公开(公告)号：US08545979B2

公开(公告)日：2013-10-01

申请号：US11370835

申请日：2006-03-09

Applicant: Kenji Kita ,  Yasumasa Morishima ,  Shinichi Ishiwata

Inventor： Kenji Kita ,  Yasumasa Morishima ,  Shinichi Ishiwata

IPC: B32B7/12 ,  B32B7/10

CPC classification number: H01L24/29 ,  C09J7/38 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/298 ,  H01L2924/00

Abstract: A wafer-processing tape, which has an adhesive layer and a removable adhesive layer formed on a surface of a base film, and which has an area where B>A, and an area where A>B, in which a peeling force between the base film and the adhesive layer is designated as A, and peeling forces between a target to be bonded and the adhesive layer and between a target to be bonded and the removable adhesive layer are designated as B, wherein the adhesive layer is transferred onto the chip side during pickup in the area where B>A, and the removable adhesive layer is not transferred onto the target to be bonded in the area where A>B during peeling off the tape.

Abstract translation: 一种晶片加工带，其具有形成在基膜的表面上的粘合剂层和可除去的粘合剂层，并且其具有B> A的区域和A> B的区域，其中， 基底膜和粘合剂层被指定为A，将待粘合的目标物和粘合剂层之间以及待接合的靶材与可除去的粘合剂层之间的剥离力指定为B，其中粘合剂层转移到芯片上 在B> A的区域中的拾取过程中，在剥离带子时，在A> B的区域中不能将可移除的粘合剂层转印到待粘合的目标物上。

公开(公告)号：US20130242512A1

公开(公告)日：2013-09-19

申请号：US13891206

申请日：2013-05-10

Applicant: AU OPTRONICS CORPORATION

Inventor： Wen-Hao Wu

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/02 ,  B29C65/1635 ,  B29C65/48 ,  B29C65/486 ,  B29C65/4885 ,  B32B37/0076 ,  B32B2037/1238 ,  C09J5/00 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2203/318 ,  G02F1/133351 ,  G02F2001/133311 ,  H01L51/5246 ,  H05K1/181

Abstract: An display device package including a first substrate, an display device, a second substrate, a welding glue, and a first adhesive layer is provided. The display device is disposed on the first substrate. The second substrate is disposed above the first substrate and the display device. The welding glue is welded with the first substrate and the second substrate and surrounds the display device, wherein the welding glue has a continuous pattern. The first adhesive layer is adhered to the first substrate and the second substrate, wherein the first adhesive layer is disposed between the display device and the welding glue and surrounds the display device, and the material of the first adhesive layer and the material of the welding glue are different.

Abstract translation: 提供了包括第一基板，显示装置，第二基板，焊接胶和第一粘合剂层的显示装置封装。 显示装置设置在第一基板上。 第二基板设置在第一基板和显示装置的上方。 焊接胶与第一基板和第二基板焊接并且围绕显示装置，其中焊接胶具有连续图案。 第一粘合剂层粘附到第一基板和第二基板，其中第一粘合剂层设置在显示装置和焊接胶之间并且围绕显示装置，并且第一粘合剂层的材料和焊接材料 胶水是不同的。

公开(公告)号：US20130233590A1

公开(公告)日：2013-09-12

申请号：US13782510

申请日：2013-03-01

Applicant: HITACHI CABLE, LTD.

Inventor： Daisuke SHANAI ,  Tomiya ABE

IPC: C09J7/02 ,  H01B7/08

CPC classification number: C09J7/02 ,  C08K3/016 ,  C08K5/0066 ,  C08K5/29 ,  C08K2003/2224 ,  C09J7/22 ,  C09J7/30 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2467/006 ,  C09J2477/00 ,  H01B7/0823 ,  H01B7/295 ,  Y10T428/24959 ,  Y10T428/264 ,  Y10T428/2843

Abstract: There is provided an adhesive film, comprising: an insulator film; an adhesive layer formed on the insulator film; and an intermediate adhesive layer interposed between the insulator film and the adhesive layer, wherein the intermediate adhesive layer is made of a mixed resin composition of a copolyamide being a crystalline resin solvable in a non-halogen based organic solvent and having a melting point of 100° C. or more and 150° C. or less, and a non-crystalline resin, and the intermediate adhesive layer contains a non-halogen flame retardant by 100 pts.wt. or more and 250 pts.wt. or less with respect to 100 pts.wt. of the mixed resin composition.

