MULTILAYER CERAMIC CAPACITOR
    91.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 有权
    多层陶瓷电容器

    公开(公告)号:US20150124370A1

    公开(公告)日:2015-05-07

    申请号:US14209420

    申请日:2014-03-13

    CPC classification number: H01G4/224 H01G4/12 H01G4/228 H01G4/232 H01G4/30

    Abstract: A multilayer ceramic capacitor may include a ceramic body having a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body to be alternately exposed to the first and second end surfaces of the ceramic body, having the dielectric layers interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively. The first and second external electrodes may include: first and second internal conductive layers; first and second insulating layers; and first and second external conductive layers.

    Abstract translation: 多层陶瓷电容器可以包括具有多个电介质层的陶瓷体; 设置在陶瓷体中的第一和第二内部电极交替地暴露于陶瓷体的第一和第二端面,其间插入介电层; 以及分别与第一和第二内部电极电连接的第一和第二外部电极。 第一和第二外部电极可以包括:第一和第二内部导电层; 第一和第二绝缘层; 以及第一和第二外部导电层。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING THE SAME
    92.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING THE SAME 审中-公开
    埋在板上的多层陶瓷电子元件及其印刷电路板

    公开(公告)号:US20150075853A1

    公开(公告)日:2015-03-19

    申请号:US14135308

    申请日:2013-12-19

    Abstract: There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes, having the dielectric layer therebetween, to thereby form capacitance; upper and lower cover layers formed in upper and lower portions of the active layer; and first and second external electrodes formed in both ends of the ceramic body, wherein the first external electrode includes a first base electrode and a first terminal electrode formed on the first base electrode, the second external electrode includes a second base electrode and a second terminal electrode formed on the second base electrode, and in the case that a thickness of the upper cover layer is tc1 and a thickness of the lower cover layer is tc2, 0.10≦tc1/tc2≦1.00 is satisfied.

    Abstract translation: 提供了一种嵌入板中的多层陶瓷电子部件,包括:包括电介质层的陶瓷体; 包括多个第一和第二内部电极的有源层,其间具有介电层,从而形成电容; 形成在有源层的上部和下部的上和下覆盖层; 以及形成在陶瓷体的两端的第一外部电极和第二外部电极,其中,所述第一外部电极包括形成在所述第一基底电极上的第一基极和第一端子电极,所述第二外部电极包括第二基极和第二端 形成在第二基极上的电极,并且在上覆盖层的厚度为tc1且下覆盖层的厚度为tc2,0.10≦̸ tc1 / tc2≦̸ 1.00的情况下,形成电极。

    MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN
    93.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN 有权
    多层陶瓷电子部件嵌入板和印刷电路板上嵌有多层陶瓷电子部件

    公开(公告)号:US20150060121A1

    公开(公告)日:2015-03-05

    申请号:US14137600

    申请日:2013-12-20

    Abstract: There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers; first and second internal electrodes having first and second leads; and first and second external electrodes, wherein when lengths from edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to points at which the first or second external electrode contacts the first and second leads are G1, lengths from the edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to a corresponding end surface of the ceramic body are BW1, and lengths from the corresponding end surface of the ceramic body to points at which the first or second external electrode contacts the first and second leads are M1, 30 μm≦G1

    Abstract translation: 提供了一种要嵌入板的多层陶瓷电子部件,包括:包括电介质层的陶瓷体; 第一和第二内部电极具有第一和第二引线; 以及第一外部电极和第二外部电极,其中当从陶瓷体的第一和第二侧表面上形成的第一或第二外部电极的边缘到第一或第二外部电极接触第一和第二引线的点的长度为G1时,长度 从形成在陶瓷体的第一和第二侧表面上的第一或第二外部电极的边缘到陶瓷体的相应端面的边缘为BW1,并且从陶瓷体的相应端面到第一 或第二外部电极接触第一和第二引线为M1,30μm和n1E; G1

    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN
    96.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN 有权
    多层陶瓷电子元件嵌入板和印刷电路板上嵌有多层陶瓷电子元件

    公开(公告)号:US20150041199A1

    公开(公告)日:2015-02-12

    申请号:US14213185

    申请日:2014-03-14

    Abstract: A multilayer ceramic electronic component to be embedded in a board includes: a ceramic body including dielectric layers; first and second internal electrodes formed in the ceramic body; and first-polarity external electrodes connected to the first internal electrodes, and second-polarity external electrodes connected to the second internal electrodes, wherein the number of the first-polarity external electrodes and the number of the second-polarity external electrodes may be two or more, the first-polarity and second-polarity external electrodes may include first-polarity and second-polarity base electrodes and first-polarity and second-polarity terminal electrodes formed on the first-polarity and second-polarity base electrodes, respectively, when L denotes a length of the ceramic body and W denotes a width thereof, W/L≧0.6 may be satisfied, and a width BW of each of the first-polarity and second-polarity external electrodes formed on the first and second main surfaces of the ceramic body may satisfy 150 μm≦BW≦350 μm.

