公开(公告)号：US20070004316A1

公开(公告)日：2007-01-04

申请号：US11452609

申请日：2006-06-13

申请人： Jalal Ashjaee ,  Boris Govzman ,  Bernard Frey ,  Boguslaw Nagorski ,  Douglas Young ,  Bulent Basol ,  Homayoun Talieh

发明人： Jalal Ashjaee ,  Boris Govzman ,  Bernard Frey ,  Boguslaw Nagorski ,  Douglas Young ,  Bulent Basol ,  Homayoun Talieh

IPC分类号： B24B51/00 ,  B24B7/00

CPC分类号： H01L21/67745 ,  B24B37/345 ,  G05B19/41865 ,  G05B2219/32272 ,  G05B2219/45031 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67219 ,  H01L21/68707 ,  H01L21/68728 ,  Y02P90/20

摘要： An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.

摘要翻译： 提供了用于化学机械加工，清洁和干燥半导体工件的集成工艺工具。 集成工艺工具包括CMP模块和清洁和干燥模块。 在处理之后，使用可动壳体将工件从CMP模块传送到清洁和干燥模块。 在清洁和干燥模块中，使用清洁机构来清洁工件，同时工件被可移动壳体的支撑结构旋转并保持。 清洁和干燥模块的干燥机构从可移动的壳体上拾取工件并使其干燥。 在整个CMP过程中，清洁和干燥，晶片的经处理表面面朝下。

公开(公告)号：US20050133379A1

公开(公告)日：2005-06-23

申请号：US10822424

申请日：2004-04-12

申请人： Bulent Basol ,  Jalal Ashjaee ,  Boris Govzman ,  Homayoun Talieh ,  Bernard Frey

发明人： Bulent Basol ,  Jalal Ashjaee ,  Boris Govzman ,  Homayoun Talieh ,  Bernard Frey

IPC分类号： B24B37/04 ,  C25D5/02 ,  C25D5/06 ,  C25D5/22 ,  C25D7/12 ,  C25F7/00 ,  H01L21/00 ,  H01L21/288 ,  H01L21/321 ,  B23H9/00

CPC分类号： B24B37/046 ,  B24B37/20 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/32115 ,  H01L21/32125 ,  H01L21/67075 ,  H01L21/6715

摘要： An apparatus for electropolishing a conductive layer on a wafer using a solution is disclosed. The apparatus comprises an electrode assembly immersed in the solution configured proximate to the conductive layer having a longitudinal dimension extending to at least a periphery of the wafer, the electrode assembly including an elongated contact electrode configured to receive a potential difference, an isolator adjacent the elongated contact electrode, and an elongated process electrode adjacent the isolator configured to receive the potential difference, a voltage supply is configured to supply the potential difference between the contact electrode and the process electrode to electropolish the conductive layer on the wafer.

摘要翻译： 公开了一种使用溶液对晶片上的导电层进行电解抛光的装置。 该装置包括浸入在靠近导电层配置的溶液中的电极组件，其具有延伸至晶片的至少周边的纵向尺寸，电极组件包括构造成接收电位差的细长接触电极，邻近细长的隔离器 接触电极和邻近隔离器的细长工艺电极，其被配置为接收电位差，电压源被配置为提供接触电极和处理电极之间的电位差以对晶片上的导电层进行电解抛光。

公开(公告)号：US07427337B2

公开(公告)日：2008-09-23

申请号：US10822424

申请日：2004-04-12

申请人： Bulent M. Basol ,  Jalal Ashjaee ,  Boris Govzman ,  Homayoun Talieh ,  Bernard M. Frey

发明人： Bulent M. Basol ,  Jalal Ashjaee ,  Boris Govzman ,  Homayoun Talieh ,  Bernard M. Frey

IPC分类号： B23H3/00 ,  B23H3/02

CPC分类号： B24B37/046 ,  B24B37/20 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/32115 ,  H01L21/32125 ,  H01L21/67075 ,  H01L21/6715

摘要： An apparatus for electropolishing a conductive layer on a wafer using a solution is disclosed. The apparatus comprises an electrode assembly immersed in the solution configured proximate to the conductive layer having a longitudinal dimension extending to at least a periphery of the wafer, the electrode assembly including an elongated contact electrode configured to receive a potential difference, an isolator adjacent the elongated contact electrode, and an elongated process electrode adjacent the isolator configured to receive the potential difference, a voltage supply is configured to supply the potential difference between the contact electrode and the process electrode to electropolish the conductive layer on the wafer.

