公开(公告)号：US07532484B1

公开(公告)日：2009-05-12

申请号：US12069469

申请日：2008-02-11

Applicant: Steven L. Sailor ,  Hugh R. Hunkeler ,  Lee R. Hinze

Inventor： Steven L. Sailor ,  Hugh R. Hunkeler ,  Lee R. Hinze

IPC: H01R9/00

CPC classification number: H01G2/06 ,  H01G2/103 ,  H01R12/585 ,  H05K3/301 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10325 ,  H05K2201/1059 ,  H05K2201/10651

Abstract: An electronic component assembly includes an electrical component assembled to a base and mounted to a support. The component electrical leads protrude through holes, along a channel, and make contact with connectors on the base. The base is formed of a polymeric material and contains protrusions for mechanically supporting the electrical component. When the base is mounted to the support, the connectors complete the electrical connection between the electrical component and the support.

Abstract translation: 电子部件组件包括组装到基座并安装到支撑件的电气部件。 部件电气引线沿着通道突出穿过孔，并与基座上的连接器接触。 基座由聚合物材料形成并且包含用于机械地支撑电气部件的凸起。 当基座安装到支撑件上时，连接器完成电气部件和支撑件之间的电气连接。

公开(公告)号：US20090009977A1

公开(公告)日：2009-01-08

申请号：US11883137

申请日：2006-01-24

Applicant: Noritsugu Enomoto ,  Hirofumi Utsunomiya ,  Ken Kamimura ,  Shigeki Motomura ,  Shigeharu Aoyagi ,  Junichi Takeda

Inventor： Noritsugu Enomoto ,  Hirofumi Utsunomiya ,  Ken Kamimura ,  Shigeki Motomura ,  Shigeharu Aoyagi ,  Junichi Takeda

IPC: H05K1/00

CPC classification number: H05K3/326 ,  H05K1/0278 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/2009 ,  H05K2203/1189 ,  H05K2203/302

Abstract: A three-dimensional, electronic components mounted wiring body comprises a flat wiring body, on which a plurality of electronic components is mounted, and which is preformed with bends to be configured into a three-dimensional structured flat wiring body which fits the shape of a base structure on which the flat wiring body is to be mounted. An electronic components mounting structure is provided by mounting the three-dimensional, electronic components mounted wiring body on the three-dimensional base structure which is assembled from base members and their joining members. Connectors having piercing members are used to electrically and mechanically connect the electronic components to the flat wiring body.

Abstract translation: 一种三维电子元件安装布线体，包括：平面布线体，多个电子部件安装在该平面布线体上，并且被预先形成为三维结构化的扁平布线体，该三维结构的扁平布线体适合于 基座结构，其上安装有扁平布线体。 通过将三维电子部件安装线路体安装在从基座部件及其接合部件组装的三维基座结构上而构成电子部件安装结构。 具有穿孔构件的连接器用于电气和机械地将电子部件连接到扁平布线体。

公开(公告)号：US20080236880A1

公开(公告)日：2008-10-02

申请号：US12056854

申请日：2008-03-27

Applicant: Hirotoshi OZAKI ,  Akiko MORIMOTO ,  Tetsuya YAMASHITA

Inventor： Hirotoshi OZAKI ,  Akiko MORIMOTO ,  Tetsuya YAMASHITA

IPC: H01R12/06 ,  H05K1/00

CPC classification number: H01R12/7082 ,  H05K1/182 ,  H05K3/3421 ,  H05K2201/09836 ,  H05K2201/10037 ,  H05K2201/10484 ,  H05K2201/10651 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/082

Abstract: A lead-attached electrical element and a mounting board to which the lead-attached electrical element is mounted both contribute to a reduction in the size of the mounting board as well as facilitate rework. The lead-attached electrical element is constituted from an electrical element and two leads. Each lead includes a main portion which is bonded to a respective electrode face of the electrical element, and a bent portion which is inclined with respect to the main portion. The mounting board is constituted from a PC (printed circuit) board and the lead-attached electrical element. Two conductive lands are provided on a surface of the PC board. The lead-attached electrical element has been inserted into an aperture in the PC board, and bent portions of the leads attached to the electrical element are bonded to the conductive lands so that the electrical element is suspended in the aperture by the leads.

Abstract translation: 安装有引线的电气元件的引线附接电气元件和安装板都有助于减小安装板的尺寸并且便于返工。 引线连接的电气元件由电气元件和两个引线构成。 每个引线包括结合到电气元件的相应电极面的主要部分和相对于主要部分倾斜的弯曲部分。 安装板由PC（印刷电路板）和带引线的电气元件构成。 在PC板的表面上设置两个导电焊盘。 引线连接的电气元件已经插入到PC板的孔中，并且附接到电气元件的引线的弯曲部分被接合到导电焊盘，使得电气元件通过引线悬挂在孔中。

公开(公告)号：US20080225461A1

公开(公告)日：2008-09-18

申请号：US12039284

申请日：2008-02-28

Applicant: Yukihiko SHIRAKAWA ,  Iwao MIURA

Inventor： Yukihiko SHIRAKAWA ,  Iwao MIURA

IPC: H01G4/224

CPC classification number: H01G2/06 ,  H01C1/14 ,  H01G4/228 ,  H01G9/008 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/611 ,  Y02P70/613

Abstract: There are provided an electronic component permitting easy surface mounting onto a circuit board and, a mounted structure and an inverter device therewith.A surface mount type electronic component has a dielectric element body, electrodes, lead conductors, and lead wires. The dielectric element body has principal faces and side faces. One electrode is formed on one principal face, the other electrode is formed on the other principal face, and the electrodes face each other. A first portion of one lead conductor is laid on one side face. A first portion of the other lead conductor is laid on another side face. First portions of the lead wires are connected to the corresponding first portions of the lead conductors.

