公开(公告)号：US08854819B2

公开(公告)日：2014-10-07

申请号：US13540954

申请日：2012-07-03

Applicant: Hong-Long Chen ,  Yi-Kun Lin

Inventor： Hong-Long Chen ,  Yi-Kun Lin

IPC: H05K7/20

CPC classification number: H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooling device includes a heat sink base plate for mounting on a circuit board to absorb waste heat from a heat source, a radiation fin unit consisting of a set of radiation fins, mounted on the heat sink base plate opposite to the circuit board and defining a plurality of heat-dissipation passages between each two adjacent ones of the radiation fins, a cooling fan unit mounted on the radiation fin unit for creating currents of air toward the heat-dissipation passages, a plurality of thermal tubes supported on the heat sink base plate and fastened to the radiation fins. Each radiation fin has first wind guiding wall portions and second wind guiding wall portions respectively tilted in reversed directions to facilitate the flow of air through the heat-dissipation passages.

Abstract translation: 冷却装置包括：散热器基板，用于安装在电路板上以吸收来自热源的废热;散热片单元，由一组辐射翅片组成，安装在与电路板相对的散热器底板上，并且限定 在两个相邻的辐射翅片之间的多个散热通道，安装在辐射翅片单元上用于产生朝向散热通道的空气流的冷却风扇单元，支撑在散热片基座上的多个热管 并固定在散热片上。 每个辐射翅片具有分别在相反方向上倾斜的第一导风壁部分和第二导风壁部分，以便于空气流过散热通道。

公开(公告)号：US08546832B2

公开(公告)日：2013-10-01

申请号：US13532749

申请日：2012-06-25

Applicant: Chao-Kun Lin

Inventor： Chao-Kun Lin

IPC: H01L33/00

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/405 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A thin-film light emitting diode includes an insulating substrate, a reflective metal electrode on the insulating substrate forming a current spreading layer, and an epitaxial structure on the electrode.

Abstract translation: 薄膜发光二极管包括绝缘基板，形成电流扩散层的绝缘基板上的反射金属电极和电极上的外延结构。

公开(公告)号：US20130082280A1

公开(公告)日：2013-04-04

申请号：US13249184

申请日：2011-09-29

Applicant: Chao-Kun Lin ,  Li Yan ,  Chih-Wei Chuang

Inventor： Chao-Kun Lin ,  Li Yan ,  Chih-Wei Chuang

IPC: H01L33/02 ,  H01L33/22

CPC classification number: H01L33/0075 ,  H01L33/0025 ,  H01L33/0079 ,  H01L33/10 ,  H01L33/22 ,  H01L33/32 ,  H01L33/38 ,  H01L33/405 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0058

Abstract: A light emitting device comprises a first layer of an n-type semiconductor material, a second layer of a p-type semiconductor material, and an active layer between the first layer and the second layer. A light coupling layer is disposed adjacent to one of the first layer and the second layer. In some cases, the light coupling layer is formed by roughening a buffer layer of the light emitting device. The light emitting device includes an electrode in electrical communication with one of the first layer and the second layer through a portion of the light coupling layer.

公开(公告)号：US20130058102A1

公开(公告)日：2013-03-07

申请号：US13587746

申请日：2012-08-16

Applicant: Chao-Kun Lin

Inventor： Chao-Kun Lin

IPC: F21V7/10 ,  H01L33/46 ,  G02B5/28

CPC classification number: H01L33/46 ,  G02B5/0833 ,  H01L2224/49107 ,  H01L2224/73265

Abstract: A blue LED device has a transparent substrate and a reflector structure disposed on the backside of the substrate. The reflector structure includes a Distributed Bragg Reflector (DBR) structure having layers configured to reflect yellow light as well as blue light. In one example, the DBR structure includes a first portion where the thicknesses of the layers are larger, and also includes a second portion where the thicknesses of the layers are smaller. In addition to having a reflectance of more than 97.5 percent for light of a wavelength in a 440 nm-470 nm range, the overall reflector structure has a reflectance of more than 90 percent for light of a wavelength in a 500 nm-700 nm range.

