公开(公告)号：USRE40137E1

公开(公告)日：2008-03-04

申请号：US10734072

申请日：2003-12-10

申请人： Mark E. Tuttle ,  Rickie C. Lake

发明人： Mark E. Tuttle ,  Rickie C. Lake

IPC分类号： H01L21/00

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/15165 ,  Y10T29/49155

摘要： The invention includes methods for forming integrated circuits within substrates, and embedded circuits. In one aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a recess in a substrate; b) printing an antenna within the recess; and c) providing an integrated circuit chip and a battery in electrical connection with the antenna. In another aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a substrate having a first recess and a second recess formed therein; b) printing a conductive film between the first and second recesses and within the first and second recesses, the conductive film forming electrical interconnects between and within the first and second recesses; c) providing a first electrical component within the first recess and in electrical connection with the electrical interconnets therein; d) providing a second electrical component within the second recess and in electrical connection with the electrical interconnects therein; and e) covering the first electrical component, the second electrical component and the conductive film with at least one protective cover. In another aspect, the invention includes an embedded circuit comprising: a) a substrate having a recess therein, the recess having a bottom surface and a sidewall surface joined to the bottom surface; b) interconnect circuitry formed on the bottom and sidewall surfaces; and c) an integrated circuit chip within the recess and operatively connected to the interconnect circuitry.Method of forming a radio frequency identification (RFID) device. In one embodiment, a recess is provided in a plastic substrate containing an integrated circuit comprising RFID circuitry. A conductive material extends over a sidewall of the recess and is coupled to the integrated circuit in a first region and to an antenna in a second region. A flexible film may be disposed over the recess, the integrated circuit, and the conductive material.

公开(公告)号：US07282433B2

公开(公告)日：2007-10-16

申请号：US11032975

申请日：2005-01-10

申请人： Sanh D. Tang ,  Mark E. Tuttle ,  Keith R. Cook

发明人： Sanh D. Tang ,  Mark E. Tuttle ,  Keith R. Cook

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04073 ,  H01L2224/05018 ,  H01L2224/05026 ,  H01L2224/05082 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0496 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/04941 ,  H01L2224/05552

摘要： Microelectronic workpieces that have bump sites over bond-pads and methods of fabricating such bump sites. One embodiment of such a workpiece, for example, includes a substrate having a plurality of microelectronic dies comprising integrated circuitry and bond-pads, such as copper bond-pads, electrically coupled to the integrated circuitry. The workpiece further includes (a) a dielectric structure having a plurality of openings with sidewalls projecting from corresponding bond-pads, and (b) a plurality of caps over corresponding bond-pads. The individual caps can include a discrete portion of a barrier layer attached to the bond-pads and the sidewalls of the openings, and a discrete portion of a cap layer on the barrier layer. The caps are electrically isolated from each other and self-aligned with corresponding bond-pads without forming a mask layer over the cap layer.

摘要翻译： 在焊盘上具有凸起部位的微电子工件以及制造这种凹凸点的方法。 例如，这种工件的一个实施例包括具有多个微电子管芯的衬底，该多个微电子管芯包括集成电路和电耦合到集成电路的接合焊盘，例如铜接合焊盘。 工件还包括（a）具有多个开口的电介质结构，其中侧壁从相应的接合焊盘突出，以及（b）在相应的接合焊盘上的多个盖。 各个盖可以包括附着到接合焊盘和开口的侧壁的阻挡层的分立部分，以及阻挡层上的覆盖层的离散部分。 盖子彼此电隔离并且与相应的接合焊盘自对准，而不在盖层上形成掩模层。

公开(公告)号：US07176065B2

公开(公告)日：2007-02-13

申请号：US11123916

申请日：2005-05-06

申请人： Mirmajid Seyyedy ,  Mark E. Tuttle ,  Glen E. Hush

发明人： Mirmajid Seyyedy ,  Mark E. Tuttle ,  Glen E. Hush

IPC分类号： H01L21/82

CPC分类号： H01L27/222 ,  G11C11/005 ,  G11C11/15 ,  G11C17/16 ,  G11C17/165 ,  H01L23/5252 ,  H01L2924/0002 ,  H01L2924/00

摘要： An MRAM device having a plurality of MRAM cells formed of a fixed magnetic layer, a second soft magnetic layer and a dielectric layer interposed between the fixed magnetic layer and the soft magnetic layer. The MRAM cells are all formed simultaneously and at least some of the MRAM cells are designed to function as antifuse devices whereby the application of a selected electrical potential can short the antifuse device to thereby affect the functionality of the MRAM device.

