公开(公告)号：US20120133460A1

公开(公告)日：2012-05-31

申请号：US13138731

申请日：2010-06-14

申请人： Koji Okubo ,  Kouetsu Takaya ,  Yasuhiro Naka ,  Toshikatsu Ohgami

发明人： Koji Okubo ,  Kouetsu Takaya ,  Yasuhiro Naka ,  Toshikatsu Ohgami

IPC分类号： H01H67/02 ,  H01H9/02

CPC分类号： H01H50/54 ,  H01H9/26 ,  H01H50/021 ,  H01H50/323 ,  H01H50/541 ,  H01H50/643 ,  H01H51/005 ,  H01H2300/044

摘要： Two electromagnetic contact devices 1a, 1b are arranged adjacently, a reversible unit 2 is detachably mounted on these electromagnetic contact devices, and two auxiliary contact point units 4a, 4b are detachably mounted on the reversible unit. In addition, two surge absorption units 3a, 3b are detachably mounted on the electromagnetic contact devices.

摘要翻译： 两个电磁接触装置1a，1b相邻布置，可逆单元2可拆卸地安装在这些电磁接触装置上，并且两个辅助接点单元4a，4b可拆卸地安装在可逆单元上。 此外，两个浪涌吸收单元3a，3b可拆卸地安装在电磁接触装置上。

公开(公告)号：USD657750S1

公开(公告)日：2012-04-17

申请号：US29390743

申请日：2011-04-28

申请人： Koji Okubo ,  Kouetsu Takaya ,  Yasuhiro Naka ,  Yutaka Nakamura ,  Takashi Tsutsumi ,  Hironobu Ariyoshi

设计人： Koji Okubo ,  Kouetsu Takaya ,  Yasuhiro Naka ,  Yutaka Nakamura ,  Takashi Tsutsumi ,  Hironobu Ariyoshi

公开(公告)号：USD656905S1

公开(公告)日：2012-04-03

申请号：US29390746

申请日：2011-04-28

申请人： Koji Okubo ,  Kouetsu Takaya ,  Yasuhiro Naka ,  Yutaka Nakamura ,  Takashi Tsutsumi ,  Hironobu Ariyoshi

设计人： Koji Okubo ,  Kouetsu Takaya ,  Yasuhiro Naka ,  Yutaka Nakamura ,  Takashi Tsutsumi ,  Hironobu Ariyoshi

公开(公告)号：US08093973B2

公开(公告)日：2012-01-10

申请号：US12409658

申请日：2009-03-24

申请人： Kouetsu Takaya ,  Koji Ohkubo ,  Yasuhiro Naka ,  Toshikatsu Ohgami ,  Kenji Suzuki

发明人： Kouetsu Takaya ,  Koji Ohkubo ,  Yasuhiro Naka ,  Toshikatsu Ohgami ,  Kenji Suzuki

IPC分类号： H01H63/02

CPC分类号： H01H50/045 ,  H01H11/06 ,  H01H49/00 ,  H01H50/042 ,  H01H50/546 ,  H01H50/58 ,  H01H2229/066 ,  Y10T29/49826

摘要： A movable contact holder includes a movable contact holder base and a movable contact holder cover. One side of the movable contact holder base is opened to have a plurality of recesses each being formed for holding a contact pair, each contact pair include a bridge contact assembly and a contact spring inserted therein while being isolated from the other pairs. The other side of the movable contact holder base is formed as a bottom wall, and preferably includes openings through which an assembly jig can be inserted from outside the moveable contact holder. Alternatively, jig openings can be formed in lateral side walls of the recesses to allow the assembly jig to be inserted. The movable contact holder cover covers the movable contact holder base and is coupled thereto.

