Abstract:
One embodiment of the invention includes an accelerometer sensor system. The system includes a sensor comprising a proofmass and electrodes and being configured to generate acceleration feedback signals based on control signals applied to the electrodes in response to an input acceleration. The system also includes an acceleration component configured to measure the input acceleration based on the acceleration feedback signals. The system further includes an acceleration controller configured to generate the control signals to define a first scale-factor range associated with the sensor and to define a second scale-factor range associated with the sensor. The control system includes a calibration component configured to calibrate the accelerometer sensor system with respect to range-dependent bias error based on a difference between the measured input acceleration at each of the first scale-factor range and the second scale-factor range.
Abstract:
One embodiment of the invention includes an accelerometer sensor system. The system includes a sensor comprising a proofmass and electrodes and being configured to generate acceleration feedback signals based on control signals applied to the electrodes in response to an input acceleration. The system also includes an acceleration component configured to measure the input acceleration based on the acceleration feedback signals. The system further includes an acceleration controller configured to generate the control signals to define a first scale-factor range associated with the sensor and to define a second scale-factor range associated with the sensor. The control system includes a calibration component configured to calibrate the accelerometer sensor system with respect to range-dependent bias error based on a difference between the measured input acceleration at each of the first scale-factor range and the second scale-factor range.
Abstract:
A method and system for a MEMS device is disclosed. The MEMS device includes a free layer, with a first portion and a second portion. The MEMS device also includes a underlying substrate, the free layer movably positioned relative to the underlying substrate. The first portion and second portion of the free layer are coupled through at least one stem. A sense material is disposed over portions of the second portion of the free layer. Stress in the sense material and second portion of the free layer does not cause substantial deflection of the first portion.
Abstract:
Embodiments of the present disclosure are directed towards techniques and configurations for a MEMS device configured to determine inertial change applied to the device. In one instance, the device may comprise a laser arrangement configured to generate a light beam having a resonant wavelength, a waveguide configured to receive and output the light beam, and an optical resonator comprising a deformable closed loop and optically coupled to the waveguide to receive a portion of the light beam. A deformation of the optical resonator may result in a change of an optical path length of a portion of the light beam traveling through the optical resonator, causing a change in the resonant wavelength of the light beam outputted by the waveguide. Other embodiments may be described and/or claimed.
Abstract:
A technique for detecting external force applied to a piezoelectric plate is provided. A crystal plate is cantilever-supported in a container. Excitation electrodes are formed on an upper face and lower face, respectively, of the crystal plate. A movable electrode is formed on the lower face side. A fixed electrode is provided on a bottom portion of the container facing the movable electrode. The excitation electrode on the upper face side and the fixed electrode are connected to an oscillation circuit. When the crystal plate bends by external force applied, capacitance between. A direction of the movable electrode along a length direction of the crystal plate is set to 30° to 60°, relative to a face orthogonal to an intended direction of the external force. The movable electrode and fixed electrode changes, and this capacitance change and a deformation of the crystal circuit.
Abstract:
A method for manufacturing a micro-electro-mechanical system (MEMS) device is provided. The method comprises: providing a semiconductor substrate, the semiconductor substrate having a metal interconnection structure (100) formed therein; forming a first sacrificial layer (201) on the surface of the semiconductor substrate, the material of the first sacrificial layer is amorphous carbon; etching the first sacrificial layer to form a first recess (301); covering and forming a first dielectric layer (401) on the surface of the first sacrificial layer; thinning the first dielectric layer by a chemical mechanical polishing (CMP) process, until exposing the first sacrificial layer; forming a micromechanical structure layer (500) on the surface of the first sacrificial layer and exposing the first sacrificial layer, wherein a part of the micromechanical structure layer is connected to the first dielectric layer. The method avoids polishing the amorphous carbon, shortens the period of production, and improves the production efficiency.
Abstract:
One embodiment of the present application includes a multisensor assembly. This assembly has an electromechanical motion sensor member defined with one wafer layer, a first sensor carried with a first one or two or more other wafer layers, and a second sensor carried with a second one of the other wafer layers. The one wafer layer is positioned between the other wafer layers to correspondingly enclose the sensor member within a cavity of the assembly.
Abstract:
One embodiment includes a method for dynamic self-calibration of an accelerometer system. The method includes forcing a proof-mass associated with a sensor of the accelerometer system in a first direction to a first predetermined position and obtaining a first measurement associated with the sensor in the first predetermined position via at least one force/detection element of the sensor. The method also includes forcing the proof-mass to a second predetermined position and obtaining a second measurement associated with the sensor in the second predetermined position via the at least one force/detection element of the sensor. The method further includes calibrating the accelerometer system based on the first and second measurements.
Abstract:
An acceleration sensor is formed using an etched layer sandwiched between first and second substrates. In this case, a structure including a movable portion which is displaceable in the thickness direction of the substrates, and a support frame are formed in the etched layer. In addition, first and second fixed electrodes are formed on the first and second substrates, respectively, at a position facing the movable portion. Further, a remaining sacrificial layer is provided on the substrate by leaving a portion of a second sacrificial layer when a first sacrificial layer is entirely etched away. Therefore, when the first sacrificial layer is etched away, corrosion of the structure and the support beams is prevented because the second sacrificial layer is preferentially corroded as compared to the structure.
Abstract:
A disclosed pressure-responsive sensor includes a flexible element contained within an enclosure and a membrane configured to exert an electrostatic force on the flexible element to cause the flexible element to respond to pressure variations on the membrane. A disclosed pressure-sensing method includes electrostatically coupling a membrane to a flexible element contained within an enclosure to transfer a pressure response of the membrane to the flexible element. Motion of the flexible element is converted into a pressure signal.