Abstract translation: 蓝色LED装置具有设置在基板背面的透明基板和反射器结构。 反射器结构包括分布布拉格反射器（DBR）结构，其具有被配置为反射黄光以及蓝光的层。 在一个示例中，DBR结构包括第一部分，其中层的厚度较大，并且还包括层的厚度较小的第二部分。 除了对于440nm-470nm范围内的波长的光具有大于97.5％的反射率，对于500nm-700nm范围内的波长的光，整个反射器结构的反射率大于90％ 。

公开(公告)号：US08389410B2

公开(公告)日：2013-03-05

申请号：US13087356

申请日：2011-04-14

Applicant: Kun-Lin Wu ,  Meng-Jin Tsai

Inventor： Kun-Lin Wu ,  Meng-Jin Tsai

IPC: H01L21/302

CPC classification number: H01L21/76829 ,  H01L21/31053 ,  H01L21/31612 ,  H01L21/31625 ,  H01L21/3185 ,  H01L21/76819 ,  H01L21/7684

Abstract: A chemical-mechanical polishing process includes the steps of providing a semiconductor substrate having a first conductive line thereon, and then forming at least one dielectric layer over the substrate and the first conductive line. Next, a chemical-mechanical polishing method is used to polish the surface of the dielectric layer. Thereafter, a cap layer is formed over the polished dielectric layer. The method of forming the cap layer includes depositing silicon oxide using a chemical vapor deposition method with silicane (SiH4) or tetra-ethyl-ortho-silicate (TEOS) as the main reactive agent. Alternatively, the cap layer can be formed by depositing silicon nitride using a chemical vapor deposition method with silicane or silicon dichlorohydride (SiH2Cl2) as the main reactive agent. Finally, a via opening is formed through the dielectric layer and the cap layer, and a second conductive line that couples electrically with the first conductive line through the via opening.

Abstract translation: 化学机械抛光工艺包括以下步骤：提供其上具有第一导电线的半导体衬底，然后在衬底和第一导电线上形成至少一个电介质层。 接下来，使用化学 - 机械抛光方法来抛光电介质层的表面。 此后，在抛光的介电层上形成覆盖层。 形成盖层的方法包括使用硅烷（SiH4）或四乙基原硅酸盐（TEOS）作为主要反应剂的化学气相沉积法沉积氧化硅。 或者，可以通过使用化学气相沉积法以硅烷或二氯硅酸氢钠（SiH 2 Cl 2）作为主要反应剂沉积氮化硅来形成覆盖层。 最后，通过介电层和盖层形成通孔，以及通过通路孔与第一导电线电连接的第二导线。

公开(公告)号：US20130032847A1

公开(公告)日：2013-02-07

申请号：US13198664

申请日：2011-08-04

Applicant: Chih-Wei Chuang ,  Chao-Kun Lin

Inventor： Chih-Wei Chuang ,  Chao-Kun Lin

IPC: H01L33/14 ,  H01L33/38

CPC classification number: H01L33/38 ,  H01L33/14 ,  H01L33/145 ,  H01L33/22 ,  H01L33/387 ,  H01L33/405 ,  H01L33/42 ,  H01L2933/0016

Abstract: An LED device includes a strip-shaped electrode, a strip-shaped current blocking structure and a plurality of distributed current blocking structures. The current blocking structures are formed of an insulating material such as silicon dioxide. The strip-shaped current blocking structure is located directly underneath the strip-shaped electrode. The plurality of current blocking structures may be disc shaped portions disposed in rows adjacent the strip-shaped current blocking structure. Distribution of the current blocking structures is such that current is prevented from concentrating in regions immediately adjacent the electrode, thereby facilitating uniform current flow into the active layer and facilitating uniform light generation in areas not underneath the electrode. In another aspect, current blocking structures are created by damaging regions of a p-GaN layer to form resistive regions. In yet another aspect, current blocking structures are created by etching away highly doped contact regions to form regions of resistive contact between conductive layers.

