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209 条记录 (耗时 0.02 秒)

    Method of laying up plywood panels
    101.
    发明授权
    Method of laying up plywood panels 失效
    铺设绒面板的方法

    公开(公告)号：US3690979A

    公开(公告)日：1972-09-12

    申请号：US3690979D

    申请日：1969-11-18

    申请人： SIMPSON TIMBER CO

    发明人： JARVI REINO A

    IPC分类号： B27D1/04 ,  B32B31/06 ,  B32B31/14

    CPC分类号： B27D1/04 ,  Y10T428/31989

    摘要： PLYWOOD PANELS OF FIVE OR MORE PLIES ARE LAYED UP BY COATING THE OUTER PILES, I.E. THE FACE AND BACK PLIES, ON ONE SIDE WITH A LONG FLOW PHENOLIC ADHESIVE, LAYING ONE PIECE CROSS BAND VENEERS OVER EACH OT THE ADHESIVE COATED VENEERS TO FORM A SERIES OF TWO PLY SANDWICHES, COATING A SHEET OF CENTER VENEER ON BOTH SIDES WITH A FAST CURING ADHESIVE RELATIVE TO THE CURING TIME OF THE LONG FLOW ADHESIVE, LAYING THE ADHESIVE COATED CENTER VENEER OVER THE UNCOATED CROSS BAND SHEET OF VENEER OF ONE OF THE TWO-PLY STRUCTURES AND LAYING A SECOND TWO-PLY STRUCTURE OVER THE ADHESIVE COATED CENTER, THE CROSS BAND OF THE SECOND TWOPLY SANDWICH CONTACTING THE ADHESIVE COATED CENTER PLY.

    Manufacture of fluid logic components for fluidic circuits
    103.
    发明授权
    Manufacture of fluid logic components for fluidic circuits 失效
    流体电路流体逻辑元件的制造

    公开(公告)号：US3676238A

    公开(公告)日：1972-07-11

    申请号：US3676238D

    申请日：1969-12-29

    申请人： WESTLAND AIRCRAFT LTD

    发明人： FURLONG OWEN DESMOND ARTHUR CH ,  BOTTRELL NEIL L

    IPC分类号： F15C1/06 ,  B32B31/14

    CPC分类号： F15C1/06 ,  Y10T156/1056

    摘要： FLUID LOGIC COMPONENTS FOR FLUIDIC CIRCUITS ARE PRODUCED BY FIRST PRODUCING A MASTER DESIGN OR TEMPLET, CASTING A MOLD TO PROVIDE A PATTERN OF THE MASTER DESIGN OR TEMPLET, AND CASTING FROM THE MOLD A UNIT HAVING CAVITIES OR DUCTS CORRESPONDING TO THE DUCT SYSTEM REQUIRED IN THE LOGIC ELEMENTS. THE CAVITIES AND/OR DUCTS ARE POSITIVELY SEALED AND ENCLOSED BY SEALING OR FUSSING A COVER OVER THE DUCT SYSTEM. THE UNIT HAVING THE CAVITIES AND DUCTS PREFERABLY IS FORMED OF AN EPOXY RESIN, AND THE COVER CAN BE A PREFORMED COVER WHICH IS BONDED TO THE BASE UNIT USING AN EPOXY RESIN AS A SEALING MATERIAL, OR THE COVER CAN BE FORMED BY CASTING AN EPOXY RESIN AND CATALYST MIXTURE OVER THE BASE PART, AFTER FIRST FILLING THE CAVITIES AND DUCTS WITH A PARAFFIN WAX. THE PARAFFIN WAX IS THEREAFTER REMOVED BY HEATING AND FLUSHING WITH AN ORGAINC SOLVENT. THE SEALING OF THE CAVITIES AND DUCTS CAN ALSO BE ACCOMPLISHED BY APPLYING THEREOVER A THIN COVER PLATE OF REINFORCED PLASTIC, BONDED THERETO WITH A THIN ADHESIVE COAT OF EPOXY RESIN, AFTER WHICH A FINAL BOTTOM PLATE IS BONDED TO THE CASTING.