公开(公告)号：US20190102136A1

公开(公告)日：2019-04-04

申请号：US16193559

申请日：2018-11-16

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yusuke Yoshitani ,  Kazuhiko Fujita ,  Akihiro Kaita

IPC: G06F3/14 ,  G06F3/041 ,  G06F3/147 ,  G06F3/044 ,  G09G3/20 ,  H01L27/32 ,  H01L25/04 ,  G09G3/3208

Abstract: To provide a display device that is suitable for increasing in size. To provide a display device in which display unevenness is suppressed. To provide a display device that can display an image along a curved surface. The display device includes two display panels, two plates, two stages, two driver circuits, two adjusting units, and a frame. Each display panel includes a display portion, an operating circuit portion, a terminal, an external electrode, a transparent portion, and a first portion and has flexibility. Each transparent portion includes a region transmitting visible light. The display panels are fixed so that transparent portions and parts of the display portions extend beyond the plates. The display portion of one of the two display panels overlaps with the transparent portion of the other display panel.

公开(公告)号：US10236276B2

公开(公告)日：2019-03-19

申请号：US15620471

申请日：2017-06-12

Applicant: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.

Inventor： Yangming Liu ,  Chin-Tien Chiu ,  Zhongli Ji ,  Shaopeng Dong ,  Zengyu Zhou

IPC: H01L25/10 ,  H01L25/04 ,  H01L25/07 ,  H01L25/11 ,  H01L25/065 ,  H01L25/00 ,  H01L25/075

Abstract: A semiconductor device is disclosed including at least first and second vertically stacked and interconnected groups of semiconductor packages. The first and second groups of semiconductor packages may differ from each other in the number of packages and functionality.

公开(公告)号：US10236273B2

公开(公告)日：2019-03-19

申请号：US15614056

申请日：2017-06-05

Applicant: Semiconductor Manufacturing International (Shanghai) Corporation ,  Semiconductor Manufacturing International (Beijing) Corporation

Inventor： Chong Wang ,  Hai Fang Zhang ,  Xuan Jie Liu

IPC: H01L25/04 ,  H01L23/00 ,  H01L23/053 ,  H01L23/31 ,  H01L23/12 ,  H01L51/00 ,  H01L23/64 ,  H01L21/768 ,  H01L23/48

Abstract: A packaging structure and a packaging method are provided. The packaging structure includes a carrier semiconductor structure including a carrier substrate, a carrier dielectric layer, and a carrier top conductive layer inside the carrier dielectric layer and having a top exposed by the carrier dielectric layer. The packaging structure also includes a top semiconductor structure including a top substrate, a first dielectric layer, a zeroth conductive layer, and a second dielectric layer, wherein a position of the zeroth conductive layer corresponds to a position of the carrier top conductive layer. Further, the packaging structure includes a conductive plug formed on one side of the zeroth conductive layer, and penetrating through the top substrate, the first dielectric layer, and the second dielectric layer, wherein the conductive plug is electrically connected to each of the zeroth conductive layer and the carrier top conductive layer.

公开(公告)号：US10211248B2

公开(公告)日：2019-02-19

申请号：US15319947

申请日：2015-06-16

Applicant: SONY CORPORATION

Inventor： Kenichi Shigenami ,  Takayuki Kai ,  Natsuhiro Aota ,  Atsushi Muto ,  Yoshiyuki Akiyama ,  Takashi Miyamoto ,  Takayuki Sekihara ,  Tomohiro Takahashi

IPC: H04N5/335 ,  H04N3/14 ,  H01L27/146 ,  H01L25/04 ,  H01L25/18 ,  H04N5/374 ,  H04N5/378

Abstract: The present technology relates to a circuit substrate, an image sensor, and an electronic apparatus that are capable of suppressing generation of noise in a conductor loop, which is caused due to a change in the conductor loop. A circuit substrate according to the present technology includes a circuit that is formed of a conductor and is capable of forming a conductor loop, at least a part of the dimensions of the conductor loop being variable; and a plurality of conductors that are each formed at a position where an induced electromotive force is generated in the conductor loop by a magnetic field and each have a structure that suppresses a change in the induced electromotive force generated by a change in dimensions of the conductor loop, the magnetic field being generated by the plurality of conductors. The present technology is applicable to, for example, an image sensor and an electronic apparatus.

公开(公告)号：US10181507B2

公开(公告)日：2019-01-15

申请号：US15644570

申请日：2017-07-07

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  Ronald S. Cok

IPC: H01L27/32 ,  G06F3/044 ,  H01L33/58 ,  H01L33/62 ,  G06F3/041 ,  H01L25/04 ,  H01L25/075 ,  H01L27/15 ,  H01L33/64 ,  H01L51/52 ,  H01L51/56

Abstract: A display tile structure includes a tile layer with opposing emitter and backplane sides. A light emitter having first and second electrodes for conducting electrical current to cause the light emitter to emit light is disposed in the tile layer. First and second electrically conductive tile micro-wires and first and second conductive tile contact pads are electrically connected to the first and second tile micro-wires, respectively. The light emitter includes a plurality of semiconductor layers and the first and second electrodes are disposed on a common side of the semiconductor layers opposite the emitter side of the tile layer. The first and second tile micro-wires and first and second tile contact pads are disposed on the backplane side of the tile layer.

