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公开(公告)号:US12300313B2
公开(公告)日:2025-05-13
申请号:US17580862
申请日:2022-01-21
Inventor: Farnood Merrikh Bayat , Xinjie Guo , Dmitri Strukov , Nhan Do , Hieu Van Tran , Vipin Tiwari , Mark Reiten
IPC: G11C11/54 , G06F3/06 , G06N3/04 , G06N3/045 , G06N3/063 , G11C16/08 , G11C16/12 , G11C16/16 , G11C16/34 , G11C29/38
Abstract: An artificial neural network device that utilizes one or more non-volatile memory arrays as the synapses. The synapses are configured to receive inputs and to generate therefrom outputs. Neurons are configured to receive the outputs. The synapses include a plurality of memory cells, wherein each of the memory cells includes spaced apart source and drain regions formed in a semiconductor substrate with a channel region extending there between, a floating gate disposed over and insulated from a first portion of the channel region and a non-floating gate disposed over and insulated from a second portion of the channel region. Each of the plurality of memory cells is configured to store a weight value corresponding to a number of electrons on the floating gate. The plurality of memory cells are configured to multiply the inputs by the stored weight values to generate the outputs.
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102.
公开(公告)号:US12299562B2
公开(公告)日:2025-05-13
申请号:US17090481
申请日:2020-11-05
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Thuan Vu , Stanley Hong , Stephen Trinh , Vipin Tiwari , Han Tran , Hien Pham
Abstract: Numerous embodiments of analog neural memory arrays are disclosed. Certain embodiments contain improved mechanisms for pulling source lines down to ground expeditiously. This is useful, for example, to minimize the voltage drop for a read, program, or erase operation.
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公开(公告)号:US12249368B2
公开(公告)日:2025-03-11
申请号:US18645184
申请日:2024-04-24
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Steven Lemke , Vipin Tiwari , Nhan Do , Mark Reiten
IPC: G11C11/54 , G06N3/045 , G11C16/04 , G11C16/10 , G11C16/14 , H01L29/423 , H01L29/788 , H10B41/30
Abstract: A neural network device with synapses having memory cells each having a floating gate and a first gate over first and second portions of a channel region disposed between source and drain regions, and a second gate over the floating gate or the source region. First lines each electrically connect the first gates in one of the memory cell rows, second lines each electrically connect the second gates in one of the memory cell rows, third lines each electrically connect the source regions in one of the memory cell rows, and fourth lines each electrically connect the drain regions in one of the memory cell columns. The synapses receive a first plurality of inputs as electrical voltages on the fourth lines, and provide a first plurality of outputs as electrical currents on the third lines.
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公开(公告)号:US12206325B2
公开(公告)日:2025-01-21
申请号:US18135395
申请日:2023-04-17
Applicant: Silicon Storage Technology, Inc.
Inventor: Thoan Nguyen , Nghia Nguyen , Viet Nguyen , Son Nguyen , Hien Lai , Phuong Nguyen
IPC: H02M3/07
Abstract: In one example, a system comprises a plurality of charge pump units connected in parallel to receive an input voltage and to generate an output voltage greater than the input voltage and a pumping controller to provide a pumping signal to a first charge pump unit of the plurality of charge pump units and to provide sequentially delayed versions of the pumping signal to the other charge pump units of the plurality of charge pump units.
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公开(公告)号:US20240389319A1
公开(公告)日:2024-11-21
申请号:US18228414
申请日:2023-07-31
Applicant: Silicon Storage Technology, Inc.
Inventor: Serguei Jourba , Catherine Decobert , Nhan Do
IPC: H10B41/30 , H01L21/28 , H01L29/423 , H01L29/66 , H01L29/788 , H10B41/40
Abstract: A memory device includes a SOI substrate comprising bulk silicon, an insulation layer vertically over the bulk silicon, and a silicon layer vertically over the insulation layer. A memory cell includes source and drain regions formed in the bulk silicon with a channel region of the bulk silicon extending therebetween, and a floating gate which includes a first portion of the silicon layer disposed vertically over and insulated from a first portion of the channel region by the insulation layer. The first portion of the silicon layer is epitaxially thickened or a layer of polysilicon is formed on the first portion of the silicon layer. A select gate is disposed vertically over and insulated from a second portion of the channel region. A control gate is disposed vertically over and insulated from the floating gate. An erase gate is disposed vertically over and insulated from the source region.
