Abstract:
A fixture and method are provided for cooling an IC in the performance of focused beam processes. The method provides a holding/cooling fixture with thermal electric (TE) jaws having an IC interface surface and a heatsink interface. An IC die is secured between the IC interface surfaces of the jaws. Electrical energy is supplied to the TE jaws, creating a negative temperature differential between the IC interface and heatsink interfaces. As a result, the IC die is cooled. A focused beam is applied to a local region of the IC die. Some examples of the focused beam include a focused ion beam (FIB), scanning electron microscope (SEM), E-beam, or a laser scanning microscope (LSM). The focused beam heats the local region of the IC, while the bulk of the IC remains cooled. Typically, each TE jaw includes a plurality of TE elements thermally connected in series.
Abstract:
A method for making transmission electron microscope gird is provided. An array of carbon nanotubes is provided and drawing a carbon nanotube film from the array of carbon nanotubes. A substrate has a plurality of spaced metal girds attached on the substrate. The metal girds are covered with the carbon nanotube film and treating the carbon nanotube film and the metal girds with organic solvent. A transmission electron microscope (TEM) grid is obtained by removing remaining CNT film.
Abstract:
For adjusting a positional relationship between a specimen and a probe to measure an electric characteristic of the specimen through a contact therebetween, a base table holding a specimen table holding the specimen and a probe holder holding the probe is positioned at a first position to measure the positional relationship between the probe and the specimen at the first position, and subsequently positioned at a second position to measure the positional relationship therebetween at the second position so that the probe and the specimen are contact each other at the second position, the specimen table and the probe holder are movable with respect to each other on the base table at each of the first and second positions to adjust the positional relationship between the probe and the specimen, and a measuring accuracy at the second position is superior to a measuring accuracy at the first position.
Abstract:
A specimen fabrication apparatus including: a sample stage to mount or hold a sample substrate, an ion beam irradiating optical system to irradiate the sample substrate with an ion beam, a specimen holder to mount a specimen obtained from the sample substrate, a transferring means including a probe, and a deposition-gas supplying source to supply a deposition-gas for forming a deposition-film between the specimen and the probe.
Abstract:
A specimen fabrication apparatus, including: an ion beam irradiating optical system to irradiate a sample placed in a chamber with an ion beam; a specimen holder to mount a specimen separated by the irradiation with the ion beam; a holder cassette to hold the specimen holder; a sample stage to hold, the sample and the holder cassette; and a probe to move the specimen to the specimen holder, wherein the holder cassette is transferred to outside of the chamber in a condition of holding the specimen holder with the specimen mounted.
Abstract:
An apparatus for temperature control of manufacture of thick film materials includes a stage comprising a planar surface for supporting a bulk material to be implanted and subsequently cleaved. The bulk material has a surface region, a side region, and a bottom region which provides a volume of material and defines a length between the bottom region and the surface region. The apparatus further includes a mechanical clamp device adapted to engage the bottom region to the planar surface of the stage such that the bulk material is in physical contact with the planar surface for thermal energy to transfer through an interface region between the bulk material and the stage while the surface region is substantially exposed. Additionally, the apparatus includes a sensor device configured to measure a temperature value of the surface region and generate an input data. The apparatus further includes an implant device configured to perform implantation of a plurality of particles through one or more portions of the surface region of the bulk material and a controller configured to receive and process the input data to increase and/or decrease the temperature value of the surface region through at least the interface region between the planar surface of the stage and the bottom region of the bulk material.
Abstract:
A substrate cover includes a frame-like member configured to be placed on a substrate which is to be written using a charged particle beam, and to have an outer perimeter dimension larger than a perimeter end of the substrate and an inner perimeter dimension, being a border between the frame-like member and an inner opening portion, smaller than the perimeter end of the substrate, and a contact point part configured to be provided on an undersurface of the frame-like member, in order to be electrically connected to the substrate.
Abstract:
For adjusting a positional relationship between a specimen and a probe to measure an electric characteristic of the specimen through a contact therebetween, a base table holding a specimen table holding the specimen and a probe holder holding the probe is positioned at a first position to measure the positional relationship between the probe and the specimen at the first position, and subsequently positioned at a second position to measure the positional relationship therebetween at the second position so that the probe and the specimen are contact each other at the second position, the specimen table and the probe holder are movable with respect to each other on the base table at each of the first and second positions to adjust the positional relationship between the probe and the specimen, and a measuring accuracy at the second position is superior to a measuring accuracy at the first position.
Abstract:
A method of testing a substrate includes separating the substrate from a larger substrate using a separating device and repositioning the substrate to be tested to a processing station apart from the separating device. The substrate is positioned on a holder for inspection.
Abstract:
A method including, in one embodiment, severing a sample at least partially from a substrate by cutting the substrate with a focused ion beam (FIB), capturing the substrate sample by activating a grasping element, and separating the captured sample from the substrate. The captured sample may be separated from the substrate and transported to an electron microscope for examination.