ADHESIVE SHEET FOR SEMICONDUCTOR ELEMENT FABRICATION

    公开(公告)号:US20240287354A1

    公开(公告)日:2024-08-29

    申请号:US18572140

    申请日:2022-02-22

    IPC分类号: C09J7/38

    摘要: Provided is a pressure-sensitive adhesive sheet for processing a semiconductor element, which is capable of protecting a semiconductor element from electrostatic breakdown caused by peeling electrification and frictional electrification even under a high-humidity environment and/or under the application of a high voltage. The pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a base material. A surface resistivity ρsBM of the base material and a surface resistivity ρsPA of the pressure-sensitive adhesive layer are each 1.0×1013Ω/□ or less. In one embodiment, a surface resistivity ρs10VBM of the base material at a time of application of 10 V and a surface resistivity ρs10VPA of the pressure-sensitive adhesive layer at a time of application of 10 V, and a surface resistivity ρs1000VBM 1,000 V and a surface resistivity ρs1000VPA 1,000 V satisfy the following expression (1) and expression (2).









    ρs

    1000


    VBM


    /

    ρs

    10


    VBM





    1
    ,
    000





    (
    1
    )














    ρs

    1000


    VPA


    /

    ρs

    10


    VPA





    1
    ,
    000





    (
    2
    )

    PRESSURE-SENSITIVE ADHESIVE TAPE PROCESSING METHOD AND PRESSURE-SENSITIVE ADHESIVE TAPE PROCESSING DEVICE

    公开(公告)号:US20240191103A1

    公开(公告)日:2024-06-13

    申请号:US18284653

    申请日:2022-03-23

    IPC分类号: C09J7/38

    摘要: Provided is a pressure-sensitive adhesive tape processing method capable of easily separating a base material and a pressure-sensitive adhesive for forming a pressure-sensitive adhesive tape from each other at low cost. Furthermore, a pressure-sensitive adhesive tape processing device used for such a pressure-sensitive adhesive tape processing method is provided. The pressure-sensitive adhesive tape processing method according to an embodiment of the present invention is a method for processing a pressure-sensitive adhesive tape including a base material layer and a pressure-sensitive adhesive layer, a storage modulus of the base material layer at 25° C. is 2 MPa or more, and the pressure-sensitive adhesive tape processing method includes a step (I) of separating a pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer, from the base material layer, by grinding a surface of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape.