Abstract:
An anti-tampering circuit for a vehicle includes an operational circuit providing a predetermined function for the vehicle to be protected, and a control circuit connected to the operational circuit for enabling and disabling operation thereof. The control circuit includes a semiconductor substrate, a communications circuit formed on the semiconductor substrate receiving data corresponding to an identification code from at least one external source within the vehicle, and a non-volatile memory formed on the semiconductor substrate and connected to the communications circuit for storing only once a predetermined identification code. The communications circuit writes the received data to the non-volatile memory as the predetermined identification code when the control circuit is within the vehicle if the predetermined identification code has not already been stored therein. The control circuit further includes a comparator formed on the substrate for comparing the received data with the predetermined identification code and providing a comparison signal. A selector is also formed on the substrate for enabling and disabling the operational circuit responsive to the comparison signal.
Abstract:
A method is provided of manufacturing a P-channel native MOS transistor in a circuit integrated on a semiconductor which also includes a matrix of non-volatile memory cells of the floating gate type with two polysilicon levels having an interpoly dielectric layer sandwiched between the two polysilicon levels. The method has the following steps: (1) masking and defining active areas of the discrete integrated devices; (2) masking and defining the first polysilicon level using a Poly1 mask; and (3) masking and defining an intermediate dielectric layer using a matrix mask. The length of the native threshold channel of the native transistor is defined by means of the matrix mask and by etching away the interpoly dielectric layer. A subsequent step of masking and defining the second polysilicon level provides for the use of a Poly2 mask which extends the active area of the transistor with a greater width than the previous mask in order to enable, by subsequent etching, the two polysilicon levels to overlap in self-alignment over the channel region.
Abstract:
The invention relates to a modular architecture of a cellular network for improved large-scale integration, of the type which comprises a plurality of fuzzy cellular elements (C.sub.m,n) interconnected to form a matrix of elements having at least m rows and n columns, the row and column numbers describing the location of each element. Each fuzzy processor is adapted for connection to other processors of the same type such that a parallel architecture of the modular type can be implemented. The management of the architecture is facilitated by each submatrix being controlled by an individually dedicated fuzzy processor device.
Abstract:
A low-noise output stage for an electronic circuit integrated on a semiconductor substrate is disclosed. The low-noise output stage comprises a complementary CMOS transistor pair including a P-channel pull-up transistor and an N-channel pull-down transistor, connected across a first terminal of the electronic circuit to receive a supply voltage, and a second terminal of the electronic circuit to receive a second reference potential. The transistors are connected together to form an output terminal of the electronic circuit for connection to an external load. The pull-down transistor is formed in a three-well structure to prevent propagation of a discharge current from the external load through the semiconductor substrate.
Abstract:
A process for the formation of a device edge morphological structure for protecting and sealing peripherally an electronic circuit integrated in a major surface of a substrate of semiconductor material. The electronic circuit is of the type that calls for formation above the major surface of at least one dielectric multilayer. The dielectric multilayer includes a layer of amorphous planarizing material having a continuous portion extending between two contiguous areas with a more internal first area and a more external second area in the morphological structure. The device edge morphological structure includes in the substrate an excavation on the side of the major surface at the more internal first area of the morphological structure in a zone in which is present the continuous portion of the dielectric multilayer.
Abstract:
The invention relates to a method of recovering faulty non-volatile memories. This method can be applied to an electrically programmable semiconductor non-volatile memory device set up as a multi-sector memory matrix and including selection circuitry for selecting words or individual bytes of the memory. According to this method, the memory matrix is addressed by byte, rather than by memory word, by selection circuitry, whenever the device fails an operation test. The use of a Hamming code for error correction to remedy malfunctions due to manufacture allows the method to be applied to those devices which fail their test and would otherwise be treated as rejects.
Abstract:
A MOS technology power device comprises a semiconductor material layer of a first conductivity type, a plurality of elementary functional units, a first insulating material layer placed above the semiconductor material layer and a conductive material layer placed above the first insulating material layer. Each elementary functional unit includes an elongated body region of a second conductivity type formed in the semiconductor material layer. Each elementary functional unit further includes a first elongated window in the conductive material layer extending above the elongated body region. Each elongated body region includes a source region doped with dopants of the first conductivity type, intercalated with a portion of the elongated body region wherein no dopant of the first conductivity type are provided. The MOS technology power device further includes a second insulating material layer disposed above the conductive material layer and disposed along elongated edges of the first elongated window. The second insulating material layer includes a second elongated window extending above each elongated body region. The second insulating material layer seals the edges of the conductive material layer from a source metal layer disposed over the second insulating material layer. The source metal layer contacts each body region and each source region through each second elongated window along the length of the elongated body region.
Abstract:
A MOS-gated power device integrated structure comprises a plurality of elementary units formed in a semiconductor material layer of a first conductivity type. Each elementary unit is formed in a body stripe of a second conductivity type. There are a plurality of body stripes of the second conductivity type extending substantially in parallel to each other and at least one source region of the first conductivity type disposed within each body stripe. A conductive gate layer is insulatively disposed over the semiconductor material layer between the body stripes in the form of a first web structure. A second web structure of the second conductivity type is formed in the semiconductor material layer and comprises an annular frame portion surrounding the plurality of body stripes and at least one first elongated stripe extending between two sides of the annular frame portion in a direction substantially orthogonal to the body stripes and that is merged at each end with the annular frame portion. The body stripes are divided by the at least one first elongated stripe into at least two groups of body stripes, wherein one end of each body stripe is merged with the annular frame portion of the second conductivity type and the other end is merged with the at least one first elongated stripe. A conductive gate finger is insulatively disposed above the first elongated stripe and is part of the first web structure. A conductive gate ring surrounds the conductive gate layer and the conductive gate finger and completes the first web structure. A metal gate finger is disposed above the conductive gate finger and is merged at its ends with a metal gate ring structure disposed above the conductive gate ring to provide a third web structure. Source metal plates cover the at least two groups of body stripes and contact each source region and each body stripe to form a source electrode of the power device. A bottom surface of the semiconductor material layer forms a drain of the power device.
Abstract:
The microtips of charge emitting material, which define the cathode of the flat FED screen and face the grid of the screen, are tubular and have portions with a small radius of curvature. The microtips are obtained by forming openings in the dielectric layer separating the cathode connection layer from the grid layer, depositing a conducting material layer to cover the walls of the openings, and anisotropically etching the layer of conducting material to form inwardly-inclined surfaces with emitting tips. Subsequently, the portions of the dielectric layer surrounding the microtips are removed.
Abstract:
A filter performs a reduction of pulsed noise in video images in accordance with fuzzy logic. An interface circuit of the filter receives consecutive digital signals in time corresponding to the video images and generates an image window having a digital signal to be processed at the center. The filter also has a comparator block, a plurality of digital subtractors, and a memory circuit connected in cascade to the comparator block. The filter also has a filtering circuit that organizes values of digital signals of the video image, and an arithmetic block that performs a switch between the digital signal to be processed and the output of the filtering circuit on the basis of the values taken by the parameter.