公开(公告)号：US20180207697A1

公开(公告)日：2018-07-26

申请号：US15745849

申请日：2016-07-22

Applicant: SUMITOMO ELECTRIC HARDMETAL CORP. ,  Sumitomo Electric Industries, Ltd. ,  A.L.M.T. Corp.

Inventor： Makoto Yukawa ,  Bunya Suemitsu ,  Takuya Kinoshita ,  Shigetoshi Sumimoto ,  Yutaka Kobayashi ,  Akihiko Ueda ,  Natsuo Tatsumi ,  Yoshiki Nishibayashi ,  Hitoshi Sumiya

IPC: B21C3/02 ,  C23C16/27 ,  C30B29/04 ,  C30B25/20 ,  C30B25/10

CPC classification number: B21C3/025 ,  B21C3/02 ,  C23C16/27 ,  C30B25/105 ,  C30B25/20 ,  C30B29/04

Abstract: A diamond die includes a diamond provided with a hole for drawing a wire material, the diamond being a CVD single-crystal diamond, an axis of the hole being inclined relative to a normal direction of a crystal plane of the diamond.

公开(公告)号：US20170287810A1

公开(公告)日：2017-10-05

申请号：US15507938

申请日：2015-09-01

Applicant: A.L.M.T. Corp. ,  Sumitomo Electric Industries, Ltd.

Inventor： Tatsuya Morikawa ,  Takanori Kadokura ,  Isao Iwayama

IPC: H01L23/373 ,  B22F3/16 ,  F28F21/08 ,  B22F3/14 ,  H01L21/48 ,  F28F21/00

Abstract: A heat radiating member includes: a composite portion composed of a composite material which contains particles of a satisfactorily thermally conductive material in a metal matrix; and a metal layer formed on at least one surface of the composite portion and composed of a metal. A method for producing a heat radiating member includes: a preparation step to prepare a composite material which contains particles of a satisfactorily thermally conductive material in a metal matrix; a powder arrangement step to dispose a metal powder composed of metal particles on at least one surface of the composite material; and a heating step to heat the composite material and the metal powder, with the metal powder disposed on the composite material, to form a metal layer composed of a metal of the metal powder on a composite portion composed of the composite material.

公开(公告)号：US20170198991A1

公开(公告)日：2017-07-13

申请号：US15312931

申请日：2015-05-13

Applicant: A.L.M.T. Corp.

Inventor： Hiroaki OKI ,  Tadashi ARIKAWA ,  Shouichi INABA

IPC: F28F21/08 ,  B32B37/10 ,  B32B3/26 ,  B32B15/01 ,  B32B15/20

CPC classification number: F28F21/085 ,  B22F3/10 ,  B22F7/06 ,  B32B3/263 ,  B32B15/01 ,  B32B15/20 ,  B32B37/10 ,  B32B2250/03 ,  B32B2307/302 ,  B32B2311/12 ,  B32B2457/14 ,  C22C9/00 ,  C22C27/04 ,  F28F13/00 ,  F28F21/081 ,  H01L23/373 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H01L2924/00

Abstract: [Problem] To provide a heat spreader capable of removing heat from an element more efficiently and immediately than an existing one, and also capable of satisfactorily responding to further enhancement in performance and output of various apparatuses, and a method for efficiently manufacturing the same. [Solution] A heat spreader includes a Cu—Mo layer made of a Cu—Mo composite material and having an average thickness of less than or equal to 0.6 mm and a variation in thickness of less than or equal to 0.1 mm, and a Cu layer directly stacked on each of both surfaces thereof. A method for manufacturing the heat spreader includes planarizing a plate material of the Cu—Mo composite material constituting the Cu—Mo layer, and roll-bonding a Cu plate constituting the Cu layer to each of both surfaces thereof.

公开(公告)号：US20150351241A1

公开(公告)日：2015-12-03

申请号：US14759618

申请日：2013-12-17

Applicant: A.L.M.T. CORP.