摘要翻译： 具有由固定磁性层形成的多个MRAM单元的MRAM器件，第二软磁性层和介于该固定磁性层与软磁性层之间的电介质层。 MRAM单元都是同时形成的，并且至少一些MRAM单元被设计为用作反熔丝器件，由此施加所选择的电位可以使反熔丝器件短路从而影响MRAM器件的功能。

公开(公告)号：US06919613B2

公开(公告)日：2005-07-19

申请号：US10820415

申请日：2004-04-08

申请人： Mirmajid Seyyedy ,  Mark E. Tuttle ,  Glen E. Hush

发明人： Mirmajid Seyyedy ,  Mark E. Tuttle ,  Glen E. Hush

IPC分类号： G11C11/15 ,  G11C17/16 ,  H01L29/00

CPC分类号： H01L27/222 ,  G11C11/005 ,  G11C11/15 ,  G11C17/16 ,  G11C17/165 ,  H01L23/5252 ,  H01L2924/0002 ,  H01L2924/00

摘要： An MRAM device having a plurality of MRAM cells formed of a fixed magnetic layer, a second soft magnetic layer and a dielectric layer interposed between the fixed magnetic layer and the soft magnetic layer. The MRAM cells are all formed simultaneously and at least some of the MRAM cells are designed to function as antifuse devices whereby the application of a selected electrical potential can short the antifuse device to thereby affect the functionality of the MRAM device.

摘要翻译： 具有由固定磁性层形成的多个MRAM单元的MRAM器件，第二软磁性层和介于该固定磁性层与软磁性层之间的电介质层。 MRAM单元都是同时形成的，并且至少一些MRAM单元被设计为用作反熔丝器件，由此施加所选择的电位可以使反熔丝器件短路从而影响MRAM器件的功能。

公开(公告)号：US06768415B1

公开(公告)日：2004-07-27

申请号：US08943889

申请日：1997-10-03

申请人： Mark E. Tuttle

发明人： Mark E. Tuttle

IPC分类号： H04Q522

CPC分类号： G06K19/0716 ,  G06K19/0723 ,  G06K19/07345 ,  G06K19/07749 ,  H01H2231/05

摘要： A wireless identification device including a housing; circuitry in the housing configured to provide a signal to identify the device in response to an interrogation signal; and a selectively actuated switch supported by the housing and controlling whether the circuitry identifies the device. A method of manufacturing a wireless identification device, the method comprising configuring circuitry to provide a signal to identify the device in response to an interrogation signal; coupling the circuitry to, a push-on/push-off switch supported by the housing and controlling whether the circuitry provides the signal to identify the device; and encasing the circuitry in a housing such that the switch is actuable from outside the housing by touching a portion of the housing.

摘要翻译： 一种无线识别装置，包括壳体; 外壳中的电路被配置为响应于询问信号提供信号以识别设备; 以及由壳体支撑的选择性致动的开关，并且控制电路是否识别该装置。 一种制造无线识别装置的方法，所述方法包括配置电路以响应于询问信号提供信号以识别所述装置; 将电路耦合到由壳体支撑的推/推/关闭开关，并控制电路是否提供信号以识别装置; 并且将电路封装在壳体中，使得开关可以通过触摸壳体的一部分从壳体外部致动。

公开(公告)号：US06548207B1

公开(公告)日：2003-04-15

申请号：US09521090

申请日：2000-03-07

申请人： Mark E. Tuttle

发明人： Mark E. Tuttle

IPC分类号： H01M642

CPC分类号： H01M2/1066 ,  H01M2/1044 ,  H01M2/204 ,  H01M6/42 ,  H02J7/0024 ,  H04B1/3883 ,  H05K3/321 ,  H05K2201/10037 ,  H05K2201/10515 ,  H05K2201/10643 ,  Y10T29/49108 ,  Y10T29/49114

摘要： Thin-profile battery circuits and constructions, and in particular button-type battery circuits and constructions and methods of forming the same are described. In one implementation, a substrate is provided having an outer surface with a pair of spaced electrical contact pads thereon. At least two thin-profile batteries are conductively bonded together in a stack having a lowermost battery and an uppermost battery. The batteries include respective positive and negative terminals. The lowermost battery has one of its positive or negative terminals adhesively bonded to one of the pair of electrical contact pads while the uppermost battery has one of its positive or negative terminals electrically connected to the other of the pair of electrical contact pads. The batteries can be provided into parallel or series electrical connections.

