公开(公告)号：US20110173500A1

公开(公告)日：2011-07-14

申请号：US12985019

申请日：2011-01-05

申请人： Masataka SONODA ,  Yuji Wada ,  Atsuji Sekiguchi

发明人： Masataka SONODA ,  Yuji Wada ,  Atsuji Sekiguchi

IPC分类号： G06F11/07 ,  G06F15/16

CPC分类号： H04L41/064

摘要： An apparatus for managing a network system including a plurality of components, the apparatus includes a memory that stores component type data of each component of the plurality of components, component relation data including relation information indicating a pair of components related to each other in the network system and error history data including error information of respective error components in the plurality of components. The apparatus includes a processor that executes a procedure including extracting a pair of component type data as a relation class candidate on the basis of the component type data of a pair of error components indicated by the error information in the error history data, the pair of error components being indicated by the relation information.

摘要翻译： 一种用于管理包括多个部件的网络系统的装置，该装置包括存储多个部件的各部件的部件类型数据的存储器，包括表示在网络中彼此相关的一对部件的关系信息的部件关系数据 系统和错误历史数据，包括多个分量中各个误差分量的误差信息。 该装置包括一个处理器，该处理器执行一个过程，该过程包括基于由错误历史数据中的错误信息指示的一对误差分量的分量类型数据提取一对组分类型数据作为关系类候选，该对 错误组件由关系信息指示。

公开(公告)号：US20100172583A1

公开(公告)日：2010-07-08

申请号：US12628559

申请日：2009-12-01

申请人： Kazuhiro SHIMAUCHI ,  Yuji Wada ,  Hiroshi Ikeda

发明人： Kazuhiro SHIMAUCHI ,  Yuji Wada ,  Hiroshi Ikeda

IPC分类号： G06K9/36

CPC分类号： H04N19/186 ,  H04N19/115 ,  H04N19/119 ,  H04N19/124 ,  H04N19/14 ,  H04N19/15 ,  H04N19/176 ,  H04N19/436 ,  H04N19/593 ,  H04N19/91

摘要： An encoding device includes: a color-difference signal encoding unit for encoding a color-difference signal for each processing block in multiple color-difference signal encoding modes to generate multiple color-difference signal bit streams; a color-difference mode selecting unit for selecting a color-difference signal encoding mode from the multiple color-difference signal encoding modes; a luminance signal encoding unit for calculating luminance target code amount by subtracting the code amount of the encoded color-difference signal bit stream from fixed code amount, and encoding a luminance signal to generate a luminance signal bit stream; a color-difference reselecting unit for selecting the color-difference signal encoding mode corresponding to the color-difference signal bit stream having the code amount not greater than the fixed code amount, and small deterioration as to the color-difference signal; and a multiplexing unit for multiplexing the luminance signal bit stream, and the encoded color-difference signal bit stream to generate a bit stream.

摘要翻译： 编码装置包括：色差信号编码单元，用于在多个色差信号编码模式中对每个处理块的色差信号进行编码，以产生多个色差信号比特流; 色差模式选择单元，用于从多个色差信号编码模式中选择色差信号编码模式; 亮度信号编码单元，用于通过从固定代码量中减去编码色差信号比特流的代码量来计算亮度目标代码量，以及对亮度信号进行编码以产生亮度信号比特流; 色差重新选择单元，用于选择与具有不大于固定码量的码量的色差信号比特流相对应的色差信号编码模式，以及色差信号的劣化; 以及复用单元，用于对亮度信号比特流和编码的色差信号比特流进行多路复用以产生比特流。

公开(公告)号：US20080209003A1

公开(公告)日：2008-08-28

申请号：US12037122

申请日：2008-02-26

申请人： Hideki Mitsunobu ,  Takao Mohri ,  Yuji Wada ,  Satoru Takahashi

发明人： Hideki Mitsunobu ,  Takao Mohri ,  Yuji Wada ,  Satoru Takahashi

IPC分类号： G06F15/167

CPC分类号： H04L67/125 ,  G06F11/00 ,  G06F13/00 ,  H04L12/2803 ,  H04L12/2809 ,  H04L67/04

摘要： A computer executes a monitoring control by receiving a first notification which has been transmitted from another communication apparatus to a network, and acquiring first identification information which is identification information of the communication apparatus at a predetermined first layer, from the first notification. The computer acquires second identification information which is identification information of the communication apparatus at a second layer being lower in hierarchy than the first layer. The computer associates the first identification information and the second identification information, and acquires a connection state between the network and the communication apparatus at the second layer.

