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    SPACER-LESS TRANSISTOR INTEGRATION SCHEME FOR HIGH-K GATE DIELECTRICS AND SMALL GATE-TO-GATE SPACES APPLICABLE TO SI, SIGE AND STRAINED SILICON SCHEMES
    103.
    发明申请
    SPACER-LESS TRANSISTOR INTEGRATION SCHEME FOR HIGH-K GATE DIELECTRICS AND SMALL GATE-TO-GATE SPACES APPLICABLE TO SI, SIGE AND STRAINED SILICON SCHEMES 有权
    适用于SI，信号和应变硅计划的高K栅介质和小门到门空间的间隔不足的晶体管集成方案

    公开(公告)号：US20080102583A1

    公开(公告)日：2008-05-01

    申请号：US11960554

    申请日：2007-12-19

    申请人： David Pritchard ,  Hemanshu Bhatt ,  David Price

    发明人： David Pritchard ,  Hemanshu Bhatt ,  David Price

    IPC分类号： H01L21/336

    CPC分类号： H01L29/517 ,  H01L21/823807 ,  H01L21/823828 ,  H01L29/4958 ,  H01L29/665 ,  H01L29/66606

    摘要： A transistor integration process provides a damascene method for the formation of gate electrodes and gate dielectric layers. An interlayer-dielectric film is deposited prior to the gate electrode formation to avoid the demanding gap fill requirements presented by adjacent gates. A trench is formed in the interlayer-dielectric film followed by the deposition of the gate material in the trench. This process avoids the potential for damage to high-k gate dielectric layers caused by high thermal cycles and also reduces or eliminates the problematic formation of voids in the dielectric layers filling the gaps between adjacent gates.

    摘要翻译： 晶体管积分过程提供了用于形成栅极电极和栅极电介质层的镶嵌方法。 在栅电极形成之前沉积层间绝缘膜，以避免由相邻栅极呈现的苛刻的间隙填充要求。 在层间电介质膜中形成沟槽，随后在沟槽中沉积栅极材料。 该过程避免了由高热循环引起的对高k栅极电介质层的损坏的可能性，并且还减少或消除填充相邻栅极之间的间隙的电介质层中空隙的有问题的形成。

    METHOD AND APPARATUS FOR AUTOMATED MANUFACTURE OF A PROBE TIP
    106.
    发明申请
    METHOD AND APPARATUS FOR AUTOMATED MANUFACTURE OF A PROBE TIP 有权
    一种探针自动制作的方法与装置

    公开(公告)号：US20050206369A1

    公开(公告)日：2005-09-22

    申请号：US10708690

    申请日：2004-03-18

    申请人： Stephen Sufka ,  Thane Tahti ,  David Price ,  Steven Roy ,  Kristoffer Wickstead

    发明人： Stephen Sufka ,  Thane Tahti ,  David Price ,  Steven Roy ,  Kristoffer Wickstead

    IPC分类号： G01P3/46 ,  G01P3/52 ,  G01P15/125 ,  G01V5/00

    CPC分类号： G01P15/125 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/4902 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/5313 ,  Y10T29/53213

    摘要： A method and apparatus for attaching a proximity probe offset to an axis defining an extension cable. The method and apparatus include a sensing element; a cylindrical part molded with a moldable material; a recess configured in one of two opposing ends defining the cylindrical part to receive the sensing element; a first and a second ferrule each extending from opposing surfaces defining an exterior of the cylindrical part, a first axis defining the first and second ferrules being offset from a second axis defining the cylindrical part; and an extension cable operably attached to the sensing element via the first and second ferrules, the sensing element being disposed offset relative to the extension cable.

    摘要翻译： 一种用于将接近探头偏置附接到限定延伸电缆的轴线的方法和装置。 该方法和装置包括感测元件; 用可模制材料模制的圆柱形部件; 一个凹槽，其被配置在两个相对端之一中，限定所述圆柱形部分以接纳感测元件; 第一和第二套圈，每个从限定所述圆柱形部件的外部的相对表面延伸;限定所述第一和第二套圈的第一轴线与限定所述圆柱形部件的第二轴线偏移; 以及延伸电缆，其经由所述第一和第二套圈可操作地附接到所述感测元件，所述感测元件相对于所述延伸电缆偏置设置。

    METHOD AND APPARATUS FOR ATTACHMENT OF A PROBE TIP
    107.
    发明申请
    METHOD AND APPARATUS FOR ATTACHMENT OF A PROBE TIP 审中-公开
    用于连接探测器的方法和装置