公开(公告)号：US10170535B2

公开(公告)日：2019-01-01

申请号：US15705810

申请日：2017-09-15

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok

IPC: H01L27/32 ,  G06F3/044 ,  H01L25/04 ,  H01L51/56 ,  H01L25/075 ,  H01L33/64 ,  H01L33/62 ,  G06F3/041 ,  H01L27/15 ,  H01L33/58 ,  H01L51/52

Abstract: An active-matrix touchscreen includes a substrate, a system controller, and a plurality of spatially separated independent touch elements disposed on the substrate. Each touch element includes a touch sensor and a touch controller circuit that provides one or more sensor-control signals to the touch sensor and receives a sense signal responsive to the sensor-control signals from the touch sensor. Each touch sensor operates independently of any other touch sensor.

公开(公告)号：US10153220B2

公开(公告)日：2018-12-11

申请号：US15785778

申请日：2017-10-17

Applicant: Texas Instruments Incorporated

Inventor： Osvaldo Jorge Lopez ,  Jonathan Almeria Noquil ,  Thomas Eugene Grebs ,  Simon John Molloy

IPC: H01L23/14 ,  H01L23/057 ,  H01L23/08 ,  H01L25/16 ,  H01L25/04 ,  H01L21/48 ,  H01L25/00 ,  H01L21/78 ,  H01L23/13

Abstract: A packaged electronic system comprises a slab (210) of low-grade silicon (l-g-Si) configured as ridges (114) framing a depression of depth (112) including a recessed central area suitable to accommodate semiconductor chips and embedded electrical components, the depth at least equal to the thickness of the chips and the components, the ridge covered by system terminals (209b) connected to attachment pads in the central area; and semiconductor chips (120, 130) having a thickness and terminals on at least one of opposing chip sides, the chips terminals attached to the central area terminals so that the opposite chip side is coplanar with the system terminals on the slab ridge.

公开(公告)号：US20180323143A1

公开(公告)日：2018-11-08

申请号：US16036946

申请日：2018-07-17

Applicant: Industrial Technology Research Institute ,  Unimicron Technology Corp.

Inventor： Yu-Hua Chen ,  Wei-Chung Lo ,  Dyi-Chung Hu ,  Chang-Hong Hsieh

IPC: H01L23/522 ,  H01L25/04 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/5226 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L25/04 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A package substrate and a method of fabricating the package substrate are provided. The package substrate includes a substrate having a first surface including a plurality of conductive pads and a second surface; an insulating protective layer formed on the first surface of the substrate; an interposer embedded in and exposed from the insulating protective layer; and at least a passive component provided on the first surface of the substrate. The insulating protective layer includes at least an opening for exposing at least one of the conductive pads, and the at least the passive component is directly provided on the conductive pad exposed from the opening.

公开(公告)号：US10020348B2

公开(公告)日：2018-07-10

申请号：US15469779

申请日：2017-03-27

Applicant: LG Display Co., Ltd.

Inventor： Taeshick Kim ,  Younseok Kam ,  Seung Kim ,  Jaeseung Jang ,  Mingyu Lee

IPC: H01L27/32 ,  H01L25/04 ,  H01L51/50

CPC classification number: H01L27/3209 ,  H01L25/048 ,  H01L51/504 ,  H01L51/5044 ,  H01L51/5278

Abstract: An organic light emitting display device includes a first emission part between an anode and a cathode and a second emission part on the first emission part. At least one of the first emission part and the second emission part includes at least three emission layers emitting lights of different colors, and one of the at least three emission layers include a green emission layer including a phosphorescent material. Accordingly, a lifetime and color reproduction rate of the organic light emitting display device having green lifetime is enhanced.

公开(公告)号：US10014461B1

公开(公告)日：2018-07-03

申请号：US15894902

申请日：2018-02-12

Applicant: FACE INTERNATIONAL CORPORATION

Inventor： Clark D Boyd ,  Bradbury R Face ,  Jeffrey D Shepard

IPC: H01L21/00 ,  H01L35/34 ,  H01L25/00 ,  H01L25/04 ,  H01L35/02

CPC classification number: H01L35/34 ,  A61N1/3785 ,  G01V1/16 ,  H01L23/58 ,  H01L25/04 ,  H01L25/0652 ,  H01L25/074 ,  H01L25/50 ,  H01L35/02 ,  H01L2924/14 ,  H02J7/34 ,  H02J50/00

Abstract: A method is provided for producing an electrically-powered device and/or component that is embeddable in a solid structural component, and a system, a produced device and/or a produced component is provided. The produced electrically powered device includes an attached autonomous electrical power source in a form of a unique, environmentally-friendly structure configured to transform thermal energy at any temperature above absolute zero to an electric potential without any external stimulus including physical movement or deformation energy. The autonomous electrical power source component provides a mechanism for generating renewable energy as primary power for the electrically-powered device and/or component once an integrated structure including the device and/or component is deployed in an environment that restricts future access to the electrical power source for servicing, recharge, replacement, replenishment or the like.