Abstract:
Apparatus for registering the spectral signature of a dynamic source event include an imaging-sensor array configured to register electromagnetic energy over a predetermined range of electromagnetic wavelengths and an optical system configured for imaging onto the imaging-sensor array a dispersion pattern of electromagnetic energy emitted from a source event external to the optical system. The optical system includes (i) a focusing element and (ii) a selected set of optical dispersion apparatus. Among the optical dispersion apparatus are at least a first optically dispersive element that disperses a first selected set of wavelengths within the sensitivity range of the imaging-sensor array and at least a second optically dispersive element that disperses a second selected set of wavelengths within the sensitivity range of the imaging-sensor array such that wavelengths emitted from a source event that are within the first and second selected sets of wavelengths impinge simultaneously upon the imaging-sensor array along, respectively, a first extrapolated axis and a second extrapolated axis that is non-parallel to the first extrapolated axis.
Abstract:
A portable spectrograph including a primary mirror, a secondary mirror, and a tertiary mirror forming a TMA having a common vertex axis, a diffraction grating, and a dispersive prism, where the portable spectrograph can detect wavelengths between 150 nm and 1.1 μm. The portable spectrograph also may include a collimating mirror and an entrance aperture, which form an interchangeable module. Radiation received through the entrance aperture is reflected in a collimated pattern towards an aperture stop. The diffraction grating, located between the collimating mirror and prism, diffracts radiation passed through the aperture stop into multiple beams directed onto the prism. A flat mirror, located to one side of the vertex axis receives and reflects the multiple beams exiting the prism onto the primary mirror, where they are reflected onto the secondary mirror. The secondary mirror reflects the beams to the tertiary mirror where they are reflected onto an image plane located on the other side of the vertex axis.
Abstract:
A detection system and method are provided having vehicle-mounted and manportable mobile surveillance capabilities with minimal equipment redundancy. The system comprises a vehicle-mounted sensor unit, a hand-held unit, a manportable unit and a vehicle-mounted air collector unit. The vehicle-mounted sensor unit comprises a spectroscopy subsystem that is configured to direct light onto a surface outside the vehicle and to capture scattered optical energy from the surface outside the vehicle while the vehicle is moving. The hand-held unit may be removably mounted to the air collector unit to interrogate airborne particles in collected air. The hand-held unit is removable from the air collector unit and is connected to the manportable unit by a cable so as to form an integrated portable detection system for mobile surveillance away from the vehicle by a user.
Abstract:
A critical wavelength refractometer is provided. A broadband light source (413) is optically coupled to a sensor (401), the sensor having at least one sensing surface (407). As the light from the broadband light source passes through the sensor, it undergoes multiple internal reflections against the sensing surface. Due to the index of refraction of the material in contact with the sensing surface, a portion of the light passing through the sensor is reflected while a second portion of the light is transmitted through the sensing surface and into the material. A detector (421) coupled to the sensor measures the spectral intensity of the light that passes completely through the sensor after having undergone the multiple internal reflections against the sensing surface. A microprocessor (423) coupled to the detector determines the critical wavelength based on the spectral intensity measurement, thereby allowing the index of refraction of the material to be determined.
Abstract:
Methods (600) and systems (100) for inspecting an indirect bandgap semiconductor structure (140) are described. A light source (110) generates light (612) suitable for inducing photoluminescence in the indirect bandgap semiconductor structure (140). A short-pass filter unit (114) reduces long-wavelength light of the generated light above a specified emission peak. A collimator (112) collimates (616) the light. A large area of the indirect bandgap semiconductor structure (140) is substantially uniformly and simultaneously illuminated (618) with the collimated, short-pass filtered light. An image capture device (130) captures (620) images of photoluminescence simultaneously induced by the substantially uniform, simultaneous illumination incident across the large area of the indirect bandgap semiconductor structure. The photoluminescence images are image processed (622) to quantify spatially resolved specified electronic properties of the indirect bandgap semiconductor structure (140) using the spatial variation of the photoluminescence induced in the large area.
Abstract:
A digital spectrophotometer and a spectrologial method for determining spectrum wavelength of an unknown illuminant, and the digital spectrophotometer has a base, an operating assembly and a photographic assembly. The operating assembly is attached to the base and has an operating pedestal, a rotating frame and a spectrometer. The rotating frame is connected rotatably to the operating pedestal. The spectrometer is connected solidly to the rotating frame. The photographic assembly is connected to the operating assembly. The spectrologial method is calculated the diffraction angle α i and the wavelength of the unknown illuminant by putting the parameters into the into the first and second functions.
Abstract:
A substrate processing system includes a processing module to process a substrate, a factory interface module configured to accommodate at least one cassette for holding the substrate, a spectrographic monitoring system positioned in or adjoining the factory interface module, and a substrate handler to transfer the substrate between the at least one cassette, the spectrographic monitoring system and the processing module.
Abstract:
High speed, optically-multiplexed, hyperspectral imagers and methods for producing multiple, spectrally-filtered image information of a scene. In a preferred embodiment, an array of imaging lenslets project multiple images of a scene along parallel optical paths which are then collimated, filtered into distinct wavelengths, and focused onto an array of image sensors. A digital image formatter converts output data from the image sensors into hyperspectral image information of the scene.
Abstract:
A method and system are presented for determining a line profile in a patterned structure, aimed at controlling a process of manufacture of the structure. The patterned structure comprises a plurality of different layers, the pattern in the structure being formed by patterned regions and un-patterned regions. At least first and second measurements are carried out, each utilizing illumination of the structure with a broad wavelengths band of incident light directed on the structure at a certain angle of incidence, detection of spectral characteristics of light returned from the structure, and generation of measured data representative thereof. The measured data obtained with the first measurement is analyzed, and at least one parameter of the structure is thereby determined. Then, this determined parameter is utilized, while analyzing the measured data obtained with the second measurements enabling the determination of the profile of the structure.
Abstract:
A non-destructive in-situ elemental profiling of a layer in a set of layers method and system are disclosed. In one embodiment, a first emission of a plurality of photoelectrons is caused from the layer to be elementally profiled. An elemental profile of the layer is determined based on the emission. In another embodiment, a second emission of a plurality of photoelectrons is also received from the layer, and an elemental profile is determined by comparison of the resulting signals. A process that is altering the layer can then be controlled “on-the-fly” to obtain a desired material composition. Since the method can be employed in-situ and is non-destructive, it reduces turn around time and lowers wafer consumption. The invention also records the composition of all processed wafers, hence, removing the conventional statistical sampling problem.