公开(公告)号：US08217503B2

公开(公告)日：2012-07-10

申请号：US12881372

申请日：2010-09-14

申请人： Yueh-Se Ho ,  Yan Xun Xue ,  Jun Lu

发明人： Yueh-Se Ho ,  Yan Xun Xue ,  Jun Lu

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L24/49 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/4103 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49111 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01082 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/84

摘要： A package structure for DC-DC converter disclosed herein can reduce the number of encapsulated elements as a low-side MOSFET chip can be stacked above the high-side MOSFET chip of a first die pad, through die pads of different thicknesses or interposers with joint parts of different thicknesses; moreover, it further reduces the size of the entire semiconductor package as a number of bond wires are contained in the space between the controller and the low-side MOSFET chip. Moreover, electrical connection between the top source electrode pin and the bottom source electrode pin of the low-side MOSFET chip is realized with a metal joint plate, such that when the DC-DC converter is sealed with plastic, the metal joint plate can be exposed outside to improve the thermal performance and effectively reduce the thickness of the semiconductor package.

摘要翻译： 本文公开的用于DC-DC转换器的封装结构可以减少封装元件的数量，因为低侧MOSFET芯片可以堆叠在第一裸片焊盘的高侧MOSFET芯片上方，通过具有不同厚度的芯片焊盘或具有接头的插入件 不同厚度的零件; 而且，由于控制器和低侧MOSFET芯片之间的空间中包含多个接合线，因此进一步减小了整个半导体封装的尺寸。 此外，利用金属接合板实现了顶部源极电极引脚和低端MOSFET芯片的底部源极电极引脚之间的电连接，使得当DC-DC转换器用塑料密封时，金属接合板可以 暴露在外面以改善热性能并有效地减小半导体封装的厚度。

公开(公告)号：US20120161304A1

公开(公告)日：2012-06-28

申请号：US13411990

申请日：2012-03-05

申请人： Kai Liu ,  Lei Shi ,  Jun Lu ,  Anup Bhalla

发明人： Kai Liu ,  Lei Shi ,  Jun Lu ,  Anup Bhalla

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49589 ,  H01L24/29 ,  H01L24/32 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/24247 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/92246 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A dual-leadframe multi-chip package comprises a first leadframe with a first die pad, and a second leadframe with a second die pad; a first chip mounted on the first die pad functioning as a high-side MOSFET and second chip mounted on the second die pad functioning as a low-side MOSFET. The package may further comprises a bypass capacity configured as a third chip mounted on the first die pad or integrated with the first chip. The package may further comprise a three-dimensional connecting plate formed as an integrated structure as the second die pad for electrically connecting a top contact area of the first chip to a bottom contact area of the second chip. A top connecting plate connects a top contact area of the second chip and a top contact area of the third chip to an outer pin of the first leadframe.

摘要翻译： 双引线框多芯片封装包括具有第一管芯焊盘的第一引线框架和具有第二管芯焊盘的第二引线框架; 安装在用作高边MOSFET的第一芯片焊盘上的第一芯片和安装在用作低端MOSFET的第二芯片焊盘上的第二芯片。 封装还可以包括配置为安装在第一裸片焊盘上或与第一芯片集成的第三芯片的旁路容量。 封装还可以包括形成为一体结构的三维连接板作为第二芯片焊盘，用于将第一芯片的顶部接触区域电连接到第二芯片的底部接触区域。 顶部连接板将第二芯片的顶部接触区域和第三芯片的顶部接触区域连接到第一引线框架的外部引脚。

公开(公告)号：US20120061813A1

公开(公告)日：2012-03-15

申请号：US12881372

申请日：2010-09-14

申请人： Yueh-Se Ho ,  Yan Xun Xue ,  Jun Lu

发明人： Yueh-Se Ho ,  Yan Xun Xue ,  Jun Lu

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L24/49 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/4103 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49111 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01082 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/84

摘要： A package structure for DC-DC converter disclosed herein can reduce the number of encapsulated elements as a low-side MOSFET chip can be stacked above the high-side MOSFET chip of a first die pad, through die pads of different thicknesses or interposers with joint parts of different thicknesses; moreover, it further reduces the size of the entire semiconductor package as a number of bond wires are contained in the space between the controller and the low-side MOSFET chip. Moreover, electrical connection between the top source electrode pin and the bottom source electrode pin of the low-side MOSFET chip is realized with a metal joint plate, such that when the DC-DC converter is sealed with plastic, the metal joint plate can be exposed outside to improve the thermal performance and effectively reduce the thickness of the semiconductor package.

