公开(公告)号：US4266239A

公开(公告)日：1981-05-05

申请号：US957144

申请日：1978-11-03

申请人： Katsunori Miyagaki ,  Shozo Noguchi ,  Yukio Hirakawa

发明人： Katsunori Miyagaki ,  Shozo Noguchi ,  Yukio Hirakawa

IPC分类号： H01L23/04 ,  H01L23/02 ,  H01L23/057 ,  H01L23/12 ,  H01L23/66 ,  H01L25/04 ,  H01L29/34 ,  H01L29/40

CPC分类号： H01L23/057 ,  H01L23/66 ,  H01L2224/48091 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3025

摘要： A semiconductor device in which a conducting shielding member is disposed over the space between the input and output terminal metal layers and over the semiconductor chip bonded to the output metal layer. The shielding member is electrically connected to the common terminal metal layer. This construction results in a reduction in the storage capacitance between the input and output terminal layers and improved power gain and stability of operation, particularly at high frequencies.

摘要翻译： 一种半导体器件，其中导电屏蔽构件设置在输入和输出端子金属层之间的空间之上以及结合到输出金属层的半导体芯片之上。 屏蔽部件与公共端子金属层电连接。 这种结构导致输入和输出端子层之间的存储电容减小，并且改善了功率增益和操作的稳定性，特别是在高频率下。

公开(公告)号：US4259684A

公开(公告)日：1981-03-31

申请号：US951219

申请日：1978-10-13

申请人： Douglas J. Dean ,  Patrick F. T. Linford ,  John Savage

发明人： Douglas J. Dean ,  Patrick F. T. Linford ,  John Savage

IPC分类号： H01L23/057 ,  H01L23/10 ,  H01L23/66 ,  H01L23/02 ,  H01L23/12 ,  H01L39/02

CPC分类号： H01L23/10 ,  H01L23/057 ,  H01L23/66 ,  H01L2224/48091 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/3011

摘要： This disclosure relates to the packaging of microwave integrated circuits (MICs) whereby an MIC is hermetically sealed within an enclosure comprising a first plate of dielectric material which carries the circuit to be enclosed, a wall of dielectric material sealed to the surface of the first plate surrounding the circuit, and a second plate of dielectric material providing a lid sealed over the wall to complete the enclosure. The first plate carries planar conductors which define at least one microwave transmission line, e.g. microstrip, extending across the wall into the enclosure from outside to provide direct microwave coupling to the enclosed circuit and thereby obviating the usual need for transitions to and from coaxial cable.Part or all of the enclosed circuit may be contained within a recess provided by forming an aperture in the first plate and sealing a third plate of dielectric material across the aperture from below.The disclosure describes various techniques for reducing losses where the transmission line propagation paths traverse the wall on the surface of the first plate. The entire package may be fabricated using materials and techniques compatible with those used in fabricating MIC's, for example thick film.

摘要翻译： 本发明涉及微波集成电路（MIC）的封装，其中MIC密封在外壳内，该外壳包括承载要封闭的电路的第一介电材料板，密封到第一板的表面的电介质材料壁 围绕电路，以及第二介电材料板，提供密封在壁上以完成外壳的盖子。 第一板承载限定至少一个微波传输线的平面导体，例如。 微带，从外部延伸穿过壁进入外壳，以提供直接的微波耦合到封闭的电路，从而避免了对同轴电缆的转换的通常需要。 封闭电路的一部分或全部可以包含在通过在第一板中形成孔并且从下方密封第三介电材料板穿过该孔而提供的凹槽内。 本公开描述了用于在传输线传播路径穿过第一板的表面上的壁的情况下减少损耗的各种技术。 可以使用与用于制造MIC的材料和技术相兼容的材料和技术来制造整个封装，例如厚膜。

公开(公告)号：US4117508A

公开(公告)日：1978-09-26

申请号：US779327

申请日：1977-03-21

申请人： Paul W. Koenig

发明人： Paul W. Koenig

IPC分类号： H01L23/34 ,  H01L23/057 ,  H01L23/31 ,  H01L23/36 ,  H01L23/373 ,  H01L23/48 ,  H01L23/495 ,  H01L23/02 ,  H01L23/28 ,  H01L23/42