Abstract translation: 提供了允许容易地安装到电路板上的电子部件，以及安装的结构和与其相反的逆变器装置。 表面安装型电子部件具有电介质元件主体，电极，引线导体和引线。 电介质元件主体具有主面和侧面。 一个电极形成在一个主面上，另一个电极形成在另一个主面上，电极彼此面对。 一个引线导体的第一部分放置在一个侧面上。 另一个引线导体的第一部分被放置在另一侧面上。 引线的第一部分连接到引线导体的对应的第一部分。

公开(公告)号：US20070285909A1

公开(公告)日：2007-12-13

申请号：US11422904

申请日：2006-06-08

Applicant: Wiclyff T. Bonga ,  William H. Tarver

Inventor： Wiclyff T. Bonga ,  William H. Tarver

IPC: H05K7/14 ,  H05K7/18

CPC classification number: H05K3/301 ,  H05K2201/1003 ,  H05K2201/10409 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2203/167

Abstract: A printed wiring assembly is provided. The printed wiring assembly comprises a printed wiring board; an electrical component adapted to electrically couple to the printed wiring board via one or more leads; and a mounting device having a base adapted to non-adhesively fasten to the printed wiring board, wherein the base has a cavity formed by at least one side wall and a bottom wall of the base which receives and partially encapsulates the electrical component.

Abstract translation: 提供印刷线路组件。 印刷线路组件包括印刷线路板; 电气部件，适于经由一个或多个引线电耦合到印刷线路板; 以及安装装置，其具有适于不粘合地固定到印刷线路板的基部，其中，所述基座具有由基部的至少一个侧壁和底壁形成的空腔，所述空腔接收并部分地封装所述电气部件。

公开(公告)号：US20070188975A1

公开(公告)日：2007-08-16

申请号：US11703171

申请日：2007-02-07

Applicant: Masaaki Togashi ,  Kentaro Ushioda

Inventor： Masaaki Togashi ,  Kentaro Ushioda

IPC: H01G4/228

CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3426 ,  H05K2201/10469 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613

Abstract: A ceramic capacitor comprises a ceramic sintered body, and first and second terminal electrodes formed on outer surfaces of the ceramic sintered body. The first terminal electrode is electrically connected to a land formed on a substrate through a first metal terminal. The first metal terminal has a first capacitor connecting portion mechanically connected to the first terminal electrode, a first terminal portion mechanically connected to the land, and a first intermediate portion electrically connecting the first capacitor connecting portion and the first terminal portion to each other. The first capacitor connecting portion of the first metal terminal is parallel to the substrate.

Abstract translation: 陶瓷电容器包括陶瓷烧结体和形成在陶瓷烧结体的外表面上的第一和第二端电极。 第一端子电极通过第一金属端子电连接到形成在基板上的焊盘。 第一金属端子具有机械地连接到第一端子电极的第一电容器连接部分，机械地连接到焊盘的第一端子部分和将第一电容器连接部分和第一端子部分彼此电连接的第一中间部分。 第一金属端子的第一电容器连接部分平行于基板。

公开(公告)号：US20070017699A1

公开(公告)日：2007-01-25

申请号：US11486028

申请日：2006-07-14

Applicant: Toshio Ishimoto ,  Toshihiko Sasaki ,  Naofumi Okayama ,  Masayoshi Terashima

Inventor： Toshio Ishimoto ,  Toshihiko Sasaki ,  Naofumi Okayama ,  Masayoshi Terashima

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K3/306 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3468 ,  H05K3/4069 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K2203/1178

Abstract: A pair of through holes are formed in a circuit board, and a silver paste filled up in the through holes connects lands formed on a front surface and a rear surface of the circuit board, respectively to each other. When the silver paste is solidified, the silver paste bulges curvedly from the front and rear surfaces of the circuit board and forms a bump. A surface of the bump is covered with an overcoat. An electronic component is brought into contact with the bump, thereby forming a degassing gap between the electronic component and the circuit board. A gas generated during soldering is discharged from the penetrating hole, into which the lead terminal is inserted, to an outside via the gap between the electronic component and the circuit board.