摘要翻译： 描述了薄型电池电路和结构，特别是按钮式电池电路及其构成及其形成方法。 在一个实施方案中，提供了具有外表面的衬底，其上具有一对间隔的电接触焊盘。 至少两个薄型电池在具有最低电池和最上面的电池的堆叠中导电地结合在一起。 电池包括相应的正极和负极。 最下面的电池具有一个正极或负极端子，其粘合地粘合到一对电接触焊盘中的一个，而最上面的电池具有与该对电接触焊盘中的另一个电连接的正或负端子中的一个。 电池可以并联或串联电连接。

公开(公告)号：US06515591B2

公开(公告)日：2003-02-04

申请号：US09754857

申请日：2001-01-04

申请人： Rickie C. Lake ,  Mark E. Tuttle

发明人： Rickie C. Lake ,  Mark E. Tuttle

IPC分类号： G08B2300

CPC分类号： A01M1/026 ,  A01M2200/011 ,  G08B23/00 ,  Y10T29/49117

摘要： The invention encompasses an electrical apparatus. Such apparatus includes RFID circuitry on a first substrate, and sensor circuitry on a second substrate. A receiving structure is associated with one of the RFID circuitry and the sensor circuitry, and at least one connecting structure is associated with the other of the RFID circuitry and the sensor circuitry. The at least one connecting structure is removable received within the receiving structure. The invention also encompasses a method of forming an electrical apparatus. A first substrate and a second substrate are provided. The first substrate has RFID circuitry thereon, and the second substrate has sensing circuitry thereon. A receptacle is joined with one of the RFID circuitry and the sensor circuitry, and has at least one orifice extending therein. At least one prong is joined with the other of the RFID circuitry and the sensor circuitry. The prong is removably inserted within the receptacle to electrically connect the RFID circuitry with the sensing circuitry.

摘要翻译： 本发明包括电气设备。 这种装置包括在第一基板上的RFID电路和在第二基板上的传感器电路。 接收结构与RFID电路和传感器电路中的一个相关联，并且至少一个连接结构与RFID电路和传感器电路中的另一个相关联。 所述至少一个连接结构可移除地容纳在所述接收结构内。 本发明还包括形成电气设备的方法。 提供第一基板和第二基板。 第一衬底在其上具有RFID电路，并且第二衬底在其上具有感测电路。 容器与RFID电路和传感器电路中的一个连接，并且在其中延伸有至少一个孔。 至少一个插脚与RFID电路和传感器电路中的另一个连接。 插脚可拆卸地插入插座中以将RFID电路与感测电路电连接。

公开(公告)号：US06458234B1

公开(公告)日：2002-10-01

申请号：US09421626

申请日：1999-10-19

申请人： Rickie C. Lake ,  Mark E. Tuttle ,  Joseph P. Mousseau ,  Clay L. Cirino

发明人： Rickie C. Lake ,  Mark E. Tuttle ,  Joseph P. Mousseau ,  Clay L. Cirino

IPC分类号： B32B3100

CPC分类号： H05K3/007 ,  H05K1/0393 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/0278 ,  Y10S156/922 ,  Y10T156/11

摘要： Methods of fixturing a flexible circuit substrate to a processing carrier are disclosed. In one implementation, the flexible circuit substrate and, processing carrier are attached with an adhesive film provided therebetween. The adhesive film comprises acrylic, silicone or a silicone acrylic blend in a preferred embodiment of the present invention. Ideally, substantially the total surface area of a first surface of the flexible circuit substrate is attached to the processing carrier. The flexible circuit substrate is removed from the adhesive film following processing thereof. In a preferred embodiment of the present invention, the adhesive film is monolithic. An electrical component is attached to the flexible circuit substrate and the flexible circuit substrate is encapsulated in accordance with one implementation of the present invention.