Abstract translation: 提供了一种粘合膜，包括：绝缘膜; 形成在绝缘膜上的粘合剂层; 以及介于所述绝缘体膜和所述粘合剂层之间的中间粘合剂层，其中所述中间粘合剂层由可溶解在非卤素类有机溶剂中并具有熔点为100的结晶树脂的共聚酰胺的混合树脂组合物制成 ℃以上且150℃以下，非结晶性树脂，中间粘合剂层含有100重量份的无卤阻燃剂。 或更多和250 pts.wt 或更少，相对于100重量份 的混合树脂组合物。

公开(公告)号：US20130220687A1

公开(公告)日：2013-08-29

申请号：US13770513

申请日：2013-02-19

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Shohei TAGAMI ,  Michihiro SUGO ,  Hiroyuki YASUDA ,  Masahiro FURUYA ,  Hideto KATO

IPC: C09J7/00 ,  H01L21/304

CPC classification number: C09J7/00 ,  C09J7/22 ,  C09J7/30 ,  C09J2201/122 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2483/00 ,  H01L21/304 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T428/2852

Abstract: Disclosed is a wafer process body, a temporary adhesive layer is formed on a supporting body, and a wafer having a circuit-formed front surface and a to-be-processed back surface is stacked on the temporary adhesive layer, wherein the temporary adhesive layer is provided with a first temporary adhesive layer including a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A) which is adhered to the front surface of the wafer so as to be detachable and a second temporary adhesive layer comprised of a thermosetting-modified siloxane polymer layer (B) which is stacked on the first temporary adhesive layer and adhered to the supporting body so as to be detachable. Thus, temporary adhesion of a wafer with a supporting body may become easy, process conformity with the TSV formation process and with the wafer-back surface-wiring process may become high, and removal may be done easily, with high productivity.

Abstract translation: 公开了一种晶片加工体，在支撑体上形成临时粘合层，并且在临时粘合剂层上堆叠具有电路形成的前表面和被处理后表面的晶片，其中临时粘合剂层 设置有第一临时粘合剂层，其包括粘附到晶片的前表面以便可拆卸的非芳族饱和烃基的有机聚硅氧烷层（A）和由热固性改性的第二临时粘合剂层 硅氧烷聚合物层（B），其被堆叠在第一临时粘合剂层上并粘附到支撑体以便可拆卸。 因此，具有支撑体的晶片的临时粘合可能变得容易，与TSV形成工艺一致，并且晶片背面布线工艺可能变高，并且可以以高生产率容易地进行去除。

公开(公告)号：US20130189517A1

公开(公告)日：2013-07-25

申请号：US13457573

申请日：2012-04-27

Applicant: HSIN YUAN CHEN ,  HAO-JAN HSIAO

Inventor： HSIN YUAN CHEN ,  HAO-JAN HSIAO

IPC: C09J7/02 ,  B32B27/00

CPC classification number: B32B27/365 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/302 ,  B32B27/304 ,  B32B27/34 ,  B32B27/36 ,  B32B2264/102 ,  B32B2307/71 ,  B32B2307/712 ,  B32B2307/714 ,  B32B2457/00 ,  C09J7/38 ,  C09J2201/36 ,  C09J2203/322 ,  C09J2427/00 ,  H01L31/0481 ,  Y02E10/50 ,  Y10T428/2848

Abstract: A multi-layer fluororesin film includes a substrate layer having substantially parallel first and second surfaces, a first fluororesin layer formed on at least one of the first and second surfaces and a second fluororesin layer formed on the first fluororesin layer. The first fluororesin layer has a first fluorine polymer and a first adhesive polymer, and the ratio between the first fluorine polymer and the first adhesive polymer ranges from 0.05 to 0.9. The second fluororesin layer has a second fluorine polymer and a second adhesive polymer, and the ratio between the second fluorine polymer and the second adhesive polymer ranges from 1.2 to 19.

Abstract translation: 多层氟树脂膜包括具有基本上平行的第一和第二表面的基底层，形成在第一和第二表面中的至少一个上的第一氟树脂层和形成在第一氟树脂层上的第二氟树脂层。 第一氟树脂层具有第一氟聚合物和第一粘合剂聚合物，第一氟聚合物和第一粘合剂聚合物之间的比例为0.05-0.9。 第二氟树脂层具有第二氟聚合物和第二粘合剂聚合物，第二氟聚合物和第二粘合剂聚合物之间的比例为1.2至19。

公开(公告)号：US08490356B2

公开(公告)日：2013-07-23

申请号：US13664045

申请日：2012-10-30

Applicant: Custom Building Products, Inc.

