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    Recovery system and methods for MEMS devices
    111.
    发明授权
    Recovery system and methods for MEMS devices 有权

    公开(公告)号：US09517930B2

    公开(公告)日：2016-12-13

    申请号：US14047944

    申请日：2014-01-29

    Applicant: Maxim Integrated Products, Inc.

    Inventor： Gabriele Cazzaniga ,  Luca Coronato ,  Barbara Simoni ,  Luciano Prandi

    IPC: H01G5/00 ,  B81C1/00 ,  B81B3/00 ,  H01H1/00

    CPC classification number: B81C1/00968 ,  B81B3/001 ,  B81B3/0056 ,  B81B2201/016 ,  H01H1/0036

    Abstract: Various embodiments of the invention reduce stiction in a wide range of MEMS devices and increase device reliability without negatively impacting performance. In certain embodiments, stiction recover is accomplished by applying electrostatic forces to electrodes via optimized voltage signals that generate a restoring force that aids in overcoming stiction forces between electrodes. The voltage signals used within a stiction recovery procedure may be static or a dynamic, and may be applied directly to existing electrodes within a MEMS device, thereby, eliminating the need for additional components. In some embodiments, the voltage is estimated or calibrated and swept through a range of frequencies that contains one or more resonant frequencies of the mechanical structure that comprises the parts to be detached.

    Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures
    114.
    发明授权
    Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures 有权
    微机电系统（MEMS）及相关执行器凸块，制造和设计结构的方法

    公开(公告)号：US09120667B2

    公开(公告)日：2015-09-01

    申请号：US13164331

    申请日：2011-06-20

    Applicant: Christopher V. Jahnes ,  Anthony K. Stamper

    Inventor： Christopher V. Jahnes ,  Anthony K. Stamper

    IPC: H02N1/00 ,  B81B3/00 ,  H05K13/00

    CPC classification number: H01H59/0009 ,  B81B3/001 ,  B81B7/0006 ,  B81B2201/016 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00293 ,  B81C2203/0145 ,  G06F17/5045 ,  G06F17/5068 ,  H01H1/0036 ,  H01H2001/0057 ,  Y10T29/49121

    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes and a contact point on a substrate. The method further includes forming a MEMS beam over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

    Abstract translation: 提供微机电系统（MEMS）结构，制造方法和设计结构。 形成MEMS结构的方法包括在基板上形成固定的致动器电极和接触点。 该方法还包括在固定的致动器电极和接触点上形成MEMS光束。 该方法还包括形成与固定致动器电极的部分对准的致动器电极阵列，其尺寸和尺寸被设计成防止MEMS光束在重复循环之后塌陷在固定的致动器电极上。 致动器电极阵列形成为与MEMS光束的下侧和固定的致动器电极的表面中的至少一个直接接触。

    MEMS electrostatic actuator
    116.
    发明授权
    MEMS electrostatic actuator 有权
    MEMS静电执行器

    公开(公告)号：US09040854B2

    公开(公告)日：2015-05-26

    申请号：US13614936

    申请日：2012-09-13

    Applicant: Arun K. Gupta ,  William C. McDonald

    Inventor： Arun K. Gupta ,  William C. McDonald

    IPC: H01H57/00 ,  B81B3/00

    CPC classification number: H02N2/12 ,  B81B3/0008 ,  B81B3/001 ,  B81B3/0013 ,  B81B7/02 ,  B81B2201/016 ,  B81B2201/0221 ,  B81B2203/0109 ,  B81B2203/0181 ,  B81B2203/053 ,  B81B2203/058 ,  B81B2203/06

    Abstract: A MEMS electrostatic actuator includes a bottom plate affixed to a substrate and a top plate suspended above the bottom plate. The top plate has a parallel plate center section and two rotating members electrically connected to the center section. Each rotating member is attached centrally of the rotating member for rotation about an axis of rotation to a set of anchor posts. The attachment includes at least one pair of torsional springs attached along each axis, each spring comprising a rectangular metal square that twists as the rotational members rotate. Electrostatic pull-down electrodes are underneath each rotational member.

