公开(公告)号：US06544584B1

公开(公告)日：2003-04-08

申请号：US08813765

申请日：1997-03-07

Applicant: Edward Lee Arrington ,  John Christopher Camp ,  Robert Jeffrey Day ,  Edmond Otto Fey ,  Curtis Michael Gunther ,  Thomas Richard Miller

Inventor： Edward Lee Arrington ,  John Christopher Camp ,  Robert Jeffrey Day ,  Edmond Otto Fey ,  Curtis Michael Gunther ,  Thomas Richard Miller

IPC: B05D512

CPC classification number: H05K3/26 ,  H05K3/184 ,  H05K2201/0761 ,  H05K2203/0796 ,  Y10S428/901 ,  Y10T428/12396 ,  Y10T428/12715 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/24917 ,  Y10T428/31678

Abstract: A process for removal of undesirable conductive material (e.g., catalyst material and seeped circuit material) on a circuitized substrate and the resultant circuitized substrates disclosed. Such process and resultant circuit effectively address the electrical shorting problems caused by nonremoval of the residual catalyst material and circuit material which has seeped under the residual catalyst material. The process includes the steps of: a) providing a catalyst layer (e.g., palladium and tin) having circuit pattern (e.g., copper) thereon; b) pretreating the catalyst layer and the circuit pattern (e.g., with a cyanide dip) for removal of undesirable portions of each which cause electrical leakage between circuit lines of the circuit pattern; c) oxidizing the catalyst layer and the circuit pattern (e.g., with chlorite, permanganate, hydrogen peroxide, or air at a temperature elevated above ambient conditions); and d) removing the undesirable portions of the catalyst layer and the undesirable portions of the circuit pattern (e.g., with a cyanide submersion). The resultant circuitized substrate includes a circuit pattern on a catalyst layer wherein undesirable portions of the catalyst layer and circuit pattern are completely removed between the circuit features of the circuit pattern so that electrical leakage between the circuit features does not occur.

Abstract translation: 用于去除电路化基板上的不期望的导电材料（例如催化剂材料和渗出的电路材料）的方法以及公开的所得的电路化基板。 这种工艺和结果电路有效地解决了残余催化剂材料和残余催化剂材料下渗出的电路材料的非破坏所引起的电短路问题。 该方法包括以下步骤：a）在其上提供具有电路图案（例如铜）的催化剂层（例如钯和锡） b）预处理催化剂层和电路图案（例如，用氰化物浸渍），以除去在电路图案的电路线之间引起漏电的各部分的不希望的部分; c）氧化催化剂层和电路图案（例如，在高于环境条件的温度下使用亚氯酸盐，高锰酸盐，过氧化氢或空气）; 以及d）去除催化剂层的不期望的部分和电路图案的不希望的部分（例如，氰化物浸没）。 所得到的电路化衬底包括在催化剂层上的电路图案，其中在电路图案的电路特征之间催化剂层和电路图案的不期望部分被完全去除，使得电路特征之间的电泄漏不会发生。

公开(公告)号：US06534120B1

公开(公告)日：2003-03-18

申请号：US09606715

申请日：2000-06-29

Applicant: Jun Ozawa ,  Shinji Eda

Inventor： Jun Ozawa ,  Shinji Eda

IPC: B05D512

CPC classification number: G11B5/8404 ,  C03C21/002

Abstract: In order to prevent particles generated in the preparation of a chemically reinforcing molten salt from getting into an operation atmosphere for performing a chemical reinforcement, a chemical reinforcement tank 2 and a dissolution tank 10 for preparing the chemically reinforcing molten salt are separated from each other. In a typical embodiment, the chemical reinforcement tank is disposed in a clean room 35, and the dissolution tank 10 is disposed outside the clean room.

Abstract translation: 为了防止在制备化学增强熔融盐时产生的颗粒进入用于进行化学增强的操作气氛中，用于制备化学增强熔融盐的化学增强槽2和溶解槽10彼此分离。 在典型的实施方案中，化学加固槽设置在洁净室35中，溶解槽10设置在洁净室的外部。

公开(公告)号：US06534119B1

公开(公告)日：2003-03-18

申请号：US09701750

申请日：2000-12-04

Applicant: Yoichiro Tsuji ,  Tadashi Aoki ,  Fumio Kageyama

Inventor： Yoichiro Tsuji ,  Tadashi Aoki ,  Fumio Kageyama

IPC: B05D512

CPC classification number: H01B3/441 ,  C08L23/06 ,  C08L23/0815 ,  C08L2203/202 ,  C08L2205/02 ,  C08L2312/00 ,  C08L2666/04 ,  C08L2666/02

Abstract: A wire showing satisfactory electrical insulation, mechanical strength, wear resistance, crosslinking properties and appearance may be obtained by coating a conductor with an ethylene/&agr;-olefin copolymer whose density, melt flow rate, decane soluble matter content, melting point and melt tension are controlled to particular ranges. The copolymer may be used singly or in combination with high-pressure low-density polyethylene. Such copolymer provides a coated layer showing tensile strength of not less than 15 MPa, tensile elongation of not less than 400% and taper wear amount of not more than 15 mg. Furthermore, if the resin pressure in the extruder is adjusted to a particular range, high-speed extrusion becomes possible with a smooth apparent coated layer.

