公开(公告)号：US20170330947A1

公开(公告)日：2017-11-16

申请号：US15667633

申请日：2017-08-03

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Shih-Yin Hsiao ,  Ching-Chung Yang ,  Wen-Fang Lee ,  Nien-Chung Li ,  Chih-Chung Wang

IPC: H01L29/423 ,  H01L29/78 ,  H01L29/06 ,  H01L23/535 ,  G06F17/50

CPC classification number: H01L29/4238 ,  G06F17/5072 ,  H01L23/535 ,  H01L29/0638 ,  H01L29/0649 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/4983 ,  H01L29/66795 ,  H01L29/7816 ,  H01L29/7834 ,  H01L29/7835 ,  H01L29/7836 ,  H01L29/785

Abstract: A metal-oxide semiconductor transistor includes a substrate, a gate insulating layer disposed on a surface of the substrate, and a metal gate disposed on the gate insulating layer, wherein at least one of the length or the width of the metal gate is greater than or equal to approximately 320 nanometers, and the metal gate has at least one plug hole. The metal-oxide semiconductor transistor further includes at least one insulating plug disposed in the plug hole and two diffusion regions disposed respectively at two sides of the metal gate in the substrate.

公开(公告)号：US20170243950A1

公开(公告)日：2017-08-24

申请号：US15047644

申请日：2016-02-19

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kuan-Liang Liu ,  Shih-Yin Hsiao ,  Ching-Chung Yang

IPC: H01L29/66 ,  H01L21/223

CPC classification number: H01L29/66598 ,  H01L21/26513 ,  H01L29/7833

Abstract: A method of fabricating a transistor with reduced hot carrier injection effects includes providing a substrate covered by a gate material layer. Later, the gate material layer is patterned into a gate electrode. Then, a mask layer is formed to cover part of the gate electrode and expose two ends of the gate electrode. Finally, a first implantation process is performed to implant dopants through the exposed two ends of the gate electrode into the substrate directly under the gate electrode to form two LDD regions by taking the mask layer as a mask.

公开(公告)号：US20170236899A1

公开(公告)日：2017-08-17

申请号：US15587378

申请日：2017-05-04

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Shih-Yin Hsiao ,  Su-Hwa Tsai

IPC: H01L29/06 ,  H01L29/78 ,  H01L29/10 ,  H01L21/308 ,  H01L21/8234 ,  H01L29/66 ,  H01L21/3065 ,  H01L27/088 ,  H01L29/40

CPC classification number: H01L29/0661 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/8234 ,  H01L21/823418 ,  H01L27/088 ,  H01L29/0653 ,  H01L29/1045 ,  H01L29/1095 ,  H01L29/408 ,  H01L29/66613 ,  H01L29/66659 ,  H01L29/66681 ,  H01L29/66704 ,  H01L29/7816 ,  H01L29/7835

Abstract: A high voltage device includes a substrate, a first LDMOS transistor and a second LDMOS transistor disposed on the substrate. The first LDMOS transistor includes a first gate electrode disposed on the substrate. A first STI is embedded in the substrate and disposed at an edge of the first gate electrode and two first doping regions respectively disposed at one side of the first STI and one side of the first gate electrode. The second LDMOS transistor includes a second gate electrode disposed on the substrate. A second STI is embedded in the substrate and disposed at an edge of the second gate electrode. Two second doping regions are respectively disposed at one side of the second STI and one side of the second gate electrode, wherein the second STI is deeper than the first STI.

公开(公告)号：US09716139B2

公开(公告)日：2017-07-25

申请号：US14727875

申请日：2015-06-02

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kuan-Chuan Chen ,  Chih-Chung Wang ,  Wen-Fang Lee ,  Nien-Chung Li ,  Shih-Yin Hsiao

IPC: H01L29/06 ,  H01L29/66 ,  H01L29/423 ,  H01L21/8234 ,  H01L27/088

CPC classification number: H01L29/0653 ,  H01L21/28238 ,  H01L21/823418 ,  H01L21/823462 ,  H01L27/088 ,  H01L29/4236 ,  H01L29/42364 ,  H01L29/66545 ,  H01L29/66568 ,  H01L29/66613

Abstract: A method for forming a high voltage transistor is provided. First, a substrate having a top surface is provided, following by forming a thermal oxide layer on the substrate. At least a part of the thermal oxidation layer is removed to form a recess in the substrate, wherein a bottom surface of the recess is lower than the top surface of the substrate. A gate oxide layer is formed in the recess, then a gate structure is formed on the gate oxide layer. The method further includes forming a source/drain region in the substrate.

公开(公告)号：US20170186652A1

公开(公告)日：2017-06-29

申请号：US14980779

申请日：2015-12-28

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Shih-Yin Hsiao ,  Kuan-Liang Liu

IPC: H01L21/8234 ,  H01L29/49 ,  H01L27/088 ,  H01L21/3105 ,  H01L21/02 ,  H01L29/40 ,  H01L21/311

CPC classification number: H01L21/823481 ,  H01L21/0217 ,  H01L21/31053 ,  H01L21/31105 ,  H01L21/823437 ,  H01L27/088 ,  H01L29/401 ,  H01L29/4966

Abstract: A method for manufacturing a semiconductor device and a device manufactured using the same are provided. According to a method approach of the embodiment, a substrate having at least a first area with a plurality of polysilicon gates and a second area adjacent to the first area is provided. A contact etch stop layer (CESL) over the polysilicon gates of the first area is formed, and the CESL extends to the second area. Then, a dielectric layer is formed on the CESL, and a nitride layer is formed on the dielectric layer. The nitride layer is patterned to expose the dielectric layer in the first area and to form a pattern of dummy nitrides on the dielectric layer in the second area.

公开(公告)号：US09647060B2

公开(公告)日：2017-05-09

申请号：US14859348

申请日：2015-09-20

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Shih-Yin Hsiao ,  Kuan-Liang Liu

IPC: H01L29/06 ,  H01L21/762

CPC classification number: H01L29/0653 ,  H01L21/76224 ,  H01L29/7836

Abstract: A method for fabricating isolation device is disclosed. The method includes the steps of: providing a substrate; forming a shallow trench isolation (STI) in the substrate, the STI includes a first STI and a second STI, and the first STI surrounds a first device region and the second STI surrounds a second device region; forming a first doped region between and contact the first STI and the second STI; and forming a first gate structure on the first doped region, the first STI and the second STI.

公开(公告)号：US20170098696A1

公开(公告)日：2017-04-06

申请号：US14937514

申请日：2015-11-10

Applicant: United Microelectronics Corp.

Inventor： Kun-Huang Yu ,  Shih-Yin Hsiao

IPC: H01L29/423 ,  H01L29/06 ,  H01L29/788 ,  H01L21/28 ,  H01L27/115 ,  H01L29/66

CPC classification number: H01L29/42328 ,  H01L27/11521 ,  H01L28/00 ,  H01L29/40114 ,  H01L29/4966 ,  H01L29/66545 ,  H01L29/66825 ,  H01L29/788

Abstract: Provided is a semiconductor structure including a substrate, a first gate, a second gate, a third gate and an inter-gate dielectric layer. The substrate has a first area and a second area, and the first surface of the first area is lower than the second surface of the second area. The first gate is disposed on the first surface of the first area. The second gate includes metal and is disposed on the first gate. The inter-gate dielectric layer is disposed between the first and second gates. The third gate includes metal and is disposed on the second surface of the second area. A method of foaming a semiconductor structure is further provided.

公开(公告)号：US09484422B2

公开(公告)日：2016-11-01

申请号：US14882462

申请日：2015-10-14

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kun-Huang Yu ,  Shih-Yin Hsiao ,  Wen-Fang Lee ,  Shu-Wen Lin ,  Kuan-Chuan Chen

IPC: H01L29/76 ,  H01L29/423 ,  H01L29/78 ,  H01L29/66 ,  H01L29/40 ,  H01L29/08 ,  H01L21/266 ,  H01L21/28 ,  H01L21/265

CPC classification number: H01L29/42368 ,  H01L21/26506 ,  H01L21/266 ,  H01L21/28026 ,  H01L21/28158 ,  H01L21/2822 ,  H01L29/086 ,  H01L29/0878 ,  H01L29/401 ,  H01L29/6659 ,  H01L29/7816 ,  H01L29/7833 ,  H01L29/7834

Abstract: The present invention provides a high-voltage metal-oxide-semiconductor (HVMOS) transistor comprising a substrate, a gate dielectric layer, a gate electrode and a source and drain region. The gate dielectric layer is disposed on the substrate and includes a protruded portion and a recessed portion, wherein the protruded portion is disposed adjacent to two sides of the recessed portion and has a thickness greater than a thickness of the recessed portion. The gate electrode is disposed on the gate dielectric layer. Thus, the protruded portion of the gate dielectric layer can maintain a higher breakdown voltage, thereby keeping the current from leaking through the gate.