摘要翻译： 公开了一种使用溶液对晶片上的导电层进行电解抛光的装置。 该装置包括浸入在靠近导电层配置的溶液中的电极组件，其具有延伸至晶片的至少周边的纵向尺寸，电极组件包括构造成接收电位差的细长接触电极，邻近细长的隔离器 接触电极和邻近隔离器的细长工艺电极，其被配置为接收电位差，电压源被配置为提供接触电极和处理电极之间的电位差以对晶片上的导电层进行电解抛光。

公开(公告)号：US07059944B2

公开(公告)日：2006-06-13

申请号：US10369118

申请日：2003-02-18

申请人： Jalal Ashjaee ,  Boris Govzman ,  Bernard M. Frey ,  Boguslaw A. Nagorski ,  Douglas W. Young ,  Bulent M. Basol ,  Homayoun Talieh

发明人： Jalal Ashjaee ,  Boris Govzman ,  Bernard M. Frey ,  Boguslaw A. Nagorski ,  Douglas W. Young ,  Bulent M. Basol ,  Homayoun Talieh

IPC分类号： B24B1/00

CPC分类号： H01L21/67745 ,  B24B37/345 ,  G05B19/41865 ,  G05B2219/32272 ,  G05B2219/45031 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67219 ,  H01L21/68707 ,  H01L21/68728 ,  Y02P90/20

摘要： An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.

公开(公告)号：US06227585B1

公开(公告)日：2001-05-08

申请号：US09206087

申请日：1998-12-04

申请人： Boris Govzman ,  Konstantin Volodarsky ,  Leon Volfovski

发明人： Boris Govzman ,  Konstantin Volodarsky ,  Leon Volfovski

IPC分类号： B25J1506

摘要： Substrate handling apparatus and methods are described. In one aspect, the substrate handling apparatus includes a clamping member having an extended condition wherein substrate movement relative to the transfer arm is substantially restricted and a retracted condition wherein substrate movement relative to the transfer arm is substantially free. The substrate handling apparatus further includes a sense mechanism (e.g., a vacuum sensor) constructed to determine whether a substrate is properly positioned on the support arm and to trigger the mode of operation of the clamping member between extended and retracted conditions. The sense mechanism also provides information relating to the operating condition of the clamping member.

公开(公告)号：US5957751A

公开(公告)日：1999-09-28

申请号：US862350

申请日：1997-05-23

申请人： Boris Govzman ,  Steven M. Zuniga ,  Hung Chen ,  Sasson Somekh

发明人： Boris Govzman ,  Steven M. Zuniga ,  Hung Chen ,  Sasson Somekh

IPC分类号： B24B37/005 ,  B24B37/30 ,  H01L21/304 ,  B24B49/00

CPC分类号： B24B37/30 ,  B24B37/0053

摘要： A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

公开(公告)号：US20050241684A1

公开(公告)日：2005-11-03

申请号：US11179926

申请日：2005-07-12

申请人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： H01L21/304 ,  H01L21/00 ,  B08B3/00

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

公开(公告)号：US07513062B2

公开(公告)日：2009-04-07

申请号：US11054336

申请日：2005-02-09

申请人： Younes Achkire ,  Alexander N Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael N Sugarman ,  Rashid A Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy E Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander N Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael N Sugarman ,  Rashid A Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy E Shirazi ,  Jianshe Tang

IPC分类号： F26B3/00 ,  B08B3/00

CPC分类号： H01L21/02052 ,  H01L21/67034

摘要： In a first aspect, a first method of drying a substrate is provided. The first method includes the steps of (1) lifting a substrate through an air/fluid interface at a first rate; (2) directing a drying vapor at the air/fluid interface during lifting of the substrate; and (3) while a portion of the substrate remains in the air/fluid interface, reducing a rate at which a remainder of the substrate is lifted through the air/fluid interface to a second rate. The drying vapor may form an angle of about 23° with the air/fluid interface and/or the second rate may be about 2.5 mm/sec.

摘要翻译： 在第一方面中，提供了干燥基板的第一种方法。 第一种方法包括以下步骤：（1）以第一速率提升衬底通过空气/流体界面; （2）在提升衬底期间在空气/流体界面处引导干燥蒸汽; 和（3）当衬底的一部分保留在空气/流体界面中时，降低衬底的剩余部分通过空气/流体界面提升到第二速率的速率。 干燥蒸气可以与空气/流体界面形成约23°的角度和/或第二速率可以为约2.5mm / sec。

公开(公告)号：US06244932B1

公开(公告)日：2001-06-12

申请号：US09369663

申请日：1999-08-05

申请人： Boris Govzman ,  Steven M. Zuniga ,  Hung Chen

发明人： Boris Govzman ,  Steven M. Zuniga ,  Hung Chen

IPC分类号： B24B4900

CPC分类号： B24B37/30 ,  B24B37/0053

摘要： A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

摘要翻译： 用于化学机械抛光系统的载体头包括基底感测机构。 承载头包括基部和连接到基部以限定室的柔性构件。 柔性构件的下表面提供衬底接收表面。 衬底检测机构包括用于测量腔室中的压力并产生代表其的输出信号的传感器，以及被配置为响应于输出信号指示衬底是否附着到衬底接收表面的处理器。

公开(公告)号：US20070295371A1

公开(公告)日：2007-12-27

申请号：US11846400

申请日：2007-08-28

申请人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： B08B1/00

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

摘要翻译： 在第一方面，提供一种适于处理晶片的模块。 模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与 卸货港 （2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。