Semiconductor memory device and method of manufacturing the same
    131.
    发明申请
    Semiconductor memory device and method of manufacturing the same 失效
    半导体存储器件及其制造方法

    公开(公告)号:US20050110067A1

    公开(公告)日:2005-05-26

    申请号:US10901996

    申请日:2004-07-30

    IPC分类号: H01L27/108 H01L21/8242

    CPC分类号: H01L27/10867 H01L27/10829

    摘要: A semiconductor memory device includes a trench formed in the semiconductor substrate, a diffusion layer for a first electrode formed within the semiconductor substrate so as to be in contact with an inner surface of the trench, a capacitor insulating film formed on the diffusion layer, a conductive layer for a second electrode formed so as to bury a lower portion of the trench, a first insulating film formed on the conductive layer and along a side surface of the trench, a first conductive layer formed so as to bury an intermediate portion of the trench, a first contact layer formed so as to bury an upper portion of the trench, and a second contact layer formed on the surface of the semiconductor substrate so as to be in contact with the first contact layer.

    摘要翻译: 半导体存储器件包括形成在半导体衬底中的沟槽,形成在半导体衬底内的与第一沟槽的内表面接触的第一电极的扩散层,形成在扩散层上的电容器绝缘膜, 用于第二电极的导电层,其形成为埋入沟槽的下部,形成在导电层上并沿着沟槽的侧表面的第一绝缘膜,形成为将第二绝缘膜的中间部分 沟槽,形成为埋入沟槽的上部的第一接触层和形成在半导体衬底的表面上以与第一接触层接触的第二接触层。

    Nonvolatile semiconductor memory device and method of manufacturing the same
    135.
    发明授权
    Nonvolatile semiconductor memory device and method of manufacturing the same 失效
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US08569133B2

    公开(公告)日:2013-10-29

    申请号:US13366509

    申请日:2012-02-06

    IPC分类号: H01L21/336

    摘要: A nonvolatile semiconductor memory device includes a plurality of memory strings, each of which has a plurality of electrically rewritable memory cells connected in series; and select transistors, one of which is connected to each of ends of each of the memory strings. Each of the memory strings is provided with a first semiconductor layer having a pair of columnar portions extending in a perpendicular direction with respect to a substrate, and a joining portion formed so as to join lower ends of the pair of columnar portions; a charge storage layer formed so as to surround a side surface of the columnar portions; and a first conductive layer formed so as to surround the side surface of the columnar portions and the charge storage layer, and configured to function as a control electrode of the memory cells. Each of the select transistors is provided with a second semiconductor layer extending upwardly from an upper surface of the columnar portions; and a second conductive layer formed so as to surround a side surface of the second semiconductor layer with a gap interposed, and configured to function as a control electrode of the select transistors.

    摘要翻译: 非易失性半导体存储器件包括多个存储串,每个存储串具有串联连接的多个电可重写存储单元; 并选择晶体管,其中一个连接到每个存储器串的每一端。 每个存储器串都具有第一半导体层,该第一半导体层具有相对于基板在垂直方向上延伸的一对柱状部分,以及形成为连接该一对柱状部分的下端的接合部分; 形成为围绕所述柱状部的侧面的电荷存储层; 以及形成为围绕柱状部分的侧面和电荷存储层的第一导电层,并且被配置为用作存储单元的控制电极。 每个选择晶体管设置有从柱状部分的上表面向上延伸的第二半导体层; 以及第二导电层,其被形成为以间隔开的方式围绕所述第二半导体层的侧表面,并且被配置为用作所述选择晶体管的控制电极。

    Nonvolatile semiconductor memory device and method for driving same
    136.
    发明授权
    Nonvolatile semiconductor memory device and method for driving same 有权
    非易失性半导体存储器件及其驱动方法

    公开(公告)号:US08559221B2

    公开(公告)日:2013-10-15

    申请号:US13651019

    申请日:2012-10-12

    IPC分类号: G11C16/04 G11C11/34

    CPC分类号: H01L27/11582 H01L27/1157

    摘要: According to one embodiment, a nonvolatile semiconductor memory device includes a memory unit and a control unit. The memory unit includes a charge storage film and a memory cell transistor. The transistor is provided for each of storage regions configured to store charge in the film. The control unit sets the transistors to an erase threshold by setting erase information in the regions; subsequently sets the transistors to thresholds corresponding to information having n values by programming the information having the n values to at least one of the regions in which the erase information is set; and controls information of at least one storage region before being programmed adjacent to the regions programmed with the information to have a value providing a threshold of the transistor nearer than the erase threshold to the thresholds corresponding to the information having the n values in the state of the transistors provided in the regions being set to the thresholds corresponding to the information having the n values.

    摘要翻译: 根据一个实施例,非易失性半导体存储器件包括存储器单元和控制单元。 存储单元包括电荷存储膜和存储单元晶体管。 针对被配置为在电影中存储电荷的每个存储区域提供晶体管。 控制单元通过设置区域中的擦除信息将晶体管设置为擦除阈值; 随后通过将具有n个值的信息编程到设置有擦除信息的区域中的至少一个来将晶体管设置为对应于具有n个值的信息的阈值; 并且在与所述信息编程的区域相邻编程之前控制至少一个存储区域的信息,以使得具有提供比所述擦除阈值更接近的晶体管的阈值的值到与所述阈值的n值的信息相对应的阈值 设置在该区域中的晶体管被​​设置为对应于具有n值的信息的阈值。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
    139.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US20130056815A1

    公开(公告)日:2013-03-07

    申请号:US13420745

    申请日:2012-03-15

    IPC分类号: H01L29/78 H01L21/336

    摘要: According to one embodiment, a nonvolatile semiconductor memory device includes: a first stacked body; a memory film; a first channel body layer provided inside the memory film; an interlayer insulating flm provided on the first stacked body; a second stacked body having a select gate electrode layer, and a second insulating layer; a gate insulating film provided on a side wall of a second hole communicating with the first hole and penetrating the second stacked body and the interlayer insulating flm in a stacking direction of the second stacked body; and a second channel body layer provided inside the gate insulating film in the second hole. A first pore diameter of the second hole at an upper end of the select gate electrode layer is smaller than a second pore diameter of the second hole at an lower end of the select gate electrode layer.

    摘要翻译: 根据一个实施例,一种非易失性半导体存储器件包括:第一层叠体; 记忆膜; 设置在记忆膜内部的第一通道体层; 设置在第一层叠体上的层间绝缘膜; 具有选择栅电极层的第二层叠体和第二绝缘层; 栅极绝缘膜,设置在与所述第一孔连通的第二孔的侧壁上,并且在所述第二层叠体的层叠方向上贯通所述第二层叠体和所述层间绝缘膜; 以及设置在第二孔中的栅极绝缘膜内部的第二沟道体层。 选择栅电极层的上端的第二孔的第一孔径比选择栅电极层的下端的第二孔的第二孔径小。