摘要翻译： 本文公开的用于DC-DC转换器的封装结构可以减少封装元件的数量，因为低侧MOSFET芯片可以堆叠在第一裸片焊盘的高侧MOSFET芯片上方，通过具有不同厚度的芯片焊盘或具有接头的插入件 不同厚度的零件; 而且，由于控制器和低侧MOSFET芯片之间的空间中包含多个接合线，因此进一步减小了整个半导体封装的尺寸。 此外，利用金属接合板实现了顶部源极电极引脚和低端MOSFET芯片的底部源极电极引脚之间的电连接，使得当DC-DC转换器用塑料密封时，金属接合板可以 暴露在外面以改善热性能并有效地减小半导体封装的厚度。

公开(公告)号：US08058961B2

公开(公告)日：2011-11-15

申请号：US13021347

申请日：2011-02-04

申请人： François Hébert ,  Tao Feng ,  Xiaotian Zhang ,  Jun Lu

发明人： François Hébert ,  Tao Feng ,  Xiaotian Zhang ,  Jun Lu

IPC分类号： H01F5/00

CPC分类号： H01F17/062

摘要： A lead frame-based discrete power inductor is disclosed. The power inductor includes top and bottom lead frames, the leads of which form a coil around a single closed-loop magnetic core. The coil includes interconnections between inner and outer contact sections of the top and bottom lead frames, the magnetic core being sandwiched between the top and bottom lead frames. Ones of the leads of the top and bottom lead frames have a generally non-linear, stepped configuration such that the leads of the top lead frame couple adjacent leads of the bottom lead frame about the magnetic core to form the coil.

摘要翻译： 公开了一种基于引线框架的分立功率电感器。 功率电感器包括顶部和底部引线框架，其引线围绕单个闭环磁芯形成线圈。 线圈包括顶部和底部引线框架的内部和外部接触部分之间的互连，磁芯夹在顶部和底部引线框架之间。 顶部引线框架和底部引线框架的引线的一部分具有大致非线性的阶梯状构造，使得顶部引线框架的引线将底部引线框架的相邻引线围绕磁芯耦合以形成线圈。

公开(公告)号：US20110257854A1

公开(公告)日：2011-10-20

申请号：US12763532

申请日：2010-04-20

申请人： Christopher E. Whitney ,  Robert C. Simon, JR. ,  William L. Aldrich, III ,  Jun Lu ,  Birendra P. Bhattarai ,  Adam J. Heisel ,  Ning Jin

发明人： Christopher E. Whitney ,  Robert C. Simon, JR. ,  William L. Aldrich, III ,  Jun Lu ,  Birendra P. Bhattarai ,  Adam J. Heisel ,  Ning Jin

IPC分类号： G06F19/00

CPC分类号： F02D29/02 ,  B60K6/48 ,  B60W30/1884 ,  B60W50/0097 ,  B60W50/087 ,  B60W2050/0091 ,  B60W2510/0233 ,  B60W2510/0638 ,  B60W2540/10 ,  B60W2710/0622 ,  F02D41/1497 ,  Y02T10/6221

摘要： A minimum torque module selectively determines a first minimum propulsion torque based on second and third minimum propulsion torques when a torque converter clutch is in unlocked and locked states, respectively. A zero pedal torque module selectively sets a zero pedal torque equal to the first minimum propulsion torque. A pedal request module determines a pedal torque request based on an accelerator pedal position, a vehicle speed, and the zero pedal torque. A driver request module determines a driver axle torque request based on the pedal torque request. A shaping module selectively shapes the driver axle torque request into a shaped driver axle torque request. A conversion module converts the first minimum propulsion torque into a minimum axle torque. A final driver request module sets a final driver axle torque request equal to a greater of the shaped driver axle torque request and the minimum axle torque.

摘要翻译： 当变矩器离合器分别处于解锁和锁定状态时，最小扭矩模块基于第二和第三最小推进力矩选择性地确定第一最小推进力矩。 零踏板扭矩模块选择性地设定等于第一最小推进力矩的零踏板扭矩。 踏板请求模块基于加速器踏板位置，车速和零踏板扭矩确定踏板扭矩请求。 驱动器请求模块基于踏板扭矩请求确定驱动器轴转矩请求。 成形模块将驱动器轴扭矩请求选择性地变形成成形的驱动器轴扭矩请求。 转换模块将第一最小推进转矩转换成最小轴转矩。 最终驾驶员请求模块设置最终驾驶员轴扭矩请求等于成形驱动器轴扭矩请求和最小轴转矩的较大值。

公开(公告)号：US20110091352A1

公开(公告)日：2011-04-21

申请号：US12757852

申请日：2010-04-09

申请人： Zhigang Z. Fang ,  Jun Lu ,  Peng Fan ,  Hong Yong Sohn ,  Young Joon Choi

发明人： Zhigang Z. Fang ,  Jun Lu ,  Peng Fan ,  Hong Yong Sohn ,  Young Joon Choi

IPC分类号： C22C28/00 ,  C22C1/00

CPC分类号： C22C24/00 ,  B22F1/0018 ,  B22F9/023 ,  B22F9/10 ,  B22F2009/041 ,  B82Y30/00 ,  C01B3/0031 ,  C01B6/04 ,  C01B6/24 ,  C01B6/243 ,  C22C1/1084 ,  C22C23/00 ,  C22C23/02 ,  Y02E60/327

摘要： A light metal solid solution alloy for reversible hydrogen storage can include a light metal solid solution alloy of M1 and M2. M1 and M2 are different and independently selected from the group consisting of Li, Mg, Al, Na, Be, and Si. Furthermore, the starting materials and formation conditions are chosen such that the resulting alloy has a hydrogenated state and a dehydrogenated state which are each solid solutions.

摘要翻译： 用于可逆储氢的轻金属固溶体合金可以包括M1和M2的轻金属固溶体合金。 M1和M2不同且独立地选自Li，Mg，Al，Na，Be和Si。 此外，选择起始材料和形成条件使得所得合金具有氢固态和脱氢状态，它们均为固溶体。

公开(公告)号：US20110073999A1

公开(公告)日：2011-03-31

申请号：US12652881

申请日：2010-01-06

申请人： Zhi Qiang Niu ,  Jun Lu ,  Tao Feng

发明人： Zhi Qiang Niu ,  Jun Lu ,  Tao Feng

IPC分类号： H01L23/34 ,  H01L23/495 ,  H01L21/50

CPC分类号： H01L21/4871 ,  H01L21/4821 ,  H01L23/49562 ,  H01L23/49568 ,  H01L24/39 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/0603 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： This invention discloses a mixed alloy lead frame for power semiconductor devices, which includes a plurality of heat sinks and a pin array; the heat sinks are made of the first material, with positioning holes on their upper parts and welding zones at the center of their lower parts, while the pin array is made of the second material, which is different from the first material, with a plurality of sets of terminals leading out from its upper end and lower end respectively. The heat sinks are positioned on the lead frame assembly welding plate, the pin is positioned in the area between the upper heat sinks and lower heat sinks on the lead frame assembly welding plate. The mixed alloy lead frame for power semiconductor devices in this invention improves the heat dissipation of lead frame, reduces the fabrication cost of lead frame, and enhances the flexibility of fabrication.

摘要翻译： 本发明公开了一种用于功率半导体器件的混合合金引线框架，其包括多个散热器和引脚阵列; 散热器由第一材料制成，其上部具有定位孔，在其下部中心处具有焊接区，而销阵列由与第一材料不同的第二材料制成，具有多个 的端子分别从其上端和下端引出。 散热器定位在引线框组件焊接板上，引脚定位在引线框组件焊接板上的上散热器和下散热器之间的区域中。 本发明的功率半导体装置用混合合金引线框架，改善了引线框架的散热，降低了引线框架的制造成本，提高了制造的灵活性。

公开(公告)号：US07846532B2

公开(公告)日：2010-12-07

申请号：US11081947

申请日：2005-03-17

申请人： Jun Lu ,  Brian James Daer

发明人： Jun Lu ,  Brian James Daer

IPC分类号： G02B27/00 ,  B32B3/00 ,  B32B17/10 ,  B32B27/00

CPC分类号： B32B17/10761 ,  B32B17/10 ,  B32B17/10036 ,  B32B17/10568 ,  B32B27/08 ,  B32B27/22 ,  B32B27/30 ,  B32B27/42 ,  B32B2250/02 ,  B32B2250/24 ,  B32B2307/102 ,  B32B2605/006 ,  G02B27/01 ,  Y10T428/24479 ,  Y10T428/24612 ,  Y10T428/24777 ,  Y10T428/2495 ,  Y10T428/3163 ,  Y10T428/31942 ,  B32B2367/00

摘要： The present invention is in the field of polymer interlayers and multiple layer glass panels comprising polymer interlayers, and, more specifically, the present invention is in the field of wedge shaped polymer interlayers.