摘要翻译： 公开了将柔性电路基板固定到处理载体的方法。 在一个实施方式中，柔性电路基板和处理载体附接有设置在其间的粘合膜。 在本发明的优选实施方案中，粘合剂膜包括丙烯酸，硅树脂或硅氧烷丙烯酸共混物。 理想地，柔性电路基板的第一表面的总表面积基本上附着在处理载体上。 柔性电路基板在其处理之后从粘合膜移除。 在本发明的优选实施方案中，粘合剂膜是整体的。 根据本发明的一个实施方式，将电气部件附接到柔性电路基板并且柔性电路基板被封装。

公开(公告)号：US06392545B2

公开(公告)日：2002-05-21

申请号：US09733275

申请日：2000-12-07

申请人： Rickie C. Lake ,  Mark E. Tuttle

发明人： Rickie C. Lake ,  Mark E. Tuttle

IPC分类号： G08B1314

CPC分类号： A01M1/026 ,  A01M2200/011 ,  Y10S428/901 ,  Y10T29/49117

摘要： The invention encompasses an electrical apparatus. Such apparatus comprises a first substrate having first circuitry thereon. The first circuitry has a terminal extending therefrom, and the terminal defines a first electrical node. The apparatus further comprises a first dielectric material covering a predominate portion of the first circuitry and not covering the first electrical node. Additionally, the apparatus comprises a second substrate having second circuitry thereon. The second circuitry has a terminal extending therefrom, and such terminal defines a second electrical node. A second dielectric material covers a predominate portion of the second circuitry, but does not cover the second electrical node. The second substrate comprises a different material than the first substrate. A portion of the second substrate is over a portion of the first substrate to define an overlap between the first and second substrates. The second electrical node overlaps the first electrical node in the overlap between the first and second substrates. A conductive material is within the overlap between the first and second substrates and electrically bonds the first and second electrical nodes to one another. The invention also encompasses termite sensing devices, methods of forming electrical apparatuses, and methods of sensing termites.

摘要翻译： 本发明包括电气设备。 这种设备包括其上具有第一电路的第一衬底。 第一电路具有从其延伸的端子，并且端子限定第一电节点。 该装置还包括覆盖第一电路的主要部分并且不覆盖第一电节点的第一电介质材料。 另外，该装置包括其上具有第二电路的第二基板。 第二电路具有从其延伸的端子，并且这种端子限定第二电节点。 第二电介质材料覆盖第二电路的主要部分，但不覆盖第二电节点。 第二基板包括与第一基板不同的材料。 第二衬底的一部分在第一衬底的一部分之上，以限定第一和第二衬底之间的重叠。 第二电节点在第一和第二基板之间的重叠处与第一电节点重叠。 导电材料在第一和第二基板之间的重叠之内，并且将第一和第二电节点彼此电连接。 本发明还包括白蚁感测装置，形成电气设备的方法以及感测白蚁的方法。

公开(公告)号：US06268078B1

公开(公告)日：2001-07-31

申请号：US09459226

申请日：1999-12-10

申请人： Mark E. Tuttle

发明人： Mark E. Tuttle

IPC分类号： H01M642

CPC分类号： H01M2/1066 ,  H01M2/1044 ,  H01M2/204 ,  H01M6/42 ,  H02J7/0024 ,  H04B1/3883 ,  H05K3/321 ,  H05K2201/10037 ,  H05K2201/10515 ,  H05K2201/10643 ,  Y10T29/49108 ,  Y10T29/49114

摘要： Thin-profile battery circuits and constructions, and in particular button-type battery circuits and constructions and methods of forming the same are described. In one implementation, a substrate is provided having an outer surface with a pair of spaced electrical contact pads thereon. At least two thin-profile batteries are conductively bonded together in a stack having a lowermost battery and an uppermost battery. The batteries include respective positive and negative terminals. The lowermost battery has one of its positive or negative terminals adhesively bonded to one of the pair of electrical contact pads while the uppermost battery has one of its positive or negative terminals electrically connected to the other of the pair of electrical contact pads. The batteries can be provided into parallel or series electrical connections.

摘要翻译： 描述了薄型电池电路和结构，特别是按钮式电池电路及其构成及其形成方法。 在一个实施方案中，提供了具有外表面的衬底，其上具有一对间隔的电接触焊盘。 至少两个薄型电池在具有最低电池和最上面的电池的堆叠中导电地结合在一起。 电池包括相应的正极和负极。 最下面的电池具有一个正极或负极端子，其粘合地粘合到一对电接触焊盘中的一个，而最上面的电池具有与该对电接触焊盘中的另一个电连接的正或负端子中的一个。 电池可以并联或串联电连接。