    Abstract translation: MEMS静电致动器包括固定到基板的底板和悬挂在底板上方的顶板。 顶板具有平行板中心部分和两个电连接到中心部分的旋转部件。 每个旋转构件安装在旋转构件的中心，用于围绕旋转轴线旋转到一组锚柱。 附件包括沿着每个轴线附接的至少一对扭转弹簧，每个弹簧包括矩形金属正方形，随着旋转构件的旋转，该正方形扭曲。 静电下拉电极位于每个旋转构件的下方。

    Electronic element, variable capacitor, micro switch, method for driving micro switch, and MEMS type electronic element
    117.
    发明授权
    Electronic element, variable capacitor, micro switch, method for driving micro switch, and MEMS type electronic element 有权
    电子元件，可变电容器，微动开关，微动开关的驱动方法和MEMS型电子元件

    公开(公告)号：US09036327B2

    公开(公告)日：2015-05-19

    申请号：US13864430

    申请日：2013-04-17

    Applicant: Nikon Corporation

    Inventor： Hiroshi Konishi ,  Junji Suzuki

    IPC: H01G7/06 ,  H01G5/16 ,  H01G7/00 ,  G02B26/08 ,  B81B3/00 ,  H01G5/18 ,  H01L23/522 ,  H01L27/08

    CPC classification number: G02B26/08 ,  B81B3/0086 ,  B81B2201/016 ,  H01G5/16 ,  H01G5/18 ,  H01L23/5223 ,  H01L27/0808 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    Abstract: An electronic element includes a fixed portion, and a movable portion which is movable with respect to the fixed portion and which is provided to generate a spring force to make restoration to a predetermined position. The fixed portion is provided with a first driving electrode and a first signal electrode. The movable portion is provided with a second driving electrode and a second signal electrode. An electrostatic force is generated between the first driving electrode and the second driving electrode by a voltage applied therebetween so that the electrostatic force resists against the spring force; and the first and second driving electrodes and the first and second signal electrodes are arranged so that the electrostatic force is generated in a direction in which a spacing distance between the first and second signal electrodes is widened.

    Abstract translation: 电子元件包括固定部分和可相对于固定部分移动并且被设置成产生弹簧力以使其恢复到预定位置的可动部分。 固定部设置有第一驱动电极和第一信号电极。 可动部设置有第二驱动电极和第二信号电极。 通过施加在第一驱动电极和第二驱动电极之间的电压产生静电力，使得静电力抵抗弹簧力; 并且第一和第二驱动电极以及第一和第二信号电极被布置成使得在第一和第二信号电极之间的间隔距离变宽的方向产生静电力。

    RF MEMS ISOLATION, SERIES AND SHUNT DVC, AND SMALL MEMS
    118.
    发明申请
    RF MEMS ISOLATION, SERIES AND SHUNT DVC, AND SMALL MEMS 有权
    RF MEMS隔离，串联和分流DVC以及小型MEMS

    公开(公告)号：US20140300404A1

    公开(公告)日：2014-10-09

    申请号：US14240677

    申请日：2012-08-31

    Applicant: Roberto Gaddi ,  Richard L. Knipe ,  Robertus Petrus Van Kampen ,  Anartz Unamuno

    Inventor： Roberto Gaddi ,  Richard L. Knipe ,  Robertus Petrus Van Kampen ,  Anartz Unamuno

    IPC: H01L49/02 ,  H03K17/687 ,  H03K17/16

    CPC classification number: H01L28/60 ,  B81B3/0086 ,  B81B2201/016 ,  B81B2207/015 ,  H01G5/18 ,  H01G5/38 ,  H01G5/40 ,  H01H59/0009 ,  H03K17/162 ,  H03K17/6872 ,  H03K2217/0009 ,  H03K2217/0036 ,  H03K2217/009

    Abstract: The present invention generally relates to an architecture for isolating an RF MEMS device from a substrate and driving circuit, series and shunt DVC die architectures, and smaller MEMS arrays for high frequency communications. The semiconductor device has one or more cells with a plurality of MEMS devices therein. The MEMS device operates by applying an electrical bias to either a pull-up electrode or a pull-down electrode to move a switching element of the MEMS device between a first position spaced a first distance from an RF electrode and a second position spaced a second distance different than the first distance from the RF electrode. The pull-up and/or pull-off electrode may be coupled to a resistor to isolate the MEMS device from the substrate.