摘要翻译： 本发明在聚合物中间层和包含聚合物夹层的多层玻璃面的领域中，更具体地说，本发明在楔形聚合物夹层领域。

公开(公告)号：US07775836B2

公开(公告)日：2010-08-17

申请号：US12420921

申请日：2009-04-09

申请人： Jun Lu ,  De-Hua Liu

发明人： Jun Lu ,  De-Hua Liu

IPC分类号： H01R24/00

CPC分类号： H04M1/026 ,  Y10T24/10 ,  Y10T24/33

摘要： A chip card holder used to fixing a chip card comprises a housing defining a receiving slot configured for receiving a chip card therein; a stop cushion for assembly in the receiving slot for resisting against the chip card to restrict movement of the chip card in the receiving slot. The chip card can avoid moving in the receiving slot and enhance the stability of portable electronic devices.

摘要翻译： 用于固定芯片卡的芯片卡座包括：外壳，其限定用于在其中接收芯片卡的接收槽; 用于组装在接收槽中的止挡垫，用于抵抗芯片卡以限制芯片卡在接收槽中的移动。 芯片卡可以避免在接收槽中移动，增强便携式电子设备的稳定性。

公开(公告)号：US20100177660A1

公开(公告)日：2010-07-15

申请号：US12319905

申请日：2009-01-13

申请人： Steven Essinger ,  Xiaoxun Zhu ,  Michael Schnee ,  JiBin Liu ,  Xin Shen ,  LiangLiang Chen ,  Jun Lu

发明人： Steven Essinger ,  Xiaoxun Zhu ,  Michael Schnee ,  JiBin Liu ,  Xin Shen ,  LiangLiang Chen ,  Jun Lu

IPC分类号： H04L12/28

CPC分类号： H04W4/001 ,  H04W4/50 ,  H04W16/00 ,  H04W84/10 ,  H04W84/18 ,  H04W88/00

摘要： Various wireless network components that offer increased flexibility, ease of use, functionality and performance in many demanding applications in diverse fields of use, namely: a wireless multi-function network device for use on a wireless communication network, that can serve multiple functions and dynamically switch and reconfigure from a network router into a network coordinator in the event that the originally designated network coordinator is permanently or temporally disabled; a wireless mesh-type communication network, including a plurality of wireless network router devices, each capable of performing the functions of a network controller/coordinator; a wireless network router device for use on a wireless communication network, and employing an integrated phased-array antenna structure, supporting the spatial isolation of multi-regions, and utilizing beam steering principles of operation, for illuminating multiple wireless network end-devices over separate regions; a network gateway device that supports a USB-type communication interface and RF-based wireless communication interface; a network protocol translation (NPT) based gateway device for use in a wireless communication network; and wireless network coordinator device for automatically establishing a Personal Area Network (PAN) on a wireless communication network, and having a compact housing with an electrical wall plug integrated therein having electrical prongs for plugging into a standard electrical wall socket.

摘要翻译： 各种无线网络组件在不同使用领域的许多苛刻应用中提供了增强的灵活性，易用性，功能性和性能，即：在无线通信网络上使用的无线多功能网络设备，可以提供多种功能和动态 在原始指定的网络协调器永久或暂时禁用的情况下，从网络路由器切换和重配置到网络协调器中; 无线网状通信网络，包括多个无线网络路由器设备，每个能够执行网络控制器/协调器的功能; 用于在无线通信网络上使用的无线网络路由器设备，以及采用集成的相控阵天线结构，支持多区域的空间隔离，以及利用波束操纵原理，用于单独地照射多个无线网络终端设备 区域; 支持USB型通信接口和基于RF的无线通信接口的网络网关设备; 基于网络协议转换（NPT）的网关设备，用于无线通信网络; 以及用于在无线通信网络上自动建立个人区域网络（PAN）的无线网络协调器设备，并且具有紧凑的壳体，其中集成有电壁插塞，其中具有用于插入标准电壁插座的电插脚。