-
公开(公告)号：US20150187996A1
公开(公告)日：2015-07-02
申请号：US14645227
申请日：2015-03-11
Applicant: Seoul Viosys Co., Ltd.
Inventor： Won Cheol Seo , Dae Sung Cho , Kyung Hee Ye , Kyoung Wan Kim , Yeo Jin Yoon
CPC classification number: H01L33/387 , H01L33/08 , H01L33/20 , H01L33/32 , H01L33/38 , H01L33/385 , H01L33/42 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2924/00
Abstract: A substrate, a first conductive type semiconductor layer arranged on the substrate, a second conductive type semiconductor layer arranged on the first conductive type semiconductor layer, an active layer disposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer, a first electrode pad electrically connected to the first conductive type semiconductor layer, a second electrode pad arranged on the second conductive type semiconductor layer, an insulation layer disposed between the second conductive type semiconductor layer and the second electrode pad, and at least one upper extension electrically connected to the second electrode pad, the at least one upper extension being electrically connected to the second conductive type semiconductor layer.
Abstract translation: 衬底，布置在衬底上的第一导电类型半导体层，布置在第一导电类型半导体层上的第二导电类型半导体层，设置在第一导电类型半导体层和第二导电类型半导体层之间的有源层，第一导电类型半导体层 电连接到第一导电型半导体层的电极焊盘，布置在第二导电类型半导体层上的第二电极焊盘，设置在第二导电类型半导体层和第二电极焊盘之间的绝缘层，以及至少一个电连接 到所述第二电极焊盘，所述至少一个上延伸部电连接到所述第二导电型半导体层。
-
公开(公告)号：US20150179879A1
公开(公告)日：2015-06-25
申请号：US14641221
申请日：2015-03-06
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jeong Hee Yang , Kyoung Wan Kim , Yeo Jin Yoon , Jae Moo Kim , Keum Ju Lee
CPC classification number: H01L33/08 , H01L33/007 , H01L33/10 , H01L33/20 , H01L33/24 , H01L33/38 , H01L33/42 , H01L33/46 , H05B33/06
Abstract: Disclosed is a light emitting diode (LED) having improved light extraction efficiency. The LED includes a light emitting structure positioned on a substrate and having a first semiconductor layer, an active layer and a second semiconductor layer. A first electrode pad is electrically connected to the first semiconductor layer. A second electrode pad is positioned on the substrate. An insulating reflective layer covers a portion of the light emitting structure, and is positioned under the second electrode pad, so that the second electrode pad is spaced apart from the light emitting structure. At least one upper extension is connected to the second electrode pad to be electrically connected to the second semiconductor layer. Further, a pattern of light extraction elements is positioned on the second semiconductor layer.
Abstract translation: 公开了具有改进的光提取效率的发光二极管（LED）。 LED包括位于衬底上并具有第一半导体层，有源层和第二半导体层的发光结构。 第一电极焊盘电连接到第一半导体层。 第二电极焊盘位于衬底上。 绝缘反射层覆盖发光结构的一部分，并且位于第二电极焊盘下方，使得第二电极焊盘与发光结构间隔开。 至少一个上延伸部连接到第二电极焊盘以与第二半导体层电连接。 此外，光提取元件的图案位于第二半导体层上。
-
公开(公告)号：US20150144981A1
公开(公告)日：2015-05-28
申请号：US14608150
申请日：2015-01-28
Applicant: Seoul Viosys Co., Ltd.
Inventor： Duk Il Suh , Jae Moo Kim , Kyoung Wan Kim , Yeo Jin Yoon , Ye Seul Kim , Sang Hyun Oh , Jin Woong Lee
CPC classification number: H01L33/46 , H01L33/10 , H01L33/38 , H01L33/42 , H01L33/50 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
Abstract: A light-emitting diode (LED) according to an exemplary embodiment includes a light-emitting structure arranged on a first surface of a substrate, the light-emitting structure including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. A first distributed Bragg reflector is arranged on a second surface of the substrate opposite to the first surface, the first distributed Bragg reflector to reflect light emitted from the light-emitting structure. The first distributed Bragg reflector has a reflectivity of at least 90% with respect to blue, green, and red light.