    Abstract translation: 本发明一般涉及用于将RF MEMS器件与衬底以及驱动电路，串联和并联DVC管芯结构隔离的架构，以及用于高频通信的较小的MEMS阵列。 该半导体器件具有其中具有多个MEMS器件的一个或多个单元。 MEMS器件通过将电偏压施加到上拉电极或下拉电极来操作，以将MEMS器件的开关元件移动在与RF电极间隔开第一距离的第一位置和间隔第二位置的第二位置 距离与RF电极的第一距离不同。 上拉和/或下拉电极可以耦合到电阻器以将MEMS器件与衬底隔离。

    MEMS devices and fabrication thereof
    119.
    发明授权
    MEMS devices and fabrication thereof 有权
    MEMS器件及其制造

    公开(公告)号：US08853797B2

    公开(公告)日：2014-10-07

    申请号：US12990123

    申请日：2009-05-06

    Applicant: Robertus T. F. van Schaijk

    Inventor： Robertus T. F. van Schaijk

    IPC: H01L27/12 ,  B81B3/00

    CPC classification number: B81B3/0086 ,  B81B3/0078 ,  B81B2201/016 ,  B81B2203/0118

    Abstract: A MEMS device and method, comprising: a substrate; a beam; and a cavity located therebetween; the beam comprising a first beam layer and a second beam layer, the first beam layer being directly adjacent to the cavity, the second beam layer being directly adjacent to the first beam layer; the first beam layer comprising a metal or a metal alloy containing silicon; and the second beam layer comprising a metal or a metal alloy substantially not containing silicon. Preferably the second beam layer is thicker than the first beam layer e.g. at least five times thicker, and the first beam layer comprises a metal or alloy containing between 1% and 2% of silicon. The second beam layer provides desired mechanical and/or optical properties while the first beam layer prevents spiking.

    Abstract translation: 一种MEMS器件和方法，包括：衬底; 一束 和位于其间的腔体; 所述光束包括第一光束层和第二光束层，所述第一光束层直接邻近所述空腔，所述第二光束层直接邻近所述第一光束层; 所述第一束层包含含有硅的金属或金属合金; 并且第二束层包含基本上不含硅的金属或金属合金。 优选地，第二光束层比第一光束层厚。 至少五倍厚，第一束层包含含有1％至2％硅的金属或合金。 第二光束层提供期望的机械和/或光学特性，而第一光束层防止尖峰。

    MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) CAPACITIVE OHMIC SWITCH AND DESIGN STRUCTURES
    120.
    发明申请
    MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) CAPACITIVE OHMIC SWITCH AND DESIGN STRUCTURES 有权
    微电子机械系统（MEMS）电容式OHMIC开关和设计结构

    公开(公告)号：US20140231236A1

    公开(公告)日：2014-08-21

    申请号：US14041983

    申请日：2013-09-30

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Hanyi DING ,  Qizhi LIU ,  Anthony K. STAMPER

    IPC: H01H1/00 ,  G06F17/50

    CPC classification number: H01H1/0036 ,  B81B7/0006 ,  B81B2201/016 ,  G06F17/5063 ,  G06F17/5068 ,  H01P1/127

    Abstract: A micro-electro-mechanical system (MEMS), methods of forming the MEMS and design structures are provided. The method includes forming a coplanar waveguide (CPW) comprising a signal electrode and a pair of electrodes on a substrate. The method includes forming a first sacrificial material over the CPW, and a wiring layer over the first sacrificial material and above the CPW. The method includes forming a second sacrificial material layer over the wiring layer, and forming insulator material about the first sacrificial material and the second sacrificial material. The method includes forming at least one vent hole in the insulator material to expose portions of the second sacrificial material, and removing the first and second sacrificial material through the vent hole to form a cavity structure about the wiring layer and which exposes the signal line and pair of electrodes below the wiring layer. The vent hole is sealed with sealing material.

    Abstract translation: 提供了微机电系统（MEMS），形成MEMS和设计结构的方法。 该方法包括在基板上形成包括信号电极和一对电极的共面波导（CPW）。 该方法包括在CPW上形成第一牺牲材料，以及在第一牺牲材料上方和CPW上方的布线层。 该方法包括在布线层上形成第二牺牲材料层，以及围绕第一牺牲材料和第二牺牲材料形成绝缘体材料。 所述方法包括在所述绝缘体材料中形成至少一个通气孔以暴露所述第二牺牲材料的部分，以及通过所述通气孔去除所述第一和第二牺牲材料以形成围绕所述布线层的空腔结构，并且暴露所述信号线和 一对电极在布线层下方。 通气孔用密封材料密封。

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