摘要翻译： 计算机通过接收从另一通信装置发送到网络的第一通知执行监视控制，并从第一通知中获取作为通信装置的预定第一层的通信装置的标识信息的第一标识信息。 计算机获取第二识别信息，该第二识别信息是与第一层分层次较低的第二层的通信装置的识别信息。 计算机将第一识别信息和第二识别信息相关联，并且在第二层获取网络和通信装置之间的连接状态。

公开(公告)号：US20080177820A1

公开(公告)日：2008-07-24

申请号：US12017823

申请日：2008-01-22

申请人： Yuji Wada ,  Takao Mohri ,  Hideki Mitsunobu ,  Satoru Takahashi

发明人： Yuji Wada ,  Takao Mohri ,  Hideki Mitsunobu ,  Satoru Takahashi

IPC分类号： G06F15/16

CPC分类号： H04L41/06 ,  H04W8/245

摘要： A communication device and method is disclosed for indicating a connection to a network and transmitting a living notification having a term of validity to the network when the device is connected with the network. The disclosed device includes an obtaining unit obtaining a first information representing a device status of the communication device, a determining unit determining a term of validity based on the first information obtained, and a first transmission unit transmitting a living notification having the term of validity determined to the network.

摘要翻译： 公开了一种通信装置和方法，用于指示与网络的连接，并且当设备与网络连接时向网络发送具有有效期限的生活通知。 所公开的设备包括：获取单元，获取表示通信设备的设备状态的第一信息;确定单元，基于获得的第一信息确定有效期;以及第一传输单元，传送具有所确定的有效期限的生活通知 到网络。

公开(公告)号：US07219422B2

公开(公告)日：2007-05-22

申请号：US10765917

申请日：2004-01-29

申请人： Yuji Wada ,  Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akira Yabushita ,  Terutaka Mori ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Teruo Shoji ,  Masakazu Sueyoshi

发明人： Yuji Wada ,  Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akira Yabushita ,  Terutaka Mori ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Teruo Shoji ,  Masakazu Sueyoshi

IPC分类号： H05K3/00 ,  H01R9/00

CPC分类号： G01R1/07314 ,  G01R31/2872 ,  Y10T29/41 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49798

摘要： The fabrication of a semiconductor integrated circuit device involves testing using a pushing mechanism that is constructed by forming, over the upper surface of a thin film probe, a reinforcing material having a linear expansion coefficient (thermal expansion coefficient) almost equal to that of a wafer to be tested; forming a groove in the reinforcing material above a contact terminal; placing an elastomer in the groove so that a predetermined amount projects out of the groove; and disposing a pusher and another elastomer to sandwich the pusher between the elastomers. With the use of such a probe, it is possible to improve the throughput of wafer-level electrical testing of a semiconductor integrated circuit.

摘要翻译： 半导体集成电路器件的制造包括使用推压机构进行测试，所述推压机构通过在薄膜探针的上表面上形成具有几乎等于晶片的线性膨胀系数（热膨胀系数）的增强材料而构成 待测 在接触端子上方的增强材料中形成凹槽; 将弹性体放置在所述槽中，使得预定量突出到所述凹槽中; 并且设置推进器和另一种弹性体以将推进器夹在弹性体之间。 通过使用这样的探针，可以提高半导体集成电路的晶片级电气测试的吞吐量。

公开(公告)号：US06864568B2

公开(公告)日：2005-03-08

申请号：US10252546

申请日：2002-09-24

申请人： Ryuji Kohno ,  Hiroya Shimizu ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Toshio Miyatake ,  Hideo Miura ,  Tatsuya Nagata ,  Yoshishige Endo ,  Masaaki Namba ,  Yuji Wada