CPC分类号： H01L24/40 ,  H01L23/057 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3731 ,  H01L23/49562 ,  H01L24/41 ,  H01L2224/40225 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/48465 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025

摘要： Disclosed is a semiconductor body mounted on an electrically-insulative, thermally-conductive plate which also carries metallized contacts electrically connected to the various contact areas associated with the semiconductor body. A protective one-piece insulative bridge overlies the semiconductor body and includes legs secured to the plate and a cross member extending over the body. The bridge facilitates pressing or clamping the plate in enhanced heat-transferring relation to a substrate heatsink without application of any pressure on the body or other deleterious effects to the body.

公开(公告)号：US4026008A

公开(公告)日：1977-05-31

申请号：US578668

申请日：1975-05-19

申请人： Joseph M. Drees ,  Fritz W. Beyerlein

发明人： Joseph M. Drees ,  Fritz W. Beyerlein

IPC分类号： H01L21/48 ,  H01L23/057 ,  H01L23/31 ,  H01L23/433 ,  H01L23/485 ,  H01L23/495 ,  B01J17/00

CPC分类号： H01L24/10 ,  H01L21/4842 ,  H01L23/057 ,  H01L23/3135 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  Y10T29/49004 ,  Y10T29/49121

摘要： A lead structure formed from a sheet of electrically conducting material having a plurality of spaced integral lead arrays formed therein with each of the arrays comprising a plurality of first leads formed from the sheet material in one region thereof and being integral with the sheet with each of the leads being cantilevered and having inner extremities which are free and positioned in a predetermined pattern. Portions of the first leads adjacent the free ends are convoluted. A semiconductor body having at least portions of an electrical circuit formed therein and with contacts in a predetermined pattern carried by the body and lying in a common plane is secured to each of the arrays with the contact pads being bonded to the inner extemities of the first leads. A first encapsulating means is provided for encapsulating the semiconductor body and the inner extremities of the first leads with the outer extremities of the first leads being free of the first encapsulating means. After the first encapsulation, the outer extremities of the first lead are separated from the sheet of material. A plurality of spaced second leads are then secured to the outer extremities of the first leads. A second encapsulating means is then provided for encapsulating the first encapsulating means, the outer extremities of the first leads and the inner extremities of the second leads with the outer extremities of the second leads being free.

摘要翻译： 由一片导电材料形成的引线结构，其具有形成在其中的多个间隔开的整体引线阵列，其中每个阵列包括由片材在其一个区域中形成的多个第一引线， 引线是悬臂的并且具有自由并且以预定图案定位的内端。 邻近自由端的第一引线的部分被卷绕。 半导体本体至少具有形成在其中的电路的一部分，并且具有由本体承载并且位于公共平面中的预定图案中的触点的每个阵列被固定到每个阵列上，其中触点焊盘与第一 领导。 提供了第一封装装置，用于封装半导体本体和第一引线的内端，第一引线的外端没有第一封装装置。 在第一次封装之后，第一引线的外端与材料片分离。 然后将多个间隔开的第二引线固定到第一引线的外端。 然后提供第二封装装置，用于封装第一封装装置，第一引线的外端和第二引线的内端与第二引线的外端自由。

公开(公告)号：US4003073A

公开(公告)日：1977-01-11

申请号：US296186

申请日：1972-10-10

申请人： Robert W. Helda ,  Harry J. Geyer

发明人： Robert W. Helda ,  Harry J. Geyer

IPC分类号： H01L21/607 ,  H01L23/057 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48 ,  H01L23/28 ,  H01L23/30

CPC分类号： H01L23/49541 ,  H01L23/057 ,  H01L23/3107 ,  H01L23/49524 ,  H01L24/86 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14

摘要： Wire bonding is eliminated in the assembly of microelectronic devices, by a process involving the direct bonding of circuit electrodes to an unsupported metallic sheet-frame member having a plurality of inwardly extending leads. A single-step vibratory pressure welding technique is employed for the simultaneous bonding of all leads to a semiconductor integrated circuit chip. Lateral confinement of the leads during the bonding steps causes a buckling action to introduce a small but critical loop in each lead to ensure clearance between the lead fingers and the perimeter of the semiconductor chip, whereby electrical shorting is avoided. The loop also provides a structural flexibility in the leads, which tends to protect the bonding sites from excessive stresses. Subsequently, the first frame member including the bonded circuit is attached, preferably by resistance welding, to a second lead frame member of heavier gage and increased dimensions, suitable for connection with external circuitry. Excess portions of the first frame member are then removed, providing a completed assembly for packaging; e.g., plastic encapsulation or hermetic sealing, as in a ceramic-glass flat package.