    公开(公告)号：US20050204534A1

    公开(公告)日：2005-09-22

    申请号：US10708692

    申请日：2004-03-18

    申请人： Peter Bellis ,  Stephen Sufka ,  Thane Tahti ,  David Price

    发明人： Peter Bellis ,  Stephen Sufka ,  Thane Tahti ,  David Price

    IPC分类号： H01J3/14

    CPC分类号： G01H1/003 ,  G01D11/245 ,  G01D11/30 ,  Y10T29/49826

    摘要： A method and apparatus for attaching a proximity probe offset to an axis defining a metal probe case and an extension cable extending therefrom. The method and apparatus include a metal interface cup securing the proximity probe therewith; and a metal probe case configured with a first bore extending from one side toward an axis defining a length of the metal probe case. The bore is configured to accept the metal interface cup while leaving a tip of the proximity probe exposed. A bottom surface defining the metal interface cup opposite the tip mates with a first surface defining a closed end of the first bore. The metal probe case is further configured with a second bore extending from a substantially opposite side of the one side. The second bore extends perpendicular from a surface defining the opposite side, wherein only a portion of the second bore intersects the first surface of said first bore creating a through hole into the first bore. When the metal interface cup is disposed in the first bore, the through hole is covered and includes a fusion at an interface between two exposed mating surfaces defining the cup and second bore, thus securing the cup with the case. The fusion includes a fusion process with or without addition of a binder material.

    摘要翻译： 一种用于将邻近探测器偏置附接到限定金属探测器壳体的轴线和从其延伸的延伸电缆的方法和装置。 该方法和装置包括：金属接口杯，用于将接近探头固定在其上; 以及金属探针壳体，其配置有从一侧朝向限定金属探针壳体的长度的轴线延伸的第一孔。 孔被配置为接受金属界面杯，同时使接近探头的尖端暴露。 限定与顶部相对的金属界面杯的底表面与限定第一孔的封闭端的第一表面配合。 金属探针外壳进一步配置有从一侧的大致相对侧延伸的第二孔。 第二孔从限定相对侧的表面垂直延伸，其中仅第二孔的一部分与所述第一孔的第一表面相交，形成通孔进入第一孔。 当金属界面杯设置在第一孔中时，通孔被覆盖并且包括在限定杯和第二孔的两个暴露的匹配表面之间的界面处的熔合，从而将杯固定在壳体上。 融合包括具有或不添加粘合剂材料的熔合过程。

    Method for determining concentrations of additives in acid copper electrochemical deposition baths
    108.
    发明授权
    Method for determining concentrations of additives in acid copper electrochemical deposition baths 有权
    确定酸性铜电化学沉积池中添加剂浓度的方法

    公开(公告)号：US06709568B2

    公开(公告)日：2004-03-23

    申请号：US10064125

    申请日：2002-06-13

    申请人： Jianwen Han ,  Ronni M. Etterman ,  Peter M. Robertson ,  Richard Bhella ,  David Price

    发明人： Jianwen Han ,  Ronni M. Etterman ,  Peter M. Robertson ,  Richard Bhella ,  David Price

    IPC分类号： G01N2742

    CPC分类号： G01N27/4161 ,  G01N27/42

    摘要： The present invention relates to a method for determining concentration of brightener and leveler contained in an aqueous acid metal electroplating solution, by firstly determining the concentration of the brightener at a first set of measurement conditions, and secondly determining the concentration of the leveler at a second set of measurement conditions, provided that the first set of measurement conditions differ from the second set of measurement conditions on the rotation speed of a rotating disc electrode used for measuring plating potential of said aqueous acid metal electroplating solution, and optionally, the electroplating duration at which the plating potential of said aqueous acid metal electroplating solution is measured, provided that the first rotation speed is lower than the second rotation speed, and that the first electroplating duration is shorter than the second electroplating duration.

    摘要翻译： 本发明涉及一种通过首先在第一组测量条件下确定增白剂的浓度来确定含酸的酸性金属电镀溶液中所含的增白剂和矫正剂的浓度的方法，其次在第二次测定矫光器的浓​​度 条件是第一组测量条件与第二组测量条件不同，所述第二组测量条件对于用于测量所述酸性金属电镀水溶液的电镀电位的旋转盘电极的旋转速度，以及可选地，电镀持续时间在 测量所述含水酸性金属电镀溶液的电镀电位，条件是所述第一转速低于所述第二转速，并且所述第一电镀持续时间短于所述第二电镀持续时间。