Abstract translation: 可以通过用密度，熔体流动速率，癸烷可溶物质含量，熔点和熔融张力的乙烯/α-烯烃共聚物涂覆导体来获得表现出令人满意的电绝缘性，机械强度，耐磨性，交联性能和外观的电线 控制到特定范围。 共聚物可以单独使用或与高压低密度聚乙烯组合使用。 这种共聚物提供显示拉伸强度不小于15MPa，拉伸伸长率不小于400％，锥度磨损量不大于15mg的涂层。 此外，如果将挤出机中的树脂压力调整到特定的范围，则可以用光滑的表面涂层进行高速挤出。

公开(公告)号：US06534116B2

公开(公告)日：2003-03-18

申请号：US09740701

申请日：2000-12-18

Applicant: Bulent Basol

Inventor： Bulent Basol

IPC: B05D512

CPC classification number: H01L21/2885 ,  C25D3/38 ,  C25D5/02 ,  C25D5/022 ,  C25D5/18 ,  C25D5/22 ,  C25D5/34 ,  C25D17/001 ,  C25D17/008 ,  H01L21/7684 ,  H01L21/76879

Abstract: The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion and causing greater plating of the cavity portion relative to the top portion.

公开(公告)号：US06524644B1

公开(公告)日：2003-02-25

申请号：US09383718

申请日：1999-08-26

Applicant: Karl F. Wengenroth

Inventor： Karl F. Wengenroth

IPC: B05D512

CPC classification number: B23K1/20 ,  B23K35/3615 ,  B23K2101/40 ,  C23C30/00 ,  C23F11/10 ,  C23F11/149 ,  H05K3/282 ,  H05K2203/0591 ,  H05K2203/124

Abstract: A method is provided for the selective deposition of an organic solderability preservative (OSP) coating on copper surfaces of articles such as electronic components, e.g., printed wiring boards, to serve as a protective coating and preserve the solderability of the copper surface while substantially excluding gold surfaces from attracting the same OSP coating which coating causes cosmetic defects in the form of staining and may reduce the conductivity of the gold contact surface. The method improves the conventional OSP process and utilizes a pre-treatment of the copper surface before applying the OSP coating comprising treating the cleaned and preferably micro-etched copper with an aqueous solution of benzimidazole or derivative thereof to form a precoat on the copper surface. After the pre-treatment step, the precoated copper surface is conventionally treated with a suitable OSP solution such as an aqueous solution of a substituted benzimidazole compound, preferably at the 2-position.

Abstract translation: 提供了一种用于选择性地将有机可焊性防腐剂（OSP）涂层选择性沉积在诸如电子部件（例如印刷线路板）的物品的铜表面上以用作保护涂层并保持铜表面的可焊性，同时基本上排除 金表面吸引相同的OSP涂层，其涂层以染色的形式引起化妆品缺陷并且可能降低金接触表面的导电性。 该方法改进了常规的OSP工艺，并且在施加OSP涂层之前利用铜表面的预处理，包括用苯并咪唑或其衍生物的水溶液处理清洁并优选微蚀刻的铜，以在铜表面上形成预涂层。 在预处理步骤之后，预涂铜表面通常用合适的OSP溶液如取代的苯并咪唑化合物的水溶液，优选在2-位处理。

公开(公告)号：US06524643B1

公开(公告)日：2003-02-25

申请号：US08907494

申请日：1997-08-08

Applicant: Takao Nakamura ,  Michitomo Iiyama

Inventor： Takao Nakamura ,  Michitomo Iiyama

IPC: B05D512

CPC classification number: H01L39/146 ,  H01L39/2461 ,  Y10S505/732

Abstract: The invention provides a method for preparing a layered structure comprising a lower thin film composed of an oxide superconductor and an upper thin film composed of a material different from the oxide superconductor on a substrate. The lower thin film is deposited by a molecular beam deposition process and the upper thin film is deposited by a process having a deposition rate faster than that of the molecular beam deposition process.

Abstract translation: 本发明提供一种制备层状结构的方法，其包括由氧化物超导体构成的下部薄膜和由与基板上的氧化物超导体不同的材料构成的上部薄膜。 通过分子束沉积工艺沉积下部薄膜，并且通过具有比分子束沉积工艺更快的沉积速率的方法沉积上部薄膜。

公开(公告)号：US06521286B2

公开(公告)日：2003-02-18

申请号：US10055622

申请日：2002-01-23

Applicant: Makoto Isozaki

Inventor： Makoto Isozaki

IPC: B05D512

CPC classification number: G11B5/8408 ,  G11B5/725

Abstract: A lubricating layer is applied to the surface of a thin protective layer on a magnetic recording medium. The surface of the protective layer is burnished to reduce protuberances. The lubricating layer is removed by solvent washing. Then, a replacement lubricating layer is deposited on the surface of the protective layer. The resulting surface of the magnetic recording medium exhibits reduced scratching and particle contamination.