摘要翻译： 通过涉及将电路电极直接接合到具有多个向内延伸的引线的未支撑的金属片框架构件的工艺，在微电子器件的组装中消除引线接合。 采用单步振动压焊技术将所有引线同时连接到半导体集成电路芯片。 在接合步骤期间引线的横向限制导致弯曲作用，以在每个引线中引入小但关键的环，以确保引线指与半导体芯片的周边之间的间隙，从而避免电短路。 该回路还在引线中提供了结构灵活性，这倾向于保护结合部位免受过大的应力。 随后，包括接合电路的第一框架构件优选地通过电阻焊接被附接到较重的规格的第二引线框架构件并且具有适于与外部电路连接的尺寸。 然后移除第一框架构件的多余部分，提供用于包装的完整组件; 例如塑料封装或气密密封，如陶瓷 - 玻璃扁平封装。

公开(公告)号：US3975201A

公开(公告)日：1976-08-17

申请号：US415948

申请日：1973-11-15

申请人： Bernard Greenstein

发明人： Bernard Greenstein

IPC分类号： C09D11/02 ,  H01L21/48 ,  H01L23/057 ,  H01L23/10 ,  H05K1/09 ,  C08K3/20 ,  C08K3/40 ,  C08K5/05 ,  C08K5/10

CPC分类号： H01L23/057 ,  C09D11/02 ,  H01L21/4867 ,  H01L23/10 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16152 ,  H05K1/097 ,  Y10S106/901

摘要： The drying characeteristics of a printing paste comprising a vehicle containing a binder and a low boiling point solvent are improved by substituting a high boiling point solvent for a portion of the low boiling point solvent without substantially adversely affecting the viscosity and flow properties of the paste. The printing paste is advantageously employed in silk screen printing in multiple passes where printed layers must have a uniform degree of wetness. The printing paste and vehicle are especially useful in the manufacture of microelectronic packages.

摘要翻译： 包含含有粘合剂和低沸点溶剂的载体的印刷浆料的干燥特征通过用高沸点溶剂代替一部分低沸点溶剂而不会对粘合剂的粘度和流动性质产生实质上的不利影响而被改进。 印刷浆料有利地用于丝网印刷多次，其中印刷层必须具有均匀的湿度。 印刷浆料和载体在微电子封装的制造中特别有用。

公开(公告)号：US3958195A

公开(公告)日：1976-05-18

申请号：US560674

申请日：1975-03-21

申请人： Joseph H. Johnson

发明人： Joseph H. Johnson

IPC分类号： H01L23/057 ,  H01L23/66 ,  H01L23/12 ,  H01P1/00

CPC分类号： H01L23/057 ,  H01L23/66 ,  H01L24/49 ,  H01L2223/6644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/30105 ,  H01L2924/30107

摘要： In a radio frequency transistor package, a layer of metallization is deposited on an electrically insulative thermally conductive ceramic substrate member serving as a heat sink. An insular region of the metallization serves as a pad for receiving a transistor die with the collector region of the transistor bonded to the insular region of metallization. The region of the metallization surrounding the pad comprises a ground plane. An apertured ceramic insulative spacer is bonded over the ground plane metallization with the aperture in registration over the transistor. Input, output and a pair of common lead metal strips are bonded to the upper surface of the spacer in generally coplanar configuration. The two common leads extend across the spacer adjacent opposite sides of the aperture in generally tangential relation thereto. The input and output leads are disposed in between the common leads and are interrupted by the central aperture in the spacer. The common leads are electrically interconnected to the ground plane metallization layer via conductive means extending through the aperture in the spacer. The input lead is connected to one of the base or emitter regions of the transistor die via wire bonding leads extending through the aperture in the spacer. The other base or emitter region of the transistor die is connected via parallel wire bonding leads to the surrounding ground plane metallization. The output lead is connected via a set of parallel wire bond leads through the central aperture to the transistor pad.