摘要翻译： 可动触点支架包括可动触点保持器基座和可动触点支架盖。 可动触头保持器基座的一侧开放，以形成多个凹部，每个凹部被形成用于保持触点对，每个触头对包括插入其中的桥接触组件和接触弹簧，同时与其它对隔离。 可移动触点保持器底座的另一侧形成为底壁，并且优选地包括开口，组装夹具可以通过该开口从可移动触点支架的外部插入。 或者，夹具开口可以形成在凹部的侧壁中，以允许装配夹具被插入。 可动触点保持器盖覆盖可动触点支架基座并与其连接。

公开(公告)号：US07618847B2

公开(公告)日：2009-11-17

申请号：US12187622

申请日：2008-08-07

申请人： Hiroyuki Tenmei ,  Kunihiko Nishi ,  Yasuhiro Naka ,  Nae Hisano ,  Hiroaki Ikeda ,  Masakazu Ishino

发明人： Hiroyuki Tenmei ,  Kunihiko Nishi ,  Yasuhiro Naka ,  Nae Hisano ,  Hiroaki Ikeda ,  Masakazu Ishino

IPC分类号： H01L21/00

CPC分类号： H01L24/73 ,  H01L21/76898 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/50 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/11912 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/75753 ,  H01L2224/8113 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2224/83907 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/27

摘要： A bonding method (three-dimensional mounting) of semiconductor substrates is provided to sequentially bond a principal surface of a silicon wafer on which coupling bumps are formed, and a principal surface of the other silicon wafer on which pads are formed, by an adhesive applied to at least one of the principal surfaces. However, there is a problem of poor electrical coupling due to displacement of the bumps and the pads when bonded together. The present invention solves such a problem by conducting temporary positioning of the silicon wafers, adjusting the positions of the coupling bumps and pads while confirming the positions by a method such as x-ray capable of passing through the silicon wafers, and bonding the bumps and the pads together while hardening an interlayer adhesive provided between the principal surfaces of the silicon wafers by thermocompression.

摘要翻译： 提供半导体衬底的接合方法（三维安装），以通过施加的粘合剂顺序地接合形成有耦合凸块的硅晶片的主表面和形成有焊盘的另一个硅晶片的主表面 到至少一个主表面。 然而，由于当焊接在一起时由于凸起和焊盘的位移而存在差的电耦合的问题。 本发明通过进行硅晶片的临时定位来解决这样的问题，通过诸如能够通过硅晶片的x射线的方法确认位置来确定位置，并且将凸块和 一边通过热压而使设置在硅晶片的主表面之间的层间粘合剂硬化。

公开(公告)号：US20080164575A1

公开(公告)日：2008-07-10

申请号：US11956560

申请日：2007-12-14

申请人： Hiroaki Ikeda ,  Masakazu Ishino ,  Hiroyuki Tenmei ,  Naoya Kanda ,  Yasuhiro Naka ,  Kunihiko Nishi

发明人： Hiroaki Ikeda ,  Masakazu Ishino ,  Hiroyuki Tenmei ,  Naoya Kanda ,  Yasuhiro Naka ,  Kunihiko Nishi

IPC分类号： H01L21/46 ,  H01L29/06

CPC分类号： H01L21/46 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A method for manufacturing a semiconductor device includes the steps of forming first and second semiconductor wafers each including an array of chips and elongate electrodes, forming a groove on scribe lines separating the chips from one another; coating a surface of one of the semiconductor wafers with adhesive; bonding together the semiconductor wafers while allowing the groove to receive therein excessive adhesive; and heating the wafers to connect the elongate electrodes of both the semiconductor wafers.

摘要翻译： 一种制造半导体器件的方法包括以下步骤：形成第一和第二半导体晶片，每个半导体晶片均包括芯片和细长电极阵列，在将芯片彼此分开的划线上形成凹槽; 用粘合剂涂覆其中一个半导体晶片的表面; 将半导体晶片粘合在一起，同时允许凹槽在其中容纳过多的粘合剂; 并加热晶片以连接两个半导体晶片的细长电极。