Inventor： Steven L. Taylor ,  Norman C. Tracy ,  Charles R. Cornman ,  John W. McMullen ,  Thomas R. Peck

IPC: E04B1/00 ,  E04C1/00

CPC classification number: E04F13/0887 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/134 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2201/40 ,  E04F15/02155 ,  E04F15/02188 ,  E04F15/187

Abstract: The installation system and method for installing an architectural covering material to a substrate surface utilizes an adhesive mat having layers of adhesive and release layers arranged to allow the covering material to be initially positioned, and later repositioned to be permanently set. The adhesive mat includes a planar carrier member, one or more adhesive layers on at least one planar side of the planar carrier member, and at least one release layer of material removably covering the one or more adhesive layers. In one form, the adhesive mat includes a carrier sheet, first and second adhesive layers on opposing planar sides of the carrier sheet, and first and second release layers of material removably covering the two adhesive layers.

Abstract translation: 用于将建筑覆盖材料安装到基底表面的安装系统和方法利用具有布置成允许覆盖材料被初始定位并且随后重新定位以永久设置的粘合剂层和释放层的粘合剂垫。 粘合垫包括平面载体构件，在平面载体构件的至少一个平面侧上的一个或多个粘合剂层和至少一个可移除地覆盖该一个或多个粘合剂层的材料释放层。 在一种形式中，粘合剂垫包括载体片，载体片的相对平面侧上的第一和第二粘合剂层，以及可移除地覆盖两个粘合剂层的材料的第一和第二释放层。

公开(公告)号：US08444882B2

公开(公告)日：2013-05-21

申请号：US13142956

申请日：2010-02-22

Applicant: Shiyuki Kanisawa ,  Hiroyuki Kumakura ,  Hidetsugu Namiki

Inventor： Shiyuki Kanisawa ,  Hiroyuki Kumakura ,  Hidetsugu Namiki

IPC: H01B1/02 ,  H01B1/22 ,  H01L33/00 ,  B32B5/16

CPC classification number: H01L24/32 ,  C08K3/08 ,  C08K9/04 ,  C09J7/10 ,  C09J11/04 ,  C09J2201/36 ,  C09J2205/102 ,  C09J2463/00 ,  H01L33/46 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K3/323 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/1189 ,  Y10T428/25 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An anisotropic conductive film is provided that does not have a light-reflecting layer on a light emitting diode element which causes costs to increase when a light emitting device that uses an LED element is flip-chip mounted, and that does not cause emission efficiency to deteriorate. Further, a light emitting device that uses such an anisotropic conductive film is provided. This anisotropic conductive film has a structure in which a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer are laminated, wherein the light-reflecting insulating adhesive layer has a structure in which light-reflecting particles are dispersed in an insulating adhesive. The light emitting device has a structure in which a light emitting diode element is flip-chip-mounted on a substrate, with this anisotropic conductive film provided between a connection terminal on the substrate and a bump for connection of the light emitting diode element.

Abstract translation: 提供一种各向异性导电膜，其在发光二极管元件上不具有光反射层，当使用LED元件的发光器件被倒装芯片安装时，导致成本增加，并且不会导致发射效率 恶化。 此外，提供了使用这种各向异性导电膜的发光器件。 这种各向异性导电膜具有层叠反光绝缘粘合剂层和各向异性导电粘合剂层的结构，其中反光绝缘粘合剂层具有其中光反射颗粒分散在绝缘粘合剂中的结构。 发光器件具有将发光二极管元件倒装芯片安装在基板上的结构，其中该各向异性导电膜设置在基板上的连接端子和用于连接发光二极管元件的突起之间。

公开(公告)号：US20130062011A1

公开(公告)日：2013-03-14

申请号：US13231818

申请日：2011-09-13

Applicant: Ralf Horstkemper ,  Casey J. Feinstein ,  Kuo-Hua Sung

Inventor： Ralf Horstkemper ,  Casey J. Feinstein ,  Kuo-Hua Sung

IPC: B29C65/54 ,  B29C65/52

CPC classification number: C09J5/00 ,  B29C65/4855 ,  B29C65/5021 ,  B29C65/5057 ,  B29C65/5064 ,  B29C65/524 ,  B29C66/342 ,  B29C66/3452 ,  B29C66/45 ,  C09J2201/36

Abstract: Methods for liquid adhesive lamination for precision adhesive control are provided. Precision liquid adhesive control can be obtained by first patterning liquid adhesive in a thin pre-coat layer on a substrate. A second adhesive layer can then be patterned on top of the pre-coat layer. When the second substrate is pressed onto the first substrate, the second substrate first comes into contact with the second adhesive layer. The adhesive can then be spread uniformly across the two substrates without forming voids. Alternatively, a single liquid adhesive layer can be formed in a three dimensional gradient pattern.