Inventor： Yoshiyuki Hirose ,  Sachie Sugitani ,  Norihito Goma ,  Gouhei Toyoshima ,  Noboru Uenishi

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/115 ,  B22F2998/10 ,  B23K35/0233 ,  B23K35/262 ,  B32B15/00 ,  C22C5/02 ,  C22C5/04 ,  C22C5/06 ,  C22C9/00 ,  C22C14/00 ,  C22C27/04 ,  H01L23/15 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/18 ,  H05K3/4061 ,  Y10T29/49126 ,  H01L2924/00 ,  B22F7/004 ,  B22F3/26

Abstract: A ceramic wiring substrate and method for manufacturing the same, the substrate having an up-and-down conduction body which is made by forming a porous structure body from a high melting point metal and then infiltrating a low-resistance metal in an up-and-down conduction hole subsequently formed in a substrate made in a plate shape through sintering a ceramic precursor, the conduction body having a normal composite structure without an abnormally grown particle, a void, a crack and the like and not having a problem of falling off from the substrate, as well as provided a semiconductor device using this substrate. An intermediate layer formed of at least one selected from a group of Mo, W, Co, Fe, Zr, Re, Os, Ta, Nb, Ir, Ru and Hf is formed on an inner surface of the up-and-down conduction hole of the substrate before being provided with the conduction body having the composite structure.

Abstract translation: 一种陶瓷布线基板及其制造方法，所述基板具有上下导体，其通过从高熔点金属形成多孔结构体，然后在上下方向上渗入低电阻金属而制成 随后在通过烧结陶瓷前体而制成板状的基板中形成的导通体，导电体具有正常的复合结构，而没有异常生长的颗粒，空隙，裂纹等，并且不具有脱落的问题 并且提供使用该衬底的半导体器件。 在上下传导的内表面上形成由选自Mo，W，Co，Fe，Zr，Re，Os，Ta，Nb，Ir，Ru和Hf中的至少一种形成的中间层 在提供具有复合结构的导体之前，衬底的孔。

公开(公告)号：US20150056408A1

公开(公告)日：2015-02-26

申请号：US14531663

申请日：2014-11-03

Applicant: A.L.M.T. Corp.

Inventor： Takanori KADOKURA ,  Hidenobu NISHINO ,  Ayuri TSUJI ,  Shigekazu YAMAZAKI ,  Akihiko IKEGAYA

IPC: C22C27/04 ,  C22C32/00

CPC classification number: C22C27/04 ,  B21C25/025 ,  B22F3/17 ,  B22F3/20 ,  C22C1/045 ,  C22C1/0491 ,  C22C32/0031 ,  C22C32/0052 ,  C22C38/44 ,  C22C38/50 ,  Y10T428/12819 ,  Y10T428/12826 ,  Y10T428/12847 ,  Y10T428/24355 ,  Y10T428/265

Abstract: A heat-resistant member comprising a molybdenum alloy that comprises a first phase containing Mo as a main component and a second phase comprising a Mo—Si—B-based intermetallic compound particle phase, wherein the balance is an inevitable impurity and wherein the Si content is 0.05 mass % or more and 0.80 mass % or less and the B content is 0.04 mass % or more and 0.60 mass % or less. The member may be coated.

Abstract translation: 一种耐热构件，包括含有以Mo为主成分的第一相的钼合金和包含Mo-Si-B系金属间化合物粒子相的第二相，其中余量为不可避免的杂质，其中Si含量 为0.05质量％以上且0.80质量％以下，B含量为0.04质量％以上且0.60质量％以下。 该构件可以被涂覆。

公开(公告)号：US11819979B2

公开(公告)日：2023-11-21

申请号：US16078462

申请日：2016-12-07

Applicant: A.L.M.T. Corp.

Inventor： Sadateru Nakamatsu

IPC: B24D3/06 ,  B24D5/02 ,  B24D3/00 ,  B24B53/12 ,  B24D5/00 ,  B24B53/075

CPC classification number: B24D3/06 ,  B24B53/075 ,  B24B53/12 ,  B24D3/00 ,  B24D5/00 ,  B24D5/02 ,  B24D2203/00

Abstract: An abrasive tool has an abrasive grain layer comprising a plurality of hard abrasive grains bonded by a binder, with a plurality of the hard abrasive grains each having a working surface formed to contact a workpiece, a ratio of a total area of a plurality of such working surfaces to an area of an imaginary plane smoothly connecting the plurality of working surfaces being 5% or more and 30% or less.

公开(公告)号：US11668009B2

公开(公告)日：2023-06-06

申请号：US16969238

申请日：2019-01-30

Applicant: Sumitomo Electric Industries, Ltd. ,  A.L.M.T. Corp.

Inventor： Kengo Goto ,  Tomoaki Ikeda ,  Akihisa Hosoe ,  Masanori Sugisawa ,  Fukuto Ishikawa ,  Hideaki Morigami

IPC: C23C18/16 ,  C23C18/18 ,  C23C26/00 ,  C23C18/50 