公开(公告)号：US3947953A

公开(公告)日：1976-04-06

申请号：US499947

申请日：1974-08-23

申请人： Takeshi Okada ,  Sanenobu Sonoda ,  Katsumi Yamamoto ,  Masahiro Fujimori

发明人： Takeshi Okada ,  Sanenobu Sonoda ,  Katsumi Yamamoto ,  Masahiro Fujimori

IPC分类号： H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L23/495 ,  H01L23/498 ,  H01L21/304 ,  B29C6/02

CPC分类号： H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L23/49579 ,  H01L23/49861 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2924/166 ,  Y10T29/49121

摘要： The external lead frame for a plastic sealed, cavity molded type semi-conductor device is formed of Phospor bronze, with the bronze lead frame liquid honed, it is pre-heated and supported in a mold cavity so as to be embedded into a powder epoxy resin molded header with improved sealing between the Phospor bronze lead frame in the header molded thereabove.

摘要翻译： 用于塑料密封型腔模制型半导体器件的外部引线框架由Phospor青铜形成，青铜引线框架液体被珩磨，它被预热并支撑在模腔中，以便嵌入粉末环氧树脂 树脂模制头部，在上面形成的头部中的磷硅青铜引线框架之间具有改进的密封。

公开(公告)号：US3916434A

公开(公告)日：1975-10-28

申请号：US42315773

申请日：1973-12-10

申请人： POWER HYBRIDS INC

发明人： GARBOUSHIAN VAHAN

IPC分类号： H01L23/055 ,  H01L23/057 ,  H01L23/02 ,  H01L23/12

CPC分类号： H01L23/057 ,  H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

摘要： Semi-conductor devices and other miniature circuit elements are hermetically sealed by mounting them on a peripherally metallized ceramic carrier, brazing a metal ring to carrier and brazing a ceramic cover onto the ring; the cover has also peripheral metallization, so that the hermetic seal results from metal-tometal bond. The carrier is provided with metallized apertures as electrical feed through into the space as defined by carrier, ring and cover. Metal leads are soldered to the metallization of the apertures on the outside of the carrier, while connections are made from the circuit elements to the metallization of and around the apertures in the said inside mounting space.

摘要翻译： 半导体器件和其他微型电路元件通过将其安装在外围金属化的陶瓷载​​体上而密封，将金属环钎焊到载体上并将陶瓷盖钎焊到环上; 该盖也具有外围金属化，使得气密密封由金属 - 金属键结合。 载体具有金属化孔，作为电馈送通过载体，环和盖所限定的空间。 金属引线被焊接到载体外部的孔的金属化，同时从电路元件到所述内部安装空间中的孔的金属化和连接。

公开(公告)号：US3914858A

公开(公告)日：1975-10-28

申请号：US49994674

申请日：1974-08-23

申请人： NITTO ELECTRIC IND CO

发明人： SONODA SANENOBU ,  FUJIMORI MASAHIRO ,  YAMAMOTO KATSUMI ,  KOBAYASHI SEIKI

IPC分类号： H01L23/057 ,  H01L23/16 ,  B01J17/00

CPC分类号： H01L23/057 ,  H01L23/16 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00

摘要： A method of making a cavity molded type semiconductor device with an external lead frame is disclosed wherein the external lead frame is prepared with a liquid honing treatment prior to its being molded into a base portion after molding, and after molding, the portion of the lead frame extending into a cavity and the mating surface of the base portion are again subjected to a liquid honing treatment. The two liquid honing treatments serve to markedly increase the ability to prevent leakage of atmospheric air into the sealed cavity of the finished molded semiconductor device.

摘要翻译： 公开了一种制造具有外部引线框架的模腔型半导体器件的方法，其中外部引线框架在模制成型后成为基底部分之后用液体珩磨处理制备，并且在模制之后，引线部分 框架延伸到空腔中，并且基部的配合表面再次进行液体珩磨处理。 两种液体珩磨处理用于显着增加防止大气进入成品模制半导体器件的密封腔中的泄漏的能力。