Abstract translation: 本发明提供一种高压金属氧化物半导体（HVMOS）晶体管，其包括衬底，栅极电介质层，栅极电极和源极和漏极区域。 栅介质层设置在基板上，并且包括突出部分和凹陷部分，其中突出部分邻近凹部的两侧设置，并且具有大于凹部的厚度的厚度。 栅电极设置在栅介质层上。 因此，栅极电介质层的突出部分可以保持更高的击穿电压，从而保持电流不通过栅极泄漏。

公开(公告)号：US20160111509A1

公开(公告)日：2016-04-21

申请号：US14519153

申请日：2014-10-21

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kun-Huang Yu ,  Shih-Yin Hsiao

IPC: H01L29/423 ,  H01L29/78 ,  H01L29/06 ,  H01L29/66

CPC classification number: H01L29/66545 ,  H01L21/76895 ,  H01L29/0653 ,  H01L29/1045 ,  H01L29/401 ,  H01L29/402 ,  H01L29/4238 ,  H01L29/66568 ,  H01L29/66659 ,  H01L29/66681 ,  H01L29/7816 ,  H01L29/7833 ,  H01L29/7835

Abstract: A MOS transistor device includes a substrate including a gate formed thereon, and a spacer being formed on a sidewall of the gate; a source region and a drain region formed in the substrate; and at least a first dummy contact formed above the substrate on a drain side of the gate. More important, the first dummy contact is formed apart from a surface of the substrate.

Abstract translation: MOS晶体管器件包括其上形成有栅极的衬底和形成在栅极的侧壁上的间隔物; 形成在所述基板中的源极区域和漏极区域; 以及形成在栅极的漏极侧的衬底上方的至少第一虚拟接触。 更重要的是，第一虚拟接触件与衬底的表面分开形成。

公开(公告)号：US20160043193A1

公开(公告)日：2016-02-11

申请号：US14882462

申请日：2015-10-14

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kun-Huang Yu ,  Shih-Yin Hsiao ,  Wen-Fang Lee ,  Shu-Wen Lin ,  Kuan-Chuan Chen

IPC: H01L29/423 ,  H01L29/08 ,  H01L29/78

CPC classification number: H01L29/42368 ,  H01L21/26506 ,  H01L21/266 ,  H01L21/28026 ,  H01L21/28158 ,  H01L21/2822 ,  H01L29/086 ,  H01L29/0878 ,  H01L29/401 ,  H01L29/6659 ,  H01L29/7816 ,  H01L29/7833 ,  H01L29/7834

Abstract: The present invention provides a high-voltage metal-oxide-semiconductor (HVMOS) transistor comprising a substrate, a gate dielectric layer, a gate electrode and a source and drain region. The gate dielectric layer is disposed on the substrate and includes a protruded portion and a recessed portion, wherein the protruded portion is disposed adjacent to two sides of the recessed portion and has a thickness greater than a thickness of the recessed portion. The gate electrode is disposed on the gate dielectric layer. Thus, the protruded portion of the gate dielectric layer can maintain a higher breakdown voltage, thereby keeping the current from leaking through the gate.

Abstract translation: 本发明提供一种高压金属氧化物半导体（HVMOS）晶体管，其包括衬底，栅极电介质层，栅极电极和源极和漏极区域。 栅介质层设置在基板上，并且包括突出部分和凹陷部分，其中突出部分邻近凹部的两侧设置，并且具有大于凹部的厚度的厚度。 栅电极设置在栅介质层上。 因此，栅极电介质层的突出部分可以保持更高的击穿电压，从而保持电流不通过栅极泄漏。