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    Setting up a wafer inspection process using programmed defects
    131.
    发明授权
    Setting up a wafer inspection process using programmed defects 有权
    使用编程缺陷设置晶圆检查过程

    公开(公告)号：US09347862B2

    公开(公告)日：2016-05-24

    申请号：US14303601

    申请日：2014-06-13

    Applicant: KLA-Tencor Corporation

    Inventor： Graham Michael Lynch

    IPC: G01N21/00 ,  G01N1/28 ,  G01N21/95 ,  H01L21/66

    CPC classification number: G01N1/28 ,  G01N21/9501 ,  H01L22/12 ,  H01L22/30

    Abstract: Methods and systems for setting up a wafer inspection process using programmed defects are provided. One method includes altering a design for a dummy area of a production chip such that printing of the dummy area on a wafer results in printing of a variety of defects. Two or more of the defects have different types, one or more different characteristics, different contexts in the design, or a combination thereof. The dummy area printed on a wafer may then be scanned with two or more optical modes of an inspection system to determine which of the optical mode(s) are better for defect detection. Additional areas of the wafer may then be scanned with the optical mode(s) that are better for defect detection to determine noise information. The noise information may then be used to select one or more of the optical modes for use in a wafer inspection process.

    Abstract translation: 提供了使用编程缺陷设置晶圆检查过程的方法和系统。 一种方法包括改变生产芯片的虚拟区域的设计，使得晶片上的虚拟区域的打印导致打印各种缺陷。 两个或更多个缺陷具有不同的类型，一个或多个不同特征，设计中的不同上下文或其组合。 然后可以用检查系统的两个或多个光学模式扫描印刷在晶片上的虚拟区域，以确定哪种光学模式对于缺陷检测更好。 然后可以利用更好的缺陷检测以确定噪声信息的光学模式来扫描晶片的附加区域。 然后可以使用噪声信息来选择在晶片检查过程中使用的一种或多种光学模式。

    Tuning wafer inspection recipes using precise defect locations
    132.
    发明授权
    Tuning wafer inspection recipes using precise defect locations 有权
    使用精确的缺陷位置调整晶圆检查配方

    公开(公告)号：US09224660B2

    公开(公告)日：2015-12-29

    申请号：US14470916

    申请日：2014-08-27

    Applicant: KLA-Tencor Corporation

    Inventor： Ashok V. Kulkarni ,  Lisheng Gao ,  Junqing Huang

    IPC: G01N21/00 ,  H01L21/66 ,  G01N21/95

    CPC classification number: H01L22/12 ,  G01N21/9501 ,  H01L22/20

    Abstract: Systems and methods for determining one or more parameters of a wafer inspection process are provided. One method includes aligning optical image(s) of an alignment target to their corresponding electron beam images generated by an electron beam defect review system. The method also includes determining different local coordinate transformations for different subsets of alignment targets based on results of the aligning. In addition, the method includes determining positions of defects in wafer inspection system coordinates based on coordinates of the defects determined by the electron beam defect review system and the different local coordinate transformations corresponding to different groups of the defects into which the defects have been separated. The method further includes determining one or more parameters for an inspection process for the wafer based on defect images acquired at the determined positions by a wafer inspection system.

    Abstract translation: 提供了用于确定晶片检查过程的一个或多个参数的系统和方法。 一种方法包括将对准靶的光学图像与由电子束缺陷检查系统产生的相应的电子束图像对准。 该方法还包括基于对准的结果确定不同的对准目标子集的不同局部坐标变换。 此外，该方法包括基于由电子束缺陷评估系统确定的缺陷的坐标以及对应于缺陷已分离的缺陷的不同组的不同局部坐标变换来确定晶片检查系统坐标中缺陷的位置。 该方法还包括基于由晶片检查系统在所确定的位置处获取的缺陷图像来确定用于晶片的检查处理的一个或多个参数。