公开(公告)号：US20070271957A1

公开(公告)日：2007-11-29

申请号：US11722964

申请日：2005-10-20

申请人： Toshihiro Nakamura ,  Tetsuya Kumada ,  Yasuhiro Naka

发明人： Toshihiro Nakamura ,  Tetsuya Kumada ,  Yasuhiro Naka

IPC分类号： C03B23/037 ,  C03B20/00

CPC分类号： C03B21/02 ,  C03B23/037 ,  C03B29/16

摘要： A manufacturing method of a glass strip, the method including a heating and drawing process of heating and softening a glass plate preform (1), drawing the glass plate preform to have a desired thickness and forming a glass strip (11), wherein at the heating and drawing process the glass plate preform (1) is drawn so that an internal pressure of a heating furnace (3) is kept positive relative to an atmospheric pressure and so that gas flows introduced to both surfaces of the glass plate preform (1) respectively are equal to each other within the heating furnace (3). It is possible to improve a surface roughness and obtain a desired surface roughness.

摘要翻译： 一种玻璃条的制造方法，该方法包括加热和软化玻璃板预制件（1）的加热和拉伸工艺，将玻璃板预制件拉制成具有所需厚度并形成玻璃条（11），其中在 加热和拉伸处理，拉制玻璃板预成型件（1），使得加热炉（3）的内部压力相对于大气压保持为正，并且使得气体流入玻璃板预制件（2）的两个表面， 分别在加热炉（3）内彼此相等。 可以提高表面粗糙度并获得所需的表面粗糙度。

公开(公告)号：US20050214543A1

公开(公告)日：2005-09-29

申请号：US10970379

申请日：2004-10-22

申请人： Yukio Koumura ,  Yasuhiro Naka ,  Nobuaki Orita

发明人： Yukio Koumura ,  Yasuhiro Naka ,  Nobuaki Orita

IPC分类号： G02B6/00 ,  C03B37/012 ,  C03B37/014 ,  C03B37/027 ,  B32B17/06

CPC分类号： C03B37/027 ,  C03B37/01446 ,  C03B37/01466 ,  C03B2205/90 ,  Y02P40/57 ,  Y10T428/24926 ,  Y10T428/2495

摘要： An optical fiber preform (1) serving as a material of an optical fiber has a shoulder portion (12) thrusting beyond a middle portion (M) in a base end region (K) which is on the upper side when the optical fiber preform is suspended for a drawing process. The optical fiber preform (1) of this configuration can be easily produced by appropriately setting the heating condition, etc. for the sintering step in the production process. Thus, it is possible to omit the elongating step after the sintering step, thereby simplifying the production process. Further, in the prior-art technique, turbulence is generated in the gas flow in the furnace of the drawing apparatus toward the end of the drawing step, making it impossible to draw in a stable manner. In contrast, in this embodiment, due to the shoulder portion (12), there is a small gap between the inner wall surface of the furnace and the optical fiber preform; due to this small gap, the gas flow is regulated, and the drawing can be conducted in a stable manner even toward the end of the drawing step.

摘要翻译： 用作光纤材料的光纤预制件（1）具有在光纤预制棒是在上侧的基端部区域（K）中超过中间部分（M）的肩部（12） 暂停绘制过程。 通过在生产过程中适当地设定烧结步骤的加热条件等，可以容易地制造这种结构的光纤预制件（1）。 因此，可以省略烧结步骤后的延伸工序，从而简化了制造工序。 此外，在现有技术中，在拉拔装置的炉内的气流中产生湍流，使得不可能稳定地绘制。 相反，在本实施方式中，由于肩部（12），炉内壁面和光纤预制体之间存在小间隙， 由于这种小的间隙，气流被调节，并且即使在拉拔步骤结束时也可以以稳定的方式进行拉伸。