公开(公告)号：US06517895B1

公开(公告)日：2003-02-11

申请号：US09719803

申请日：2001-03-12

Applicant: Klaus Wolfer ,  Dietmar Leibrock

Inventor： Klaus Wolfer ,  Dietmar Leibrock

IPC: B05D512

CPC classification number: H05K3/0094 ,  H05K3/108 ,  H05K3/1216 ,  H05K3/227 ,  H05K3/28 ,  H05K3/3452 ,  H05K2203/0759 ,  H05K2203/1366 ,  H05K2203/1572

Abstract: In a method of coating substrates, especially printed circuit boards, on both sides, one side of the substrate, which is provided with holes, is coated by a coating process, especially by screen printing, wherein the holes that are not required for the circuit layout are lastingly covered over and the holes that are required are covered over only slightly or are left clear, whereupon the other side of the substrate is coated by a coating process, especially by curtain pouring or spraying, wherein the entire surface of the substrate is provided uniformly with a coating that gives only a light covering over the holes.

Abstract translation: 在两面涂覆基板，特别是印刷电路板的方法中，设置有孔的基板的一侧通过涂布工艺涂覆，特别是通过丝网印刷，其中电路不需要的孔 布局最后被覆盖并且所需的孔仅被稍微覆盖或者被清除，于是衬底的另一侧通过涂覆工艺涂覆，特别是通过帘式浇注或喷涂，其中基底的整个表面是 均匀地提供仅在孔上仅覆盖光的涂层。

公开(公告)号：US06509056B2

公开(公告)日：2003-01-21

申请号：US09877449

申请日：2001-06-11

Applicant: Parviz Soroushian ,  Ali Nossoni

Inventor： Parviz Soroushian ,  Ali Nossoni

IPC: B05D512

CPC classification number: C04B41/009 ,  C04B41/52 ,  C04B41/70 ,  G01N21/91 ,  G01N21/95 ,  G01N33/383 ,  C04B41/4515 ,  C04B41/4521 ,  C04B41/4523 ,  C04B41/51 ,  C04B41/53 ,  C04B41/483 ,  C04B41/522 ,  C04B41/4853 ,  C04B2111/807 ,  C04B28/02

Abstract: Concrete materials are impregnated with liquids which harden within concrete pores and microcracks, and develop a sharp contrast with the body of concrete in microscopic images. The impregnation process involves vacuum application to remove air from concrete pores and microcracks, followed by the introduction of liquids under pressure. The sharp contrast between the impregnated (and hardened) liquid and the body of concrete facilitates distinction of pores and microcracks in microscopic images for the purpose of automated image analysis.

Abstract translation: 混凝土材料浸渍在混凝土孔隙和微裂纹中硬化的液体，并在微观图像中与混凝土体形成鲜明对比。 浸渍过程涉及真空应用以从混凝土孔隙和微裂纹中除去空气，然后在压力下引入液体。 浸渍（和硬化）液体和混凝土体之间的鲜明对比有助于区分微观图像中的孔和微裂纹，以实现自动图像分析。

公开(公告)号：US06506442B2

公开(公告)日：2003-01-14

申请号：US09764100

申请日：2001-01-19

Applicant: Hitoshi Otsuka

Inventor： Hitoshi Otsuka

IPC: B05D512

CPC classification number: G11B5/8404 ,  B05D3/002 ,  B05D2201/02 ,  B05D2252/02 ,  B08B1/008

Abstract: A method for producing a magnetic recording medium having a magnetic material coated on a surface of a polymeric film comprising, in the running direction of the polymeric film, the steps of pressing a cleaning tape made of one of a non-woven fabric and a fabric impregnated with a cleaning agent against the surface of said polymeric film onto which said coating material is coated in order to wipe off foreign matter adhering to said surface of the polymeric film; drying the surface of the wiped polymeric film; and just after the drying step, coating a magnetic coating material onto a surface of a polymeric film while said polymeric film is running. An apparatus for the above method is also disclosed.

Abstract translation: 一种制备具有涂覆在聚合物膜表面上的磁性材料的磁记录介质的方法，包括在聚合物膜的运行方向上按压由无纺织物和织物之一制成的清洁带的步骤 用清洁剂浸渍在所述聚合物膜的表面上，所述涂覆材料涂覆在所述聚合物膜的表面上，以便擦除附着在聚合物膜的所述表面上的异物; 干燥被擦拭的聚合物膜的表面; 并且在干燥步骤之后，当聚合物膜运行时，将磁性涂料涂覆在聚合物膜的表面上。 还公开了上述方法的装置。