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公开(公告)号:US20240338144A1
公开(公告)日:2024-10-10
申请号:US18212066
申请日:2023-06-20
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , STEPHEN TRINH , HOA VU , STANLEY HONG , THUAN VU
IPC: G06F3/06
CPC classification number: G06F3/0655 , G06F3/062 , G06F3/0679 , G11C16/08
Abstract: Numerous examples are disclosed of a masking circuit for inputs and outputs in a neural network array. In one example, a system comprises a neural network array comprising a plurality of non-volatile memory cells arranged into rows and columns; and row circuits for respective rows in the neural network array, the row circuits comprising a masking circuit to prevent an application of a sparse input to one or more rows in the array when a condition is satisfied.
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107.
公开(公告)号:US20240257880A1
公开(公告)日:2024-08-01
申请号:US18104228
申请日:2023-01-31
Applicant: Silicon Storage Technology, Inc.
Inventor: Louisa Schneider , Xian Liu , Steven Lemke , Parviz Ghazavi , Jinho Kim , Henry A. Om'Mani , Hieu Van Tran , Nhan Do
IPC: G11C16/16 , H01L23/48 , H01L29/423 , H10B41/10 , H10B41/27
CPC classification number: G11C16/16 , H01L23/481 , H01L29/42328 , H10B41/10 , H10B41/27
Abstract: A memory cell array having rows and columns of memory cells with respective ones of the memory cells including spaced apart source and drain regions formed in a semiconductor substrate with a channel region extending there between, a floating gate over a first portion of the channel region, a select gate over a second portion of the channel region, and an erase gate over the source region. A strap region is disposed between first and second pluralities of the columns. For one memory cell row, a dummy floating gate is disposed in the strap region, an erase gate line electrically connects together the erase gates of the memory cells in the one row and in the first plurality of columns, wherein the erase gate line is aligned with the dummy floating gate with a row direction gap between the erase gate line and the dummy floating gate.
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公开(公告)号:US20240220154A1
公开(公告)日:2024-07-04
申请号:US18604884
申请日:2024-03-14
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran
CPC classification number: G06F3/0655 , G06F3/0604 , G06F3/0679 , G06N3/065 , G11C7/1006 , G11C7/16 , G11C11/54 , G11C27/005
Abstract: Numerous embodiments of an array of non-volatile memory cells are disclosed herein. In one example, a system comprises an array of non-volatile memory cells arranged into rows and columns; wherein in a first mode, the array stores digital data; and wherein in a second mode, the array stores analog data.
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公开(公告)号:US12020762B2
公开(公告)日:2024-06-25
申请号:US17576754
申请日:2022-01-14
Applicant: Silicon Storage Technology, Inc.
Inventor: Yuri Tkachev , Jinho Kim , Cynthia Fung , Gilles Festes , Bernard Bertello , Parviz Ghazavi , Bruno Villard , Jean Francois Thiery , Catherine Decobert , Serguei Jourba , Fan Luo , Latt Tee , Nhan Do
IPC: G11C29/50
CPC classification number: G11C29/50004 , G11C2029/5006
Abstract: A method of testing non-volatile memory cells formed on a die includes erasing the memory cells and performing a first read operation to determine a lowest read current RC1 for the memory cells and a first number N1 of the memory cells having the lowest read current RC1. A second read operation is performed to determine a second number N2 of the memory cells having a read current not exceeding a target read current RC2. The target read current RC2 is equal to the lowest read current RC1 plus a predetermined current value. The die is determined to be acceptable if the second number N2 is determined to exceed the first number N1 plus a predetermined number. The die is determined to be defective if the second number N2 is determined not to exceed the first number N1 plus the predetermined number.
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110.
公开(公告)号:US11989440B2
公开(公告)日:2024-05-21
申请号:US17519241
申请日:2021-11-04
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran
CPC classification number: G06F3/0655 , G06F3/0604 , G06F3/0679 , G06N3/065 , G11C7/1006 , G11C7/16 , G11C11/54 , G11C27/005
Abstract: Numerous embodiments of a hybrid memory system are disclosed. The hybrid memory can store weight data in an array in analog form when used in an analog neural memory system or in digital form when used in a digital neural memory system. Input circuitry and output circuitry are capable of supporting both forms of weight data.
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