Integrated Circuit Cooling Apparatus for Focused Beam Processes
    101.
    发明申请
    Integrated Circuit Cooling Apparatus for Focused Beam Processes 审中-公开
    用于聚焦光束处理的集成电路冷却装置

    公开(公告)号:US20090323287A1

    公开(公告)日:2009-12-31

    申请号:US12330376

    申请日:2008-12-08

    Abstract: A fixture and method are provided for cooling an IC in the performance of focused beam processes. The method provides a holding/cooling fixture with thermal electric (TE) jaws having an IC interface surface and a heatsink interface. An IC die is secured between the IC interface surfaces of the jaws. Electrical energy is supplied to the TE jaws, creating a negative temperature differential between the IC interface and heatsink interfaces. As a result, the IC die is cooled. A focused beam is applied to a local region of the IC die. Some examples of the focused beam include a focused ion beam (FIB), scanning electron microscope (SEM), E-beam, or a laser scanning microscope (LSM). The focused beam heats the local region of the IC, while the bulk of the IC remains cooled. Typically, each TE jaw includes a plurality of TE elements thermally connected in series.

    Abstract translation: 提供了一种夹具和方法,用于在聚焦光束过程的执行中冷却IC。 该方法提供具有具有IC接口表面和散热器接口的热电(TE)钳口的保持/冷却固定装置。 IC芯片固定在钳口的IC接口表面之间。 电能供应到TE钳口,在IC接口和散热器接口之间产生负温差。 结果,IC管芯被冷却。 聚焦光束被施加到IC芯片的局部区域。 聚焦光束的一些实例包括聚焦离子束(FIB),扫描电子显微镜(SEM),电子束或激光扫描显微镜(LSM)。 聚焦光束加热IC的局部区域,而大部分IC仍然冷却。 通常,每个TE卡爪包括串联热连接的多个TE元件。

    APPARATUS AND METHOD OF TEMPERATURE CONROL DURING CLEAVING PROCESSES OF THICK FILM MATERIALS
    106.
    发明申请
    APPARATUS AND METHOD OF TEMPERATURE CONROL DURING CLEAVING PROCESSES OF THICK FILM MATERIALS 审中-公开
    厚膜清洗过程中温度条件的装置及方法

    公开(公告)号:US20080188011A1

    公开(公告)日:2008-08-07

    申请号:US12019110

    申请日:2008-01-24

    Abstract: An apparatus for temperature control of manufacture of thick film materials includes a stage comprising a planar surface for supporting a bulk material to be implanted and subsequently cleaved. The bulk material has a surface region, a side region, and a bottom region which provides a volume of material and defines a length between the bottom region and the surface region. The apparatus further includes a mechanical clamp device adapted to engage the bottom region to the planar surface of the stage such that the bulk material is in physical contact with the planar surface for thermal energy to transfer through an interface region between the bulk material and the stage while the surface region is substantially exposed. Additionally, the apparatus includes a sensor device configured to measure a temperature value of the surface region and generate an input data. The apparatus further includes an implant device configured to perform implantation of a plurality of particles through one or more portions of the surface region of the bulk material and a controller configured to receive and process the input data to increase and/or decrease the temperature value of the surface region through at least the interface region between the planar surface of the stage and the bottom region of the bulk material.

    Abstract translation: 用于制造厚膜材料的温度控制装置包括一个平台,该平台用于支撑待植入的大块材料并随后被切割。 本体材料具有表面区域,侧面区域和底部区域,其提供一定体积的材料并限定了底部区域和表面区域之间的长度。 该装置还包括机械夹持装置,其适于将底部区域接合到平台的平面表面,使得散装材料与平面表面物理接触,以使热能通过散装材料和载物台之间的界面区域传递 而表面区域基本上是露出的。 另外,该装置包括被配置为测量表面区域的温度值并生成输入数据的传感器装置。 该装置还包括植入装置,其配置成执行多个粒子通过散装材料的表面区域的一个或多个部分的植入;以及控制器,被配置为接收和处理输入数据以增加和/或降低温度值 所述表面区域至少通过所述平台的平坦表面和所述散装材料的底部区域之间的界面区域。

    SUBSTRATE COVER, AND CHARGED PARTICLE BEAM WRITING APPARATUS AND METHOD
    107.
    发明申请
    SUBSTRATE COVER, AND CHARGED PARTICLE BEAM WRITING APPARATUS AND METHOD 有权
    基板盖和充电颗粒光束写字装置和方法

    公开(公告)号:US20080054195A1

    公开(公告)日:2008-03-06

    申请号:US11838465

    申请日:2007-08-14

    Inventor: Yuichi TACHIKAWA

    Abstract: A substrate cover includes a frame-like member configured to be placed on a substrate which is to be written using a charged particle beam, and to have an outer perimeter dimension larger than a perimeter end of the substrate and an inner perimeter dimension, being a border between the frame-like member and an inner opening portion, smaller than the perimeter end of the substrate, and a contact point part configured to be provided on an undersurface of the frame-like member, in order to be electrically connected to the substrate.

    Abstract translation: 衬底盖包括框架状构件,其被配置为放置在要使用带电粒子束书写的衬底上,并且具有大于衬底的周边端部的外周尺寸和内周尺寸,其为 框架状构件和内部开口部分之间的边界,小于基板的周边端部,以及构造成设置在框架构件的下表面上的接触点部件,以便电连接到基板 。

    Sample preparation technique
    109.
    发明申请
    Sample preparation technique 审中-公开
    样品制备技术

    公开(公告)号:US20070278421A1

    公开(公告)日:2007-12-06

    申请号:US11789298

    申请日:2007-04-23

    Applicant: K. Gleason

    Inventor: K. Gleason

    Abstract: A method of testing a substrate includes separating the substrate from a larger substrate using a separating device and repositioning the substrate to be tested to a processing station apart from the separating device. The substrate is positioned on a holder for inspection.

    Abstract translation: 测试基板的方法包括使用分离装置将基板与较大的基板分离,并将待测试的基板重新定位到与分离装置分开的处理台。 基板定位在支架上用于检查。

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