    Wafer inspection
    134.
    发明授权
    Wafer inspection 有权
    晶圆检查

    公开(公告)号：US08891079B2

    公开(公告)日：2014-11-18

    申请号：US13822281

    申请日：2011-12-07

    Applicant: Guoheng Zhao ,  Jenn-Kuen Leong ,  Mehdi Vaez-Iravani

    Inventor： Guoheng Zhao ,  Jenn-Kuen Leong ,  Mehdi Vaez-Iravani

    IPC: G01N21/00 ,  G01J4/00 ,  G01N21/88 ,  G01N21/95 ,  H01L21/66

    CPC classification number: G01N21/9501 ,  G01N21/21 ,  G01N21/47 ,  G01N21/8806 ,  G01N2201/06113 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Systems and methods for inspecting a wafer are provided. One system includes an illumination subsystem configured to illuminate the wafer; a collection subsystem configured to collect light scattered from the wafer and to preserve the polarization of the scattered light; an optical element configured to separate the scattered light collected in different segments of the collection numerical aperture of the collection subsystem, where the optical element is positioned at a Fourier plane or a conjugate of the Fourier plane of the collection subsystem; a polarizing element configured to separate the scattered light in one of the different segments into different portions of the scattered light based on polarization; and a detector configured to detect one of the different portions of the scattered light and to generate output responsive to the detected light, which is used to detect defects on the wafer.

    Abstract translation: 提供了用于检查晶片的系统和方法。 一个系统包括配置成照亮晶片的照明子系统; 收集子系统，被配置为收集从晶片散射的光并保持散射光的偏振; 光学元件，被配置为将收集在收集子系统的收集数值孔径的不同段中的散射光分离，其中所述光学元件位于所述收集子系统的傅立叶平面或所述傅立叶平面的共轭处; 偏振元件，被配置为基于极化将所述不同段中的一个中的散射光分离成所述散射光的不同部分; 以及检测器，被配置为检测散射光的不同部分中的一个，并且响应于检测到的光而产生输出，所述检测光用于检测晶片上的缺陷。

    Computer-implemented methods for inspecting and/or classifying a wafer
    136.
    发明授权
    Computer-implemented methods for inspecting and/or classifying a wafer 有权
    用于检查和/或分类晶片的计算机实现的方法

    公开(公告)号：US08269960B2

    公开(公告)日：2012-09-18

    申请号：US12179260

    申请日：2008-07-24

    Applicant: Juergen Reich ,  Louis Vintro ,  Prasanna Dighe ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Stephen Biellak

    Inventor： Juergen Reich ,  Louis Vintro ,  Prasanna Dighe ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Stephen Biellak

    IPC: G01N21/00

    CPC classification number: H01L22/12 ,  G01N21/9501 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.

    Abstract translation: 提供了用于检查和/或分类晶片的计算机实现的方法。 一种计算机实现的包括使用一个或多个缺陷检测参数来检测晶片上的缺陷，所述缺陷检测参数是基于使用响应于由检查系统产生的晶片散射的光的输出而确定的晶片的非空间局部特征确定的。 另一种计算机实现的方法包括基于使用响应于由检查系统产生的晶片散射的光的输出确定的晶片的非空间局部化特性和使用输出确定的晶片的空间局部化特性的组合来分类晶片 。

    Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers
    137.
    发明授权
    Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers 有权
    用于为晶片执行测量的过程创建或执行动态采样方案的方法和系统

    公开(公告)号：US08175831B2

    公开(公告)日：2012-05-08

    申请号：US12107346

    申请日：2008-04-22

    Applicant: Pavel Izikson ,  John Robinson ,  Mike Adel ,  Amir Widmann ,  Dongsub Choi ,  Anat Marchelli

    Inventor： Pavel Izikson ,  John Robinson ,  Mike Adel ,  Amir Widmann ,  Dongsub Choi ,  Anat Marchelli

    IPC: G01N37/00

    CPC classification number: G05B21/02 ,  G03F7/70508 ,  G03F7/70625 ,  G03F7/70633

    Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one lot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.

