装置，用于向接触探针提供高频评估信号; 输出信号检测装置，用于检测通过印刷电路板的封装中的系统的输出信号; 以及分析装置，用于分析由输出信号检测装置检测到的信号，其中通过使接触探针的接触电极与形成在LSI芯片上的电极焊盘接触，评估信号不通过金属布线输入到LSI芯片 LSI封装。

公开(公告)号：US07382067B2

公开(公告)日：2008-06-03

申请号：US10497678

申请日：2002-11-26

申请人： Hiroshi Nakagawa ,  Kazumichi Kato ,  Toshio Miki ,  Minoru Maeda ,  Takashi Fukunaga ,  Kozo Furutani ,  Toshiya Sugimoto

发明人： Hiroshi Nakagawa ,  Kazumichi Kato ,  Toshio Miki ,  Minoru Maeda ,  Takashi Fukunaga ,  Kozo Furutani ,  Toshiya Sugimoto

IPC分类号： H02K33/16 ,  H02K33/00 ,  F04B17/04

CPC分类号： H01F7/1615 ,  H01F7/081 ,  H01F7/122 ,  H02K7/085 ,  H02K21/44 ,  H02K33/16 ,  H02K41/033

摘要： An object of the present invention is to provide a linear actuator in which reliability is improved, and performance is also easily improved. The present invention provides a linear actuator including a stator, a movable element having an iron member, and being reciprocatable with respect to the stator, a permanent magnet fixed to the stator so as to be opposed to the iron member, and a coil fixed to the stator. Because both the coil and the permanent magnet are fixed to the stator, electrical current does not have to be supplied to the movable element, and the feeder lines connected to the coil will not be broken due to the movement of the movable element. In addition, the weight of the movable element will not be increased even when the weigh of the permanent magnet is increased in order to obtain high magnetic flux density for improvement in performance. Moreover, because the movable element does not include a magnet, a magnetizing operation does not have to be applied to the movable element. The permanent magnets may be a pair in which the directions the magnetic poles thereof differ from each other, and two pairs of permanent magnets may be provided. The number of magnetic fluxes that run through the magnetic pole elements and the iron member can be increased by providing a magnetic reluctance section around the permanent magnets.

摘要翻译： 本发明的目的是提供一种可靠性提高的线性致动器，并且性能也容易提高。 本发明提供了一种线性致动器，其包括定子，具有铁构件的可移动元件，并且能够相对于定子往复运动;固定到定子上以与铁构件相对的永磁体，以及固定到 定子。 由于线圈和永磁体均固定在定子上，所以不必向可动元件供电，并且由于可移动元件的移动而连接到线圈的馈线不会被破坏。 此外，为了提高性能，为了获得高的磁通密度，即使永磁体的重量增加，可移动元件的重量也不会增加。 此外，由于可动元件不包括磁体，因此不必对可动元件施加磁化操作。 永磁体可以是彼此不同的磁极方向的一对，并且可以设置两对永磁体。 可以通过在永磁体周围设置磁阻部分来增加穿过磁极元件和铁构件的磁通量的数量。