Abstract translation: LED器件包括条形电极，条状电流阻挡结构和多个分布电流阻挡结构。 电流阻挡结构由诸如二氧化硅的绝缘材料形成。 带状电流阻挡结构位于条形电极的正下方。 多个电流阻挡结构可以是与带状电流阻挡结构相邻的行设置的盘形部分。 电流阻挡结构的分布使得防止电流集中在紧邻电极的区域中，从而促进均匀的电流流入有源层并且促进在不在电极下方的区域中均匀的光产生。 在另一方面，通过损害p-GaN层的区域以形成电阻区域来产生电流阻挡结构。 在另一方面，通过蚀刻掉高度掺杂的接触区域以形成导电层之间的电阻接触区域来产生电流阻挡结构。

公开(公告)号：US20130032845A1

公开(公告)日：2013-02-07

申请号：US13196839

申请日：2011-08-02

Applicant: Chih-Wei Chuang ,  Chao-Kun Lin ,  Long Yang ,  Norihito Hamaguchi

Inventor： Chih-Wei Chuang ,  Chao-Kun Lin ,  Long Yang ,  Norihito Hamaguchi

IPC: H01L33/40 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L33/0079 ,  H01L33/405 ,  H01L2224/05624 ,  H01L2224/29118 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/0665 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A vertical GaN-based LED is made by growing an epitaxial LED structure on a silicon wafer. A silver layer is added and annealed to withstand >450° C. temperatures. A barrier layer (e.g., Ni/Ti) is provided that is effective for five minutes at >450° C. at preventing bond metal from diffusing into the silver. The resulting device wafer structure is then wafer bonded to a carrier wafer structure using a high temperature bond metal (e.g., AlGe) that melts at >380° C. After wafer bonding, the silicon is removed, gold-free electrodes (e.g., Al) are added, and the structure is singulated. High temperature solder (e.g., ZnAl) that is compatible with the electrode metal is used for die attach. Die attach occurs at >380° C. for ten seconds without melting the bond metal or otherwise damaging the device. The entire LED contains no gold, and consequently is manufacturable in a high-volume gold-free semiconductor fabrication facility.

Abstract translation: 通过在硅晶片上生长外延LED结构来制造垂直GaN基LED。 添加银层并退火以承受> 450℃的温度。 提供了在> 450℃有效5分钟的阻挡层（例如Ni / Ti），以防止粘结金属扩散到银中。 然后，所得到的器件晶片结构使用在> 380℃熔化的高温接合金属（例如，AlGe）将晶片结合到载体晶片结构。在晶片接合之后，去除硅，无金电极（例如，Al ），并且结构被分割。 与电极金属相容的高温焊料（例如ZnAl）用于管芯附着。 芯片附着在> 380°C下发生十秒，而不熔化粘结金属或以其他方式损坏器件。 整个LED不含金，因此可在大容量无金属半导体制造设备中制造。

公开(公告)号：US08365908B2

公开(公告)日：2013-02-05

申请号：US12823233

申请日：2010-06-25

Applicant: Kun-Lin Shiao

Inventor： Kun-Lin Shiao

IPC: A63B55/00

CPC classification number: A63B55/00 ,  A63B55/53

Abstract: A golf bag has a cord, a bottom frame and a top frame. The bottom frame has a cover and a bottom cuff received therein. The bottom cuff is pivotally mounted to the cover and has a bevel surface, a lever holder and a lever received in the lever holder and tied to the cord. The top frame has a cord guide for guiding and branching the cord and two leg holders tied to two branches of the cord and abut against the cord guide. When the golf bag is tilted, the bevel surface rests on the cover, the cord is dragged down to pull and extend out the two leg holders to stand on the ground. As the cover stay intact when the bottom cuff tilts, the golf bag can stably stand and requires a simplified cord linking design.