Abstract translation: 根据示例性实施例的发光二极管（LED）包括布置在基板的第一表面上的发光结构，所述发光结构包括第一导电类型半导体层，第二导电类型半导体层， 以及插入在第一导电型半导体层和第二导电型半导体层之间的有源层。 第一分布式布拉格反射器布置在基板的与第一表面相对的第二表面上，第一分布布拉格反射器用于反射从发光结构发射的光。 第一分布布拉格反射器相对于蓝色，绿色和红色光具有至少90％的反射率。
-
公开(公告)号：US20140110729A1
公开(公告)日：2014-04-24
申请号：US14138917
申请日：2013-12-23
Applicant: Seoul Viosys Co., Ltd.
Inventor： Won Cheol Seo , Joon Hee Lee , Jong Kyun You , Chang Youn Kim , Jin Cheol Shin , Hwa Mok Kim , Jang Woo Lee , Yeo Jin Yoon , Jong Kyu Kim
IPC: H01L33/62
CPC classification number: H01L33/60 , H01L25/0753 , H01L27/156 , H01L33/007 , H01L33/0079 , H01L33/06 , H01L33/22 , H01L33/32 , H01L33/46 , H01L33/62 , H01L2924/0002 , H01L2933/0058 , H01L2933/0066 , H01L2924/00
Abstract: Disclosed are a light emitting device and a method of fabricating the same. The light emitting device comprises a substrate. A plurality of light emitting cells are disposed on top of the substrate to be spaced apart from one another. Each of the light emitting cells comprises a first upper semiconductor layer, an active layer, and a second lower semiconductor layer. Reflective metal layers are positioned between the substrate and the light emitting cells. The reflective metal layers are prevented from being exposed to the outside.
Abstract translation: 公开了一种发光器件及其制造方法。 发光器件包括衬底。 多个发光单元设置在基板的顶部上以彼此间隔开。 每个发光单元包括第一上半导体层，有源层和第二下半导体层。 反射金属层位于基板和发光单元之间。 防止反射金属层暴露于外部。
-
公开(公告)号：US11939239B2
公开(公告)日：2024-03-26
申请号：US16604817
申请日：2018-04-13
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jae Young Choi , Woong Ki Jeong , Kyu Won Han , Yeo Jin Yoon
IPC: C02F1/32
CPC classification number: C02F1/325 , C02F2201/322 , C02F2303/04
Abstract: A sterilization module including a light source configured to irradiate ultraviolet light, a board on which the light source is mounted, a protective tube accommodating the board therein and configured to transmit ultraviolet light irradiated from the light source, a first base coupled to one side of the protective tube, and a second base coupled to the other side of the protective tube, in which at least one of the first base and the second base includes an insertion part to be inserted into the protective tube, the insertion part having a first diameter when viewed in a first cross-section perpendicular to a length direction of the protective tube, and a cover part integrally formed on the insertion part and having a second diameter greater than the first diameter in the first cross-section.
-
Patent Agency Ranking
公开(公告)号：US11904062B2
公开(公告)日：2024-02-20
申请号：US18101580
申请日：2023-01-25
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Woong Ki Jeong , Jae Hak Jeong , Si Ho Yu , Byung Chul Joo , Jae Young Choi , Kyu Won Han , Yeo Jin Yoon
CPC classification number: A61L2/10 , A61L2/26 , H01L33/483 , H01L33/56 , A61L2202/122
Abstract: A sterilization module including a main body, a circuit board disposed in the main body, a light source disposed on the circuit board to emit sterilizing light, and a transparent unit to protect the light source from an outside and including a material that transmits the sterilizing light, in which the light source includes a mesa including a first semiconductor layer, an active layer, and a second semiconductor layer, a first electrode electrically connected to the first semiconductor layer, and a second electrode disposed on the second semiconductor layer and electrically connected to the second semiconductor layer, in which the first electrode includes a first contact region disposed on the outer area of the first semiconductor layer and a second contact region at least partially surrounded by the mesa, and a distance between the transparent unit and the circuit board is greater than a height of the light source.