发明人： Ryuji Kohno ,  Hiroya Shimizu ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Toshio Miyatake ,  Hideo Miura ,  Tatsuya Nagata ,  Yoshishige Endo ,  Masaaki Namba ,  Yuji Wada

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R1/073 ,  H01L21/66 ,  H01L23/02

CPC分类号： G01R1/0483 ,  H01L2924/0002 ,  H01L2924/00

摘要： A packaging device for holding thereon a plurality of semiconductor devices to be inspected on an inspection device including a probe to be electrically connected to an electrode of each of the semiconductor devices, comprises, holes for respectively receiving detachably therein the semiconductor devices to keep a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices, in a direction perpendicular to a thickness direction of the semiconductor devices, and electrically conductive members adapted to be connected respectively to the electrodes of the semiconductor devices, and extending to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members.

摘要翻译： 一种用于在其上保持要检查的多个待检查的半导体器件的封装装置，包括：电连接到每个半导体器件的电极的探针，包括：用于分别接收半导体器件中的可分离地接收的孔，以保持位置 半导体器件之间的关系以及在与半导体器件的厚度方向垂直的方向上半导体器件之间的间隔恒定的封装器件和每个半导体器件之间的位置关系以及适于分别连接的导电部件 并且延伸到包装装置的外部，使得探针连接到每个导电构件。

公开(公告)号：US06696849B2

公开(公告)日：2004-02-24

申请号：US09964708

申请日：2001-09-28

申请人： Naoto Ban ,  Masaaki Namba ,  Akio Hasebe ,  Yuji Wada ,  Ryuji Kohno ,  Akira Seito ,  Yasuhiro Motoyama

发明人： Naoto Ban ,  Masaaki Namba ,  Akio Hasebe ,  Yuji Wada ,  Ryuji Kohno ,  Akira Seito ,  Yasuhiro Motoyama

IPC分类号： G01R3102

CPC分类号： G01R31/2831

摘要： A testing apparatus and a fabricating method of a semiconductor integrated circuit device for reducing the fabrication cost by placing, in the wafer level burn-in, divided contactors in equally contact with the full surface of wafer, enabling repair of each contactor and improving the yield of contactors. The cassette structure of the mechanical pressurizing system in the testing apparatus is structured with a plurality of divided silicon contactor blocks and a guide frame for integrating these blocks and employs the wafer full surface simultaneous contact system of the divided contactor integration type. Each probe of the silicon contactor is equally placed in contact in the predetermined pressure with each test pad of each chip of the test wafer by mechanically pressuring each silicon contactor block which moves individually, the test control signal is supplied to each chip and this test result signal is obtained for the wafer level burn-in test.

摘要翻译： 一种半导体集成电路器件的测试装置和制造方法，用于通过在晶片级老化中放置与晶片的整个表面均匀接触的分割的接触器来降低制造成本，从而能够修复每个接触器并提高产量 的接触器。 测试装置中的机械加压系统的盒式结构由多个分开的硅接触器块和用于集成这些块的引导框架构成，并且采用分开的接触器一体化型的晶片全表面同时接触系统。 硅接触器的每个探针通过机械加压每个单独移动的硅接触器块，将测试控制信号提供给每个芯片，并且测试结果与测试晶片的每个芯片的每个测试焊盘等同地以预定压力接触 获得晶片级老化测试信号。

公开(公告)号：US06465264B1

公开(公告)日：2002-10-15

申请号：US09654612

申请日：2000-09-01

申请人： Ryuji Kohno ,  Hiroya Shimizu ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Toshio Miyatake ,  Hideo Miura ,  Tatsuya Nagata ,  Yoshishige Endo ,  Masaaki Namba ,  Yuji Wada

发明人： Ryuji Kohno ,  Hiroya Shimizu ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Toshio Miyatake ,  Hideo Miura ,  Tatsuya Nagata ,  Yoshishige Endo ,  Masaaki Namba ,  Yuji Wada