Abstract translation: 高尔夫球包具有绳索，底架和顶架。 底部框架具有收纳在其中的盖和底部袖带。 底部袖带可枢转地安装到盖上，并且具有倾斜表面，杆保持器和容纳在杆保持器中并连接到绳索的杆。 顶部框架具有用于引导和分支绳索的绳索引导件和连接到绳索的两个分支并且抵靠绳索引导件的两个腿部保持器。 当高尔夫球袋倾斜时，斜面停留在盖子上，将绳索拖下来拉出并延伸出两个支腿支架以站立在地面上。 当底部袖口倾斜时，护盖保持完整，高尔夫球袋可以稳定地站立并需要简化的绳索连接设计。

公开(公告)号：US20130027360A1

公开(公告)日：2013-01-31

申请号：US13557865

申请日：2012-07-25

Applicant: Jar-Ferr Yang ,  Chi-Kun Lin ,  Cheng-Mao Li

Inventor： Jar-Ferr Yang ,  Chi-Kun Lin ,  Cheng-Mao Li

IPC: G06F3/041

CPC classification number: G06F3/0418

Abstract: A positioning and calibration method is applied in the positioning and calibration of a projection system with touch control function. The projection system includes a touch device and a projection device. The touch device has touch plates, which can be combined and formed into a plane. The projection device has projection units, which project images onto projection areas of the plane, respectively, so as to form a projection image on the plane. The positioning and calibration method includes the steps of projecting positioning markers onto the plane by the projection device; disposing a calibration element at or around each of the positioning markers; and locating and calibrating the corresponding projection unit according to a positioning signal of the calibration element delivered by the touch device. The invention makes the projection system, having touch plates, projection units and the touch control function, have the good location function.

Abstract translation: 定位和校准方法应用于具有触摸控制功能的投影系统的定位和校准。 投影系统包括触摸装置和投影装置。 触摸装置具有可以组合并形成平面的触摸板。 投影装置具有分别将图像投影到平面的投影区域上的投影单元，以在平面上形成投影图像。 定位和校准方法包括通过投影装置将定位标记投影到平面上的步骤; 在每个定位标记处或周围设置校准元件; 以及根据由触摸装置传递的校准元件的定位信号来定位和校准相应的投影单元。 本发明使得具有触摸板，投影单元和触摸控制功能的投影系统具有良好的定位功能。

公开(公告)号：US08248155B2

公开(公告)日：2012-08-21

申请号：US12960328

申请日：2010-12-03

Applicant: Ping-Kun Lin ,  Song Guo

Inventor： Ping-Kun Lin ,  Song Guo

IPC: G05F1/10

CPC classification number: G09G3/3696

Abstract: A voltage adjusting circuit includes a voltage regulator module (VRM), a control chip, a connection device, and a number of first resistors. The VRM includes an input receiving a first voltage from a motherboard, and an output connected to a liquid crystal display (LCD). A number of sense terminals of the control chip are connected to the LCD to sense current of the LCD. A driven terminal of the control chip is connected to a control terminal of the VRM to output corresponding driven signals to control the VRM to output corresponding voltage to the LCD. A first terminal of each first resistor is connected to a corresponding sense terminal of the control chip. A second terminal of each first resistor is grounded. The connection device is configured to cut off or connect the first resistor from or to the corresponding sense terminal of the control chip.

Abstract translation: 电压调节电路包括电压调节器模块（VRM），控制芯片，连接装置和多个第一电阻器。 VRM包括从主板接收第一电压的输入端和连接到液晶显示器（LCD）的输出。 控制芯片的多个感测端子连接到LCD以感测LCD的电流。 控制芯片的驱动端子连接到VRM的控制端子，以输出相应的驱动信号，以控制VRM向LCD输出相应的电压。 每个第一电阻器的第一端子连接到控制芯片的对应检测端子。 每个第一个电阻的第二个端子接地。 连接装置被配置为从控制芯片的相应感测端子切断或连接第一电阻器。