公开(公告)号：US20100109688A1

公开(公告)日：2010-05-06

申请号：US12264751

申请日：2008-11-04

Applicant: Benjamin N. Eldridge ,  Yoshikazu Hatsukano ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Yoshikazu Hatsukano ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: G01R31/02 ,  H05K3/10

CPC classification number: G01R3/00 ,  B33Y10/00 ,  B33Y80/00 ,  G01R1/06716 ,  G01R1/07342 ,  H05K3/1241 ,  H05K3/4664 ,  Y10T29/49126 ,  Y10T29/49147

Abstract: A probe substrate for use in testing semiconductor devices can include a base substrate that can have first electrical terminals at a first pitch. One or more redistribution layers on the base substrate can include droplets of a conductive material that form redistribution traces extending from the first terminals to second electrical terminals at a second pitch different from the first pitch.

Abstract translation: 用于测试半导体器件的探针衬底可以包括可以具有第一间距的第一电端子的基底衬底。 基底衬底上的一个或多个再分配层可以包括形成以不同于第一间距的第二间距从第一端子延伸到第二电端子的再分布迹线的导电材料的液滴。

公开(公告)号：US07699616B2

公开(公告)日：2010-04-20

申请号：US12034110

申请日：2008-02-20

Applicant: Charles A. Miller ,  Benjamin N. Eldridge

Inventor： Charles A. Miller ,  Benjamin N. Eldridge

IPC: H01R29/00

CPC classification number: G01R1/0466 ,  H01R13/025 ,  H01R13/40 ,  H01R2201/20

Abstract: An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.

Abstract translation: 一种包括具有多个通孔的基板和包括电线和/或同轴电缆的多根电缆的设备，其延伸穿过基板的多个通孔中的相应的通孔。 每个电缆包括导体并围绕基板的表面终止，使得多个电缆中的相应电缆的导体平面对准并且可用于电接触。 一种系统，包括延伸穿过所述界面的主体的多个通孔中的相应一个的电缆接口; 互连部件，其包括与所述多根电缆中的相应导体对准的第一多个接触点以及与要测试的设备的相应接触点对准的第二多个接触点。 而且，一种通过电子部件之间的多根电缆的导线路由信号的方法。

公开(公告)号：US20100083489A1

公开(公告)日：2010-04-08

申请号：US12632428

申请日：2009-12-07

Applicant: Benjamin N. Eldridge ,  Treliant Fang ,  Gaetan L. Mathieu ,  Onnik Yaglioglu

Inventor： Benjamin N. Eldridge ,  Treliant Fang ,  Gaetan L. Mathieu ,  Onnik Yaglioglu

IPC: H01R43/00 ,  B05D5/12 ,  C23C14/34 ,  G01R31/02

CPC classification number: B82Y40/00 ,  B82Y10/00 ,  B82Y30/00 ,  C01B32/16 ,  C01B2202/08 ,  G01R1/06755 ,  G01R3/00 ,  Y10T29/49117

Abstract: Carbon nanotube columns each comprising carbon nanotubes can be utilized as electrically conductive contact probes. The columns can be grown, and parameters of a process for growing the columns can be varied while the columns grow to vary mechanical characteristics of the columns along the growth length of the columns. Metal can then be deposited inside and/or on the outside of the columns, which can enhance the electrical conductivity of the columns. The metalized columns can be coupled to terminals of a wiring substrate. Contact tips can be formed at or attached to ends of the columns. The wiring substrate can be combined with other electronic components to form an electrical apparatus in which the carbon nanotube columns can function as contact probes.

Abstract translation: 每个包含碳纳米管的碳纳米管柱可用作导电接触探针。 柱可以生长，并且用于生长柱的方法的参数可以变化，同时柱生长以改变柱沿着生长长度的机械特性。 然后可以将金属沉积在柱的内部和/或外部，这可以增强柱的导电性。 金属化柱可以连接到布线基板的端子。 接触尖端可以形成在柱或端附近。 布线基板可以与其他电子部件组合以形成其中碳纳米管柱可用作接触探针的电气设备。

公开(公告)号：US07675311B2

公开(公告)日：2010-03-09

申请号：US11749004

申请日：2007-05-15

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge ,  Charles A. Miller ,  A. Nicholas Sporck

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Charles A. Miller ,  A. Nicholas Sporck

IPC: G01R31/26

CPC classification number: G01R31/3025 ,  G01R31/31907 ,  G01R31/31908

Abstract: One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wireless communication may also include transmission of test results to a tester. Messages may also be wirelessly exchanged.