    Abstract translation: 提供了用于创建或执行在晶片上执行测量的过程的动态采样方案的各种方法和系统。 用于为在晶片上进行测量的过程创建动态采样方案的一种方法包括在晶片上的所有测量点处对至少一批中的所有晶片进行测量。 该方法还包括基于测量结果确定用于该过程的动态采样方案的最佳采样方案，增强采样方案，减少采样方案和阈值。 阈值对应于最佳采样方案，增强采样方案和减少采样方案将用于该过程的测量值。

    Segmented polarizer for optimizing performance of a surface inspection system
    138.
    发明授权
    Segmented polarizer for optimizing performance of a surface inspection system 有权
    分段偏振器，用于优化表面检测系统的性能

    公开(公告)号：US08169613B1

    公开(公告)日：2012-05-01

    申请号：US12618620

    申请日：2009-11-13

    Applicant: Stephen Biellak ,  Daniel Kavaldjiev

    Inventor： Stephen Biellak ,  Daniel Kavaldjiev

    IPC: G01J4/00

    CPC classification number: G01J1/0422 ,  G01J1/0429 ,  G01N21/8806 ,  G01N21/9501 ,  G02B5/3025 ,  G02B5/3075

    Abstract: A polarizing device may be used with sample inspection system having one or more collection systems that receive scattered radiation from a region on a sample surface and direct it to a detector. The polarizing device disposed between the collection system(s) and the detector. The polarizing device may include a plurality of polarizing sections. The sections may be characterized by different polarization characteristics. The polarizing device is configured to transmit scattered radiation from defects to the detector and to block noise from background sources that do not share characteristics with scattered radiation from the defects from reaching the detector while, maximizing a capture rate for the defects the detector at a less than optimal signal-to-noise ratio.

    Abstract translation: 可以使用具有一个或多个收集系统的样本检查系统的偏振装置，其接收来自样品表面上的区域的散射辐射并将其引导到检测器。 设置在收集系统和检测器之间的偏振装置。 偏振装置可以包括多个偏振部分。 这些部分可以具有不同的偏振特性。 偏振装置被配置为将来自缺陷的散射辐射传输到检测器并且阻止来自背景源的噪声，其不与来自缺陷的散射辐射共享特征以到达检测器，同时使检测器的缺陷的捕获率最小化 比最佳信噪比。

    Systems and methods for blocking specular reflection and suppressing modulation from periodic features on a specimen
    140.
    发明授权
    Systems and methods for blocking specular reflection and suppressing modulation from periodic features on a specimen 有权
    用于阻挡镜面反射并抑制样品周期特征的调制的系统和方法

    公开(公告)号：US07940384B2

    公开(公告)日：2011-05-10

    申请号：US11957985

    申请日：2007-12-17

    Applicant: Andrew V. Hill ,  Robert M. Danen

    Inventor： Andrew V. Hill ,  Robert M. Danen

    IPC: G01N21/00

    CPC classification number: G01N21/95623 ,  G01N21/9501 ,  G01N2021/95676 ,  G02B27/46

    Abstract: Systems and methods for blocking specular reflection and suppressing modulation from periodic features on a specimen are provided. One inspection system configured to block specular reflection and suppress modulation in an image of a specimen includes an illumination subsystem configured to illuminate the specimen with a predetermined pattern of spatially incoherent light. The system also includes an optical element configured to block light reflected from periodic features formed on the specimen and at least some light diffracted from the periodic features. The system further includes a detector configured to detect light that passes through the optical element and to generate an image of the specimen in response to the detected light. The optical element blocks specular reflection and at least partially suppresses modulation in the image due to the periodic features. The system also includes a processor configured to detect defects on the specimen using the image.

    Abstract translation: 提供了用于阻挡镜面反射并抑制样本上的周期特征的调制的系统和方法。 配置为阻挡镜面反射并抑制样本图像中的调制的一个检查系统包括被配置为以预定的空间非相干光图案来照射样本的照明子系统。 该系统还包括光学元件，其被配置为阻挡从形成在样本上的周期特征反射的光和从周期特征衍射的至少一些光。 该系统还包括检测器，其被配置为检测通过光学元件的光并且响应于检测到的光而产生样本的图像。 光学元件阻挡镜面反射并且至少部分地抑制由于周期特征导致的图像中的调制。 该系统还包括处理器，其被配置为使用图像检测样本上的缺陷。

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