公开(公告)号：US09117611B2

公开(公告)日：2015-08-25

申请号：US14116226

申请日：2012-04-03

申请人： Yasuhiro Naka ,  Kouetsu Takaya ,  Kenji Suzuki ,  Osamu Kashimura

发明人： Yasuhiro Naka ,  Kouetsu Takaya ,  Kenji Suzuki ,  Osamu Kashimura

IPC分类号： H01H9/30 ,  H01H50/54 ,  H01H50/42 ,  H01H9/34 ,  H01H50/02 ,  H01H1/54 ,  H01H9/44

CPC分类号： H01H50/54 ,  H01H1/54 ,  H01H9/34 ,  H01H9/443 ,  H01H50/42 ,  H01H50/546 ,  H01H2050/025

摘要： An electromagnetic contactor has a contact device including a pair of fixed contacts disposed maintaining a predetermined distance and a movable contact disposed to be capable of contacting to and separating from the pair of fixed contacts. The pair of fixed contacts each includes a support conductor portion supported by an upper plate of a contact housing case, and a contact conductor portion connected to an end portion of the support conductor portion. The contact conductor portion includes a contact plate portion formed with a contact portion, and a connecting plate portion formed on an outer end portion of the contact plate portion and extending to the upper plate side. The movable contact is mounted onto a connecting shaft connected to a drive portion through a contact spring on an end portion on the upper plate side, and disposed to face the contact portion of the pair of fixed contacts.

摘要翻译： 电磁接触器具有接触装置，该接触装置包括保持预定距离的一对固定触点和设置成能够接触和分离一对固定触点的可动触点。 一对固定触点各自包括由触点外壳的上板支撑的支撑导体部分和连接到支撑导体部分的端部的接触导体部分。 接触导体部分包括形成有接触部分的接触板部分和形成在接触板部分的外端部并延伸到上板侧的连接板部分。 可动触头通过上板侧的端部上的接触弹簧安装在与驱动部连接的连接轴上，并配置成与一对固定触头的接触部相对。

公开(公告)号：US09048051B2

公开(公告)日：2015-06-02

申请号：US13978088

申请日：2012-04-03

申请人： Yasuhiro Naka ,  Kouetsu Takaya ,  Kenji Suzuki ,  Takahiro Taguchi

发明人： Yasuhiro Naka ,  Kouetsu Takaya ,  Kenji Suzuki ,  Takahiro Taguchi

IPC分类号： H01H47/00 ,  H01H9/44 ,  H01H50/14 ,  H01H50/16 ,  H01H50/38 ,  H01H51/06 ,  H01H9/00 ,  H01H47/18 ,  H01H47/32 ,  H01H51/30 ,  H01H51/28 ,  H01H67/00 ,  H01H1/00 ,  H01H9/30 ,  H01H1/48 ,  H01H1/50 ,  H01H50/42 ,  H01H50/02

CPC分类号： H01H47/32 ,  H01H9/443 ,  H01H50/14 ,  H01H50/163 ,  H01H50/38 ,  H01H50/42 ,  H01H51/065 ,  H01H2050/025

摘要： An electromagnetic contactor has a pair of fixed contacts disposed and fixed maintaining a predetermined interval; a movable contact disposed to be capable of contacting to and separating from the pair of fixed contacts; an electromagnet unit to drive the movable contact; and a drive circuit driving the electromagnet unit. The electromagnet unit includes at least a movable plunger urged by a return spring, a coil to move the movable plunger, and a ring-form permanent magnet magnetized in a moving direction of the movable plunger. The drive circuit includes a power source to supply power to the coil; a pulse drive circuit to output and supply to the coil an engage pulse causing the movable plunger to perform an attracting operation and a hold pulse maintaining the attracting operation when the movable plunger is subject to the attracting operation, and a flywheel circuit having a semiconductor switching element.

摘要翻译： 电磁接触器具有保持预定间隔设置和固定的一对固定触点; 设置成能够接触和分离所述一对固定触点的可动触头; 用于驱动可动触头的电磁体单元; 以及驱动电磁铁单元的驱动电路。 电磁体单元包括至少一个由复位弹簧推动的可移动柱塞，用于移动可移动柱塞的线圈和沿可移动柱塞的移动方向被磁化的环形永磁体。 驱动电路包括向线圈供电的电源; 脉冲驱动电路，用于向所述线圈输出接合脉冲，使得所述可动柱塞进行吸引动作，以及当所述可动柱塞经受所述吸引动作时保持所述吸引动作的保持脉冲;以及具有半导体开关 元件。