-
公开(公告)号：US11565007B2
公开(公告)日：2023-01-31
申请号：US16628529
申请日：2018-07-06
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Woong Ki Jeong , Jae Hak Jeong , Si Ho Yu , Byung Chul Joo , Jae Young Choi , Kyu Won Han , Yeo Jin Yoon
Abstract: A sterilization module including a main body including an ultraviolet outlet, a transparent member disposed on the ultraviolet outlet to transmit ultraviolet light, and a light source unit irradiating ultraviolet light toward the transparent member, and a sealing member, in which the light source unit includes a circuit board and a light emitting diode chip mounted thereon and including an epitaxial substrate, a conductive semiconductor layer electrically connected to the circuit board directly by an electrode, ultraviolet light is c irradiated toward the transparent member by passing through the epitaxial substrate, the sealing member is disposed between the transparent member and the circuit board, and a distance between the transparent member and the circuit board spaced apart from each other by the sealing member is greater than a height of the light emitting diode chip.
-
108.发明授权公开(公告)号：US11350620B2
公开(公告)日：2022-06-07
申请号：US16128069
申请日：2018-09-11
Applicant: Seoul Viosys Co., Ltd.
Inventor： Mi So Ko , Yeo Jin Yoon
Abstract: An insecticide fumigator including a chemical cartridge mount on which a chemical cartridge is configured to be mounted, a heater disposed near the chemical cartridge mount and configured to heat the chemical cartridge such that an insecticide in the chemical cartridge is evaporated from a fumigation part of the chemical cartridge, a light source disposed near the fumigation part and configured to emit light having a first wavelength range to attract insects, and a housing provided with the chemical cartridge mount and receiving the heater and the light source, in which the light source includes a UV LED and a substrate on which the UV LED is mounted, and the housing has a light passage hole through which light emitted from the light source passes.
-
公开(公告)号：US10438992B2
公开(公告)日：2019-10-08
申请号：US15409306
申请日：2017-01-18
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jong Kyu Kim , So Ra Lee , Yeo Jin Yoon , Jae Kwon Kim , Joon Sup Lee , Min Woo Kang , Se Hee Oh , Hyun A Kim , Hyoung Jin Lim
IPC: H01L21/00 , H01L27/15 , H01L33/08 , H01L33/38 , H01L33/58 , H01L33/60 , H01L33/64 , H01L33/36 , H01L33/62
Abstract: A light-emitting element includes a light-emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first contact electrode and a second contact electrode located on the light-emitting structure, and respectively making ohmic contact with the first conductive semiconductor layer and the second conductive semiconductor layer; an insulation layer for covering a part of the first contact electrode and the second contact electrode so as to insulate the first contact electrode and the second contact electrode; a first electrode pad and a second electrode pad electrically connected to each of the first contact electrode and the second contact electrode; and a radiation pad formed on the insulation layer, and radiating heat generated from the light-emitting structure.
-
公开(公告)号：US10355184B2
公开(公告)日：2019-07-16
申请号：US15758302
申请日：2016-09-07
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jun Yong Park , In Kyu Park , Yeo Jin Yoon
Abstract: A light-emitting diode package comprising: a substrate having one or more first pads, one or more second pads, a first terminal, and a second terminal, which are all formed on the upper surface; a plurality of light-emitting diode chips loaded on the one or more first pads and electrically connected to the first pad and the second pad; and a reflector coupled to an upper part of the substrate and having an opening part through which the plurality of light-emitting diode chips is exposed, wherein the first pad is formed as one body with the substrate, and the first terminal or the second terminal are connected to an external power source and formed to have a predetermined height at the upper surface of the substrate.
-
-
-
-
-
-
-
-
-
Search Results
128
records
(took 0.023 seconds)