IPC分类号： G01R3126

CPC分类号： G01R1/0483 ,  H01L2924/0002 ,  H01L2924/00

摘要： A packaging device for holding thereon a plurality of semiconductor devices to be inspected on an inspection device including a probe to be electrically connected to an electrode of each of the semiconductor devices, comprises, holes for respectively receiving detachably therein the semiconductor devices to keep a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices, in a direction perpendicular to a thickness direction of the semiconductor devices, and electrically conductive members adapted to be connected respectively to the electrodes of the semiconductor devices, and extending to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members.

摘要翻译： 一种用于在其上保持要检查的多个待检查的半导体器件的封装装置，包括：电连接到每个半导体器件的电极的探针，包括：用于分别接收半导体器件中的可分离地接收的孔，以保持位置 半导体器件之间的关系以及在与半导体器件的厚度方向垂直的方向上半导体器件之间的间隔恒定的封装器件和每个半导体器件之间的位置关系以及适于分别连接的导电部件 并且延伸到包装装置的外部，使得探针连接到每个导电构件。

公开(公告)号：US06197603B1

公开(公告)日：2001-03-06

申请号：US09157153

申请日：1998-09-18

申请人： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

发明人： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

IPC分类号： G01R3126

CPC分类号： G01R3/00 ,  G01R1/0735

摘要： Dispersion of a load may be kept within a predetermined allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane against a wafer by applying a pressure load to a plurality of places on a plane of the pressure members on the side opposite the wafer in a probe test step, burn-in test step which represent typical semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit at the same time.

摘要翻译： 即使当大量区域中的多个探针通过将设置在膜中的探针压在晶片上时，通过将压力负载施加到多个位置的平面上的多个位置，负载的分散也可以保持在预定容限内 在探针测试步骤中与晶片相对的一侧的压力构件，代表典型的半导体器件制造步骤的老化测试步骤。 因此，可以提供通过同时探测大量集成电路或大尺寸集成电路来提高半导体器件的可靠性和生产率的半导体器件及其制造方法。

公开(公告)号：US08986422B2

公开(公告)日：2015-03-24

申请号：US13634881

申请日：2011-03-17

申请人： Katsuhiro Yamada ,  Shuji Inoue ,  Hiderou Nomoto ,  Tomohisa Yamauchi ,  Yuji Wada ,  Yasunori Tsukahara

发明人： Katsuhiro Yamada ,  Shuji Inoue ,  Hiderou Nomoto ,  Tomohisa Yamauchi ,  Yuji Wada ,  Yasunori Tsukahara

IPC分类号： B22F9/24 ,  B82Y40/00 ,  B22F9/30

CPC分类号： B22F9/24 ,  B22F9/305 ,  B22F2301/15 ,  B22F2303/01 ,  B82Y40/00 ,  Y10S977/896 ,  B22F2998/00 ,  B22F1/0018 ,  B22F2999/00 ,  B22F2202/11

摘要： A method for producing nickel nanoparticles is described, including a first step of heating a mixture of a nickel carboxylate with 1-12 carbon atoms in its moiety excluding —COOH and a primary amine to obtain a complexed reaction solution with a nickel complex foiiiied therein, and a second step of heating the complexed reaction solution by a microwave to obtain a Ni-nanoparticle slurry. In the first step, the heating is preferably conducted at a temperature of 105-175° C. for 15 minutes or longer. In the second step, the heating is preferably conducted at a temperature of 180° C. or higher.

摘要翻译： 描述了一种制备镍纳米颗粒的方法，其包括第一步骤，在除了-COOH之外的部分中加热具有1-12个碳原子的羧酸镍的混合物和伯胺以获得其中所形成的镍络合物的络合反应溶液， 以及通过微波加热配合的反应溶液以获得Ni-纳米颗粒浆料的第二步骤。 在第一步骤中，加热优选在105-175℃的温度下进行15分钟或更长时间。 在第二步骤中，加热优选在180℃以上的温度下进行。