Abstract translation: 一个或多个测试人员与一个或多个测试台无线通信。 无线通信可以包括将测试命令和/或测试向量发送到测试站，导致测试台上的一个或多个电子设备的测试。 无线通信还可以包括将测试结果传输给测试者。 消息也可以被无线地交换。

公开(公告)号：US07671614B2

公开(公告)日：2010-03-02

申请号：US11164737

申请日：2005-12-02

Applicant: Benjamin N. Eldridge ,  Eric D. Hobbs ,  Gaetan L. Mathieu ,  Makarand S. Shinde ,  Alexander H. Slocum

Inventor： Benjamin N. Eldridge ,  Eric D. Hobbs ,  Gaetan L. Mathieu ,  Makarand S. Shinde ,  Alexander H. Slocum

IPC: G01R31/02

CPC classification number: G01R31/2891 ,  G01R31/31905

Abstract: Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mounted in a test apparatus, and an orientation of the probe card assembly can be adjusted with respect to the test apparatus, such as a structural part of the test apparatus or a structural element attached to the test apparatus.

Abstract translation: 可以相对于探针卡组件的元件调整探针卡组件的探针，探针卡组件可以是探针卡组件的元件，其有助于将探针卡组件安装到测试装置。 然后可以将探针卡组件安装在测试装置中，并且可以相对于测试装置（例如测试装置的结构部分或连接到测试装置的结构元件）来调整探针卡组件的取向。

公开(公告)号：US07649368B2

公开(公告)日：2010-01-19

申请号：US12169538

申请日：2008-07-08

Applicant: Benjamin N. Eldridge ,  Carl V. Reynolds

Inventor： Benjamin N. Eldridge ,  Carl V. Reynolds

IPC: G01R31/02 ,  H05K1/00

CPC classification number: G01R1/07378 ,  G01R1/07307 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Double-sided interposer assemblies and methods for forming and using them. In one example of the invention, an interposer comprises a substrate having a first surface and a second surface opposite of said first surface, a first plurality of contact elements disposed on said first side of said substrate, and a second plurality of contact elements disposed on said second surface of said substrate, wherein said interposer connects electronic devices via said first and said second plurality of contact elements.

Abstract translation: 双面插入器组件及其形成和使用方法。 在本发明的一个示例中，插入器包括具有第一表面和与所述第一表面相对的第二表面的基板，设置在所述基板的所述第一侧上的第一多个接触元件和设置在所述第一表面上的第二多个接触元件 所述基板的所述第二表面，其中所述插入件经由所述第一和第二多个接触元件连接电子器件。

公开(公告)号：US20100011334A1

公开(公告)日：2010-01-14

申请号：US12564799

申请日：2009-09-22

Applicant: Benjamin N. Eldridge ,  Mark W. Brandemuehl ,  Stefan Graef ,  Yves Parent

Inventor： Benjamin N. Eldridge ,  Mark W. Brandemuehl ,  Stefan Graef ,  Yves Parent

IPC: G06F17/50

CPC classification number: G01R3/00 ,  G01R1/073 ,  G01R1/07342 ,  G06Q30/0609 ,  G06Q30/0621 ,  G06Q30/0633 ,  G06Q50/188

Abstract: A method and system for designing a probe card from data provided by prospective customers via the Internet is provided. Design specifications are entered into the system by prospective customers and compiled into a database. The collective feasibility of each set of design specifications is determined by an automated computer system and communicated to the prospective customer. If feasible, additional software enables prospective customers to create verification packages according to their respective design specifications. These verification packages further consist of drawing files visually describing the final design and verification files confirming wafer bonding pad data. Verification packages are reviewed and forwarded to an applications engineer after customer approval. An interactive simulation of probe card performance is also provided. Data on probe card performance is incorporated into an overall modeling exercise, which includes not only the probe card, but data on the device(s) under test and wafer, as well as data on automated test equipment.

Abstract translation: 提供了一种通过互联网从潜在客户提供的数据设计探针卡的方法和系统。 设计规范由潜在客户输入系统并编译成数据库。 每套设计规范的集体可行性由自动化计算机系统确定，并传达给潜在客户。 如果可行，附加软件可使潜在客户根据各自的设计规范创建验证包。 这些验证包还包括可视化地描述确认晶圆键合焊盘数据的最终设计和验证文件的绘图文件。 在客户批准后，验证包将被审核并转发给应用工程师。 还提供了探针卡性能的交互式仿真。 探针卡性能数据被纳入整体建模练习中，其中不仅包括探针卡，还包括被测设备和晶片上的数据，以及自动测试设备的数据。

公开(公告)号：US07642794B2

公开(公告)日：2010-01-05

申请号：US11963575

申请日：2007-12-21

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand S. Shinde ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand S. Shinde ,  Gaetan L. Mathieu

IPC: G01R31/02

CPC classification number: G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

Abstract translation: 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

公开(公告)号：US07601039B2

公开(公告)日：2009-10-13

申请号：US11456568

申请日：2006-07-11

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H05K3/00

CPC classification number: G01R3/00 ,  B23K2101/38 ,  G01R1/06727 ,  G01R1/06744 ,  H01L21/6835 ,  H01L23/4951 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/57 ,  H05K3/4092 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00

Abstract: An electronic interconnection apparatus can include a sacrificial substrate, which can include first trenches and second trenches formed in the sacrificial substrate. The first trenches can be disposed below a surface of the sacrificial substrate, and the second trenches can be disposed below the first trenches. First sidewalls can connect the surface and the first trenches, and the first sidewalls can be angled with respect to the surface and the first trenches. Second sidewalls can connect the first trenches and the second trenches, and the second sidewalls can be angled with respect to the first trenches and the second trenches. Spring contact elements can reside upon the sacrificial substrate. Each of the spring contact elements can have a first portion disposed on the surface, a second portion disposed on one of the first trenches, and a third portion disposed on one of the second trenches.

Abstract translation: 电子互连设备可以包括牺牲衬底，其可以包括形成在牺牲衬底中的第一沟槽和第二沟槽。 第一沟槽可以设置在牺牲衬底的表面下方，并且第二沟槽可以设置在第一沟槽下方。 第一侧壁可以连接表面和第一沟槽，并且第一侧壁可以相对于表面和第一沟槽成角度。 第二侧壁可以连接第一沟槽和第二沟槽，并且第二侧壁可以相对于第一沟槽和第二沟槽成角度。 弹性接触元件可以驻留在牺牲衬底上。 每个弹簧接触元件可以具有设置在表面上的第一部分，设置在第一沟槽中的一个上的第二部分和设置在第二沟槽之一上的第三部分。

公开(公告)号：US20090142707A1

公开(公告)日：2009-06-04

申请号：US12326486

申请日：2008-12-02

Applicant: Benjamin N. Eldridge ,  Bruce Jeffrey Barbara

Inventor： Benjamin N. Eldridge ,  Bruce Jeffrey Barbara

IPC: G03F7/20

CPC classification number: G01R3/00 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2889 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/30111 ,  Y10T29/49121 ,  Y10T29/49147 ,  Y10T29/49224 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Resilient spring contacts for use in wafer test probing are provided that can be manufactured with a very fine pitch spacing and precisely located on a support substrate. The resilient contact structures are adapted for wire bonding to an electrical circuit on a space transformer substrate. The support substrates with attached spring contacts can be manufactured together in large numbers and diced up and tested before attachment to a space transformer substrate to improve yield. The resilient spring contacts are manufactured using photolithographic techniques to form the contacts on a release layer, before the spring contacts are epoxied to the support substrate and the release layer removed. The support substrate can be transparent to allow alignment of the contacts and testing of optical components beneath. The support substrate can include a ground plane provided beneath the spring contacts for improved impedance matching.

Abstract translation: 提供用于晶片测试探测的弹性弹簧触点，其可以以非常精细的间距间隔制造并且精确地位于支撑基板上。 弹性接触结构适于引线接合到空间变压器基板上的电路。 具有附接弹簧触点的支撑基板可以一起大量制造，并在连接到空间变压器基板之前进行切割和测试，以提高产量。 弹性弹簧触点使用光刻技术制造，以在将弹簧触点环氧化为支撑基底并且去除释放层之前在释放层上形成触点。 支撑衬底可以是透明的，以允许触点的对准和下面的光学部件的测试。 支撑基板可以包括设置在弹簧触点下方的接地平面，用于改善阻抗匹配。