Abstract:
An infrared imaging system includes a phase grating overlying a two-dimensional array of thermally sensitive pixels. The phase grating comprises a two-dimensional array of identical subgratings that define a system of Cartesian coordinates. The subgrating and pixel arrays are sized and oriented such that the pixels are evenly distributed with respect to the row and column intersections of the subgratings. The location of each pixel thus maps to a unique location beneath a virtual archetypical subgrating.
Abstract:
Described are memory modules that support different error detection and correction (EDC) schemes in both single- and multiple-module memory systems. The memory modules are width configurable, and support the different EDC schemes for relatively wide and narrow module data widths. Data buffers on the modules support the half-width and full-width modes, and also support time-division-multiplexing to access additional memory components on each module in support of enhanced EDC.
Abstract:
A memory module uses dynamic data buffers for providing extended capacity for computing systems. The memory module comprises an external interface having a first set of data pins and a second set of data pins. The memory module includes a first set of memory chips and a second set of memory chips. The memory module includes a first registering clock driver to control the first set of memory chips and a second registering clock driver to control the second set of memory chips. The memory module further includes a first data buffer to connect the first set of memory chips to the first set of data pins and a second data buffer to connect the second set of memory chips to the second set of data pins.
Abstract:
A multiple memory rank selection method and system assigns, based at least in part on decoding an assignment signal in a second command/address signal, a first terminal of a memory device to receive a first command/address signal and a second terminal of the memory device to receive the second command/address signal or assigns the first terminal of the memory device to receive the second command/address signal and the second terminal of the memory device to receive the first command/address signal. The multiple memory selection method and system decodes a selection signal encoded in the first command/address signal and enables the memory device based at least in part on the assignment signal and the selection signal.
Abstract:
A memory controller (110) interfaces with one or more memory devices (120-n) having configurable width data buses and configurable connectivity between data pins of the memory devices and data pins of the memory controller. Upon initialization of the memory devices (120-n), the memory controller (110) automatically discovers the connectivity configuration of the one or more memory devices (120-n), including both individually selected and jointly selected devices. After discovering connectivity of the connected devices, the memory controller (110) configures the memory devices (120-n) according to the discovered connectivity and assigns unique addresses to jointly selected devices.
Abstract:
Embodiments of a memory controller are described. This memory controller includes signal connectors, which are electrically coupled to a communication path that includes multiple links, and an interface circuit, which is electrically coupled to the signal connectors. In a first operating mode, the interface circuit communicates with a first memory device via the communication path using spatial multiplexing, in which there are dedicated command/address links and dedicated data links in the communication path. Moreover, in a second operating mode, the interface circuit communicates with a second memory device via the communication path using time multiplexing, in which at least some of the links in the communication path time interleave command/address information and data.
Abstract:
The embodiments are directed to technologies for variable pitch vertical interconnect design for scalable escape routing in semiconductor devices. One semiconductor device includes a circuit die, and an array of circuit die interconnects located on the circuit die. The array includes a first triangular octant of interconnects that are organized in rows and columns, each column incrementing its number of interconnects from a first side of the first triangular octant to a second side of the first triangular octant. A pitch size between the columns increases in a first repeating pattern from the first side to the second side.
Abstract:
A memory module includes cache of relatively fast and durable dynamic, random-access memory (DRAM) in service of a larger amount of relatively slow and wear-sensitive non-volatile memory. Local controller manages communication between the DRAM cache and non-volatile memory to accommodate disparate access granularities, reduce the requisite number of memory transactions, and minimize the flow of data external to nonvolatile memory components.
Abstract:
Described are memory modules that support different error detection and correction (EDC) schemes in both single-and multiple-module memory systems. The memory modules are width configurable and support the different EDC schemes for relatively wide and narrow module data widths. Data buffers on the modules support the half-width and full-width modes, and also support time-division-multiplexing to access additional memory components on each module in support of enhanced EDC.
Abstract:
A memory component and a controller communicate commands and data with each other The commands to activate and then access data, and the data itself, are all communicated between a controller and the memory component at different times. The controller and memory component each calculate a respective error detecting code (EDC) values on the activate command information (e.g., bank address and row address) and store them indexed by the bank address. When the memory component is accessed, retrieved EDC values are combined with EDC values calculated from the access command information, and the data itself. The memory component transmits its combined EDC value to the controller for checking.