    Abstract translation: 嵌入板中的多层陶瓷电子部件包括:包含电介质层的陶瓷体; 在陶瓷体中形成的第一和第二内部电极; 连接到第一内部电极的第一极性外部电极和连接到第二内部电极的第二极性外部电极,其中第一极性外部电极的数量和第二极性外部电极的数量可以是两个或 此外,第一极性和第二极性外部电极可以包括分别在第一极性和第二极性基极上形成的第一极性和第二极性基极以及形成在第一极性和第二极性基极上的第一极性和第二极性端子电极,当L 表示陶瓷体的长度,W表示其宽度,W /L≥0.6,并且形成在第一和第二主表面上的第一极性和第二极性外部电极的宽度BW 陶瓷体可以满足150μm≦̸ BW≦̸350μm。

    MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN
    97.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN 有权
    多层陶瓷电子部件嵌入板和印刷电路板上嵌有多层陶瓷电子部件

    公开(公告)号:US20150041198A1

    公开(公告)日:2015-02-12

    申请号:US14174591

    申请日:2014-02-06

    Abstract: There is provided a multilayer ceramic electronic part to be embedded in a board, the multilayer ceramic electronic part including: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body; first and second external electrodes formed on the respective end portions of the ceramic body, and a third external electrode formed on first and second main surfaces of the ceramic body, wherein an outermost first internal electrode among the first internal electrodes is connected to the first and second external electrodes through at least one first via, and the second internal electrodes are connected to the third external electrode through at least one second via.

    Abstract translation: 提供了一种要嵌入板中的多层陶瓷电子部件,所述多层陶瓷电子部件包括:陶瓷体,包括电介质层; 布置在陶瓷体中的第一和第二内部电极; 形成在陶瓷体的各个端部的第一外部电极和第二外部电极,以及形成在陶瓷体的第一和第二主表面上的第三外部电极,其中,第一内部电极中的最外部第一内部电极连接到第一内部电极, 通过至少一个第一通孔的第二外部电极,并且所述第二内部电极通过至少一个第二通孔连接到所述第三外部电极。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN
    98.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN 审中-公开
    多层陶瓷电子元件嵌入板和印刷电路板上嵌有多层陶瓷电子元件

    公开(公告)号:US20150021079A1

    公开(公告)日:2015-01-22

    申请号:US14083189

    申请日:2013-11-18

    Abstract: There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body with the dielectric layers interposed therebetween, to form capacitance therein, upper and lower cover layers formed on upper and lower portions of the active layer, and first and second external electrodes formed on both end surfaces of the ceramic body, wherein when a thickness of the upper or lower cover layer is defined as tc, 4 μm≦tc≦20 μm may be satisfied.

    Abstract translation: 本发明提供一种嵌入电路板的多层陶瓷电子元件,其包括:包含电介质层的陶瓷体,具有彼此相对的第一和第二主表面,彼此相对的第一和第二侧表面以及面向每个的第一和第二端面 另一方面,包括多个第一和第二内部电极的有源层,所述多个第一和第二内部电极通过陶瓷体的两个端面交替地暴露在介电层之间以形成电容,其中形成在活性物质的上部和下部的上部和下部覆盖层 层,以及形成在陶瓷体的两个端面的第一外部电极和第二外部电极,其中当上部或下部覆盖层的厚度被定义为tc时,可以满足4μm< nlE; tc≦̸20μm。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN
    99.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN 有权
    多层陶瓷电子元件嵌入板和印刷电路板上嵌有多层陶瓷电子元件

    公开(公告)号:US20150021078A1

    公开(公告)日:2015-01-22

    申请号:US14083065

    申请日:2013-11-18

    CPC classification number: H01G2/06 H01G4/005 H01G4/01 H01G4/012 H01G4/232 H01G4/30

    Abstract: There is provided a multilayer ceramic electronic component, including a ceramic body having first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes having first and second lead portions; and first and second external electrodes extended from the first and second end surfaces of the ceramic body to the first and second side surfaces, respectively, wherein when a distance from an end portion of the first or second external electrode formed on the first or second side surface of the ceramic body to a point of the first or second external electrode connected to the first or second lead portion is defined as G, and a width of the first or second external electrode on the first or second side surface of the ceramic body is defined as BW, 30 μm≦G

    Abstract translation: 提供了一种多层陶瓷电子部件,包括具有彼此面对的第一和第二侧表面的陶瓷体以及彼此面对的第一和第二端面; 第一和第二内部电极具有第一和第二引线部分; 以及分别从陶瓷体的第一和第二端面延伸到第一和第二侧表面的第一和第二外部电极,其中当形成在第一或第二侧面上的第一或第二外部电极的端部的距离 陶瓷体的表面连接到第一或第二引线部分的第一或第二外部电极的点被定义为G,并且陶瓷体的第一或第二侧表面上的第一或第二外部电极的宽度为 定义为BW,30μm≦̸满足G

    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD
    100.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD 审中-公开
    多层陶瓷电子元件嵌入板上

    公开(公告)号:US20150016019A1

    公开(公告)日:2015-01-15

    申请号:US14331019

    申请日:2014-07-14

    CPC classification number: H01G4/30 H01G4/2325

    Abstract: A multilayer ceramic electronic component to be embedded in a board may include: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, respectively, with at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on the end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. Each of the first and second external electrodes includes a first external electrode layer containing a glass component and disposed on the end surface of the ceramic body and a second external electrode layer being glass-free and covering the first external electrode layer.

    Abstract translation: 要嵌入板中的多层陶瓷电子部件可以包括:多个电介质层堆叠的陶瓷体; 多个第一和第二内部电极分别通过陶瓷体的两个端面交替地暴露,其中介电层中的至少一个介于其间; 以及第一外部电极和第二外部电极,其分别设置在陶瓷体的端面上并电连接到第一和第二内部电极。 第一和第二外部电极中的每一个包括含有玻璃成分并设置在陶瓷体的端面上的第一外部电极层和不含玻璃的第二外部电极层,并覆盖第一外部电极层。

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