Abstract translation: 提供了用于精密粘合剂控制的液体粘合剂层压方法。 通过首先在基材上的薄预涂层中图案化液体粘合剂可以获得精密的液体粘合剂控制。 然后可以在预涂层的顶部上构图第二粘合剂层。 当第二基板被按压到第一基板上时，第二基板首先与第二粘合剂层接触。 然后可以将粘合剂均匀地铺展在两个基材上而不形成空隙。 或者，可以以三维梯度图案形成单个液体粘合剂层。

公开(公告)号：US20120308784A1

公开(公告)日：2012-12-06

申请号：US13209404

申请日：2011-08-14

Applicant: Albert CHEN

Inventor： Albert CHEN

IPC: C09J7/02 ,  C09J109/06 ,  C09J115/00 ,  B32B7/12 ,  B32B3/10

CPC classification number: B32B7/12 ,  B32B27/08 ,  B32B27/302 ,  B32B2274/00 ,  B32B2307/412 ,  B32B2307/75 ,  C08K5/0016 ,  C08K5/01 ,  C08K5/02 ,  C09J7/10 ,  C09J7/381 ,  C09J109/06 ,  C09J153/02 ,  C09J2201/128 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2205/102 ,  C09J2423/046 ,  C09J2453/00 ,  C09J2467/006 ,  C09J2469/006 ,  Y10T428/24802 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/2878 ,  Y10T428/2883

Abstract: A flexible adhesive pad has a tacky elastomeric back layer made of a first naphthenic oil-impregnated thermoplastic rubber, an intermediary layer made of a polymer film permanently adhered to the elastomeric back layer by a first oil-based adhesive, and a tacky elastomeric front layer made of a second naphthenic oil-impregnated thermoplastic rubber adhered to the intermediary layer by a second oil-based adhesive. The front layer is transparent and the intermediary layer may has graphics or text viewable through the front layer that indicate a device that the front layer is intended to receive, and/or where on the front layer that device is intended to be received.

Abstract translation: 柔性粘合垫具有由第一环烷油浸渍的热塑性橡胶制成的粘性弹性体后层，由聚合物膜制成的中间层，其通过第一油性粘合剂永久地粘附到弹性体背层上，并且粘性弹性体前层 由通过第二油性粘合剂粘附到中间层的第二种环烷油浸渍的热塑性橡胶制成。 前层是透明的，并且中间层可以具有通过前层可见的图形或文本，其指示前层旨在接收的设备，和/或要在该设备被接收的前面层的哪个位置。

公开(公告)号：US20120244328A1

公开(公告)日：2012-09-27

申请号：US13513409

申请日：2010-11-30

Applicant: Miki Tanimura ,  Hitoshi Takahira ,  Satomi Yoshie

Inventor： Miki Tanimura ,  Hitoshi Takahira ,  Satomi Yoshie

IPC: C09J7/02 ,  C09J167/02 ,  B32B5/14 ,  B32B7/02 ,  B32B27/06 ,  B32B5/00

CPC classification number: C09J175/06 ,  B32B7/12 ,  B32B27/36 ,  C08G18/4288 ,  C09J7/00 ,  C09J7/10 ,  C09J7/38 ,  C09J167/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/622 ,  C09J2467/00 ,  Y10T428/2495 ,  Y10T428/264 ,  Y10T428/269 ,  Y10T428/2848 ,  Y10T428/2852

Abstract: The present invention provides a pressure-sensitive adhesive sheet containing a pressure-sensitive adhesive layer that contains a polyester resin as a main component, in which the pressure-sensitive adhesive layer having a laminate structure that contains at least one layer LA where a polyester resin EA having Mw of from 4×104 to 12×104 is crosslinked and at least one layer LB where a polyester resin EB having Mw of from 0.2×104 to 1×104 is crosslinked, and at least one surface of the pressure-sensitive adhesive layer is constituted by the layer LA.

Abstract translation: 本发明提供一种压敏粘合片，其含有以聚酯树脂为主要成分的压敏粘合剂层，其中所述压敏粘合剂层具有包含至少一层LA的层压结构，其中聚酯树脂 具有4×10 4至1​​2×10 4的Mw的EA交联，并且至少一层LB，其中Mw为0.2×10 4至1​​×10 4的聚酯树脂EB交联，并且压敏粘合剂的至少一个表面 层由层LA构成。