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    System for electrochemical mechanical polishing
    91.
    发明申请
    System for electrochemical mechanical polishing 审中-公开
    电化学机械抛光系统

    公开(公告)号：US20050173260A1

    公开(公告)日：2005-08-11

    申请号：US11069202

    申请日：2005-02-28

    Applicant: Bulent Basol ,  Homayoun Talieh

    Inventor： Bulent Basol ,  Homayoun Talieh

    IPC: H01L21/321 ,  B23H5/00

    CPC classification number: H01L21/32115

    Abstract: A system for electrochemical mechanical polishing of a semiconductor wafer. The system includes a wafer carrier for holding the wafer, an electropolishing pad, and a showerhead for applying fluid towards the electrode. The electropolishing pad includes an electrode and a pad material layer attached to the electrode. The pad material layer includes openings to permit processing solution to wet both a conductive surface of the wafer and a surface of the electrode.

    Abstract translation: 一种用于半导体晶片的电化学机械抛光的系统。 该系统包括用于保持晶片的晶片载体，电抛光垫和用于向该电极施加流体的喷头。 电抛光垫包括附着在电极上的电极和焊盘材料层。 衬垫材料层包括允许处理溶液润湿晶片的导电表面和电极表面的开口。

    Vertically configured chamber used for multiple processes
    92.
    发明授权
    Vertically configured chamber used for multiple processes 有权
    垂直配置的腔室用于多个过程

    公开(公告)号：US06884334B2

    公开(公告)日：2005-04-26

    申请号：US10041058

    申请日：2001-12-28

    Applicant: Konstantin Volodarsky ,  Boguslaw A. Nigorski ,  Rimma Volodarsky ,  Douglas W. Young ,  Cyprian Uzoh ,  Homayoun Talieh

    Inventor： Konstantin Volodarsky ,  Boguslaw A. Nigorski ,  Rimma Volodarsky ,  Douglas W. Young ,  Cyprian Uzoh ,  Homayoun Talieh

    IPC: C25D7/12 ,  H01L21/00 ,  H01L21/02 ,  H01L21/3063 ,  C25D5/00

    CPC classification number: H01L21/6719 ,  C25D7/12 ,  C25D17/001 ,  H01L21/67028 ,  Y10S134/902

    Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

    Abstract translation: 本发明涉及一种用于进行多个处理步骤的容纳室，例如沉积，抛光，蚀刻，改性，漂洗，清洁和干燥工件上的表面。 在本发明的一个实例中，室用于在半导体晶片上化学机械地沉积导电材料。 然后可以使用相同的容纳室来冲洗和清洁相同的晶片。 结果，本发明消除了对用于沉积导电材料和清洁晶片的单独处理站的需要。 因此，利用本发明，降低了成本和物理空间，同时提供了使用容纳室在晶片表面上执行多个工艺的有效的装置和方法。

    Anode assembly for plating and planarizing a conductive layer
    93.
    发明申请
    Anode assembly for plating and planarizing a conductive layer 审中-公开
    用于电镀和平坦化导电层的阳极组件

    公开(公告)号：US20050040049A1

    公开(公告)日：2005-02-24

    申请号：US10914490

    申请日：2004-08-10

    Applicant: Rimma Volodarsky ,  Konstantin Volodarsky ,  Cyprian Uzoh ,  Homayoun Talieh ,  Douglas Young

    Inventor： Rimma Volodarsky ,  Konstantin Volodarsky ,  Cyprian Uzoh ,  Homayoun Talieh ,  Douglas Young

    IPC: B23H7/00 ,  C25D5/08 ,  C25D7/12 ,  C25D17/10 ,  H01L21/288 ,  H01L21/768

    CPC classification number: C25D17/001 ,  C25D5/08 ,  C25D17/008 ,  C25D17/10 ,  H01L21/2885 ,  H01L21/7684 ,  H01L21/76877

    Abstract: A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.

    Abstract translation: 可以使用特定的阳极组件来提供用于在半导体晶片上进行的电镀操作，平面化操作和电镀和平面化操作中的任何一种的解决方案。 阳极组件包括设置在其中执行操作的室内的可旋转轴，连接到轴的阳极壳体和附接到阳极壳体的多孔垫支撑板。 支撑板具有适于支撑面向晶片的焊盘的顶表面，并且与阳极壳体一起限定阳极腔。 可以在阳极腔中设置消耗性阳极以向溶液提供电镀材料。 还提供了可以将溶液输送到所述阳极腔的溶液输送结构。 溶液输送结构可以包含在进行操作的室内。 护罩还可以安装在轴和相关主轴之间，以防止溶液从腔室泄漏。

    Pad designs and structures for a versatile materials processing apparatus
    96.
    发明授权
    Pad designs and structures for a versatile materials processing apparatus 失效
    垫片设计和结构，用于多功能材料加工设备

    公开(公告)号：US06413388B1

    公开(公告)日：2002-07-02

    申请号：US09511278

    申请日：2000-02-23

    Applicant: Cyprian Uzoh ,  Bulent Basol ,  Homayoun Talieh

    Inventor： Cyprian Uzoh ,  Bulent Basol ,  Homayoun Talieh

    IPC: C25D1700

    CPC classification number: B24B37/26 ,  B23H5/08 ,  C25D17/001 ,  C25D17/14

    Abstract: An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface of a predetermined shape and a bottom surface. The rigid member contains a plurality of channels, each forming a passage from the top surface to the bottom surface, and each allowing the electrolyte and electric field flow therethrough. A pad is attached to the rigid member via a fastener. The pad also allows for electrolyte and electric field flow therethrough to the substrate.

    Abstract translation: 提供一种能够辅助控制用于处理基板的电解质流动和电场分布的装置。 它包括具有预定形状的顶表面和底表面的刚性构件。 刚性构件包括多个通道，每个通道形成从顶表面到底表面的通道，并且每个通道允许电解质和电场流过其中。 垫通过紧固件附接到刚性构件。 衬垫还允许电解质和电场流过衬底。

    Reverse linear polisher with loadable housing
    98.
    发明授权
    Reverse linear polisher with loadable housing 有权
    带可装载外壳的反向线性抛光机

    公开(公告)号：US6103628A

    公开(公告)日：2000-08-15

    申请号：US201928

    申请日：1998-12-01

    Applicant: Homayoun Talieh

    Inventor： Homayoun Talieh

    IPC: B24B21/04 ,  B24B37/04 ,  B24B47/04 ,  H01L21/304 ,  H01L21/00

    CPC classification number: B24B21/04 ,  B24B37/04 ,  B24B47/04

    Abstract: The present invention is directed to a method and apparatus for polishing a surface of a semiconductor wafer using a pad moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad as the pad moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having a novel wafer loading and unloading method.

    Abstract translation: 本发明涉及一种使用可沿正向和反向两者可移动的衬垫抛光半导体晶片的表面的方法和装置。 在VLSI和ULSI应用中，非常需要抛光晶片表面以完成平坦度。 抛光垫的正向和反向运动为晶片的表面提供了优异的平面性和均匀性。 当衬垫沿着正向和反向移动同时抛光晶片表面时，晶片表面被压靠在抛光垫上。 在抛光期间，晶片由具有新颖的晶片装载和卸载方法的晶片壳体支撑。

    Wafer polishing machine with fluid bearings and drive systems
    99.
    发明授权
    Wafer polishing machine with fluid bearings and drive systems 失效
    晶圆抛光机带流体轴承和驱动系统

    公开(公告)号：US5593344A

    公开(公告)日：1997-01-14

    申请号：US321085

    申请日：1994-10-11

    Applicant: David E. Weldon ,  Boguslaw A. Nagorski ,  Homayoun Talieh

    Inventor： David E. Weldon ,  Boguslaw A. Nagorski ,  Homayoun Talieh

    IPC: B24B21/00 ,  B24B21/06 ,  B24B37/12 ,  B24B37/20 ,  H01L21/304

    CPC classification number: B24B37/20 ,  B24B21/06 ,  B24B37/12

    Abstract: A semi-conductor wafer polishing machine having a polishing pad assembly and a wafer holder includes a support positioned adjacent the polishing pad assembly. This support has at least one fluid inlet connectable to a source of fluid at a higher pressure, at least one fluid outlet connectable to a fluid drain at a lower pressure, and at least one bearing surface over which fluid flows from the source to the drain. The polishing pad is supported by the fluid over the bearing surface for low-friction movement with respect to the support. Similar fluid bearings can be used in the wafer holder. An array of generally parallel grooves is provided on a belt support surface to reduce hydroplaning of a polishing belt. A turbine drive system rotates a wafer chuck in a wafer holder.

    Abstract translation: 具有抛光垫组件和晶片保持器的半导体晶片抛光机包括邻近抛光垫组件定位的支撑件。 该支撑件具有至少一个可在较高压力下连接到流体源的流体入口，至少一个可在较低压力下连接到流体排放口的流体出口以及至少一个支承表面，流体从该流体从源流向排水管 。 抛光垫由轴承表面上的流体支撑，用于相对于支撑件的低摩擦运动。 类似的流体轴承可用于晶片保持器。 大致平行的凹槽的阵列设置在带支撑表面上以减少抛光带的滑动。 涡轮驱动系统将晶片卡盘旋转在晶片保持器中。

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