Abstract translation: 一对通孔形成在电路板中，并且填充在通孔中的银浆分别将形成在电路板的前表面和后表面上的焊盘彼此连接。 当银膏凝固时，银膏从电路板的前表面和后表面弯曲地凸起并形成凸起。 凸起的表面被外涂层覆盖。 电子部件与凸块接触，从而在电子部件和电路板之间形成脱气间隙。 在焊接期间产生的气体经由电子部件和电路板之间的间隙从引导端子插入的贯通孔排出到外部。

公开(公告)号：US07112071B2

公开(公告)日：2006-09-26

申请号：US11290558

申请日：2005-12-01

Applicant: Tooru Nakagawa ,  Kazuhiro Yamamoto

Inventor： Tooru Nakagawa ,  Kazuhiro Yamamoto

IPC: H01R12/00

CPC classification number: H01R12/58 ,  H01R13/112 ,  H05K3/301 ,  H05K2201/10333 ,  H05K2201/10651 ,  H05K2201/10962

Abstract: In a structure for attaching a circuit board terminal to a circuit board, stress is minimized in a soldered portion on a circuit section upon inserting and drawing an electrical element into and from the circuit board. The attaching structure including a holding member mounted on and secured to a circuit board, a bus bar that has a base portion supported on the holding member and a leg portion that passes one or more through-holes and to be soldered on a circuit section, and a circuit board terminal that has a base portion to be connected to the bus bar and a connection portion adapted to be coupled to a terminal of an electrical element. The bus bar is provided on the base portion with elastic tongue pieces that can contact elastically with a circuit board terminal. The circuit board terminal is connected through the bus bar to the circuit section.

Abstract translation: 在将电路基板端子安装在电路基板上的结构中，将电气元件插入电路基板并从电路基板上拔出时，电路部分的焊接部位的应力最小化。 该安装结构包括安装在电路板上并固定到电路板上的保持构件，具有支撑在保持构件上的基部的汇流条和通过一个或多个通孔并被焊接在电路部分上的支脚部分， 以及电路板端子，其具有要连接到母线的基座部分和适于联接到电气元件的端子的连接部分。 汇流条在基部上设置有可与电路板端子弹性接触的弹性舌片。 电路板端子通过母线连接到电路部分。

公开(公告)号：US07064278B2

公开(公告)日：2006-06-20

申请号：US10106977

申请日：2002-03-25

Applicant: Michael C. Seckora

Inventor： Michael C. Seckora

IPC: H05K1/16

CPC classification number: H05K1/0243 ,  H05K1/0231 ,  H05K3/305 ,  H05K3/3426 ,  H05K2201/09727 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49169

Abstract: Methods and apparatus provide for electrical coupling of electrical components to traces on a substrate such that impedance mismatches otherwise experienced in high frequency operation are avoided. Connecting elements having length, width, and thickness, are provided for terminals of a component to be connected to a trace. The connecting element is electrically coupled between the terminal and the trace, typically by soldering. The dimensions of the connecting element are chosen to reduce or eliminate the impedance mismatch which would result from a direct connection between the trace and component. Connecting elements are generally L-shaped, i.e., having first and second planar portions perpendicular with respect to each other, and having a curving portion that connects the first and second planar portions. In one embodiment, dimensions of at least a portion of the connecting element are such that its width increases as its distance from a ground plane within the substrate increases.

公开(公告)号：US07002813B2

公开(公告)日：2006-02-21

申请号：US10415267

申请日：2002-10-31

Applicant: Eduard Bergmann ,  Herwig Rilling ,  Peter Westermayr ,  Clemens Hofbauer ,  Boris Klebensberger ,  Karsten Wambach

Inventor： Eduard Bergmann ,  Herwig Rilling ,  Peter Westermayr ,  Clemens Hofbauer ,  Boris Klebensberger ,  Karsten Wambach

IPC: H05K7/02 ,  H05K3/36 ,  B23P19/00

CPC classification number: H05K3/202 ,  H01L31/02013 ,  H01R13/24 ,  H01R13/665 ,  H01R43/24 ,  H02S40/34 ,  H02S40/345 ,  H05K1/187 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10651 ,  Y02E10/50 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/53174 ,  Y10T29/53209 ,  Y10T29/53265

Abstract: An arrangement which has a panel-like electrical/electronic module, such as a solar power module, and a connection unit which are electrically connected to one another. The module and the connection unit each have an essentially flat printed conductor structure with connecting sections. The printed conductor structures are situated in parallel planes. The connecting sections are rigid electrical conductor sections and are bent out from the planes of the printed conductor structures of the connection unit and the module. The connecting sections of the connection unit are situated corresponding to the arrangement of the connecting sections of the module so that for the connection unit connected to the module each connecting section of the module is electrically connected to a respective connecting section of the connection unit and these adjoin one another in one section situated in a different spatial position than that of the planes of the printed conductor structures.

Abstract translation: 具有彼此电连接的诸如太阳能电源模块的面板式电气/电子模块和连接单元的布置。 模块和连接单元各自具有基本上平坦的具有连接部分的印刷导体结构。 印刷的导体结构位于平行平面中。 连接部分是刚性电导体部分，并且从连接单元和模块的印刷导体结构的平面弯曲出来。 连接单元的连接部分对应于模块的连接部分的布置，使得对于连接到模块的连接单元，模块的每个连接部分电连接到连接单元的相应连接部分，并且这些连接部分 位于与印刷导体结构的平面不同的空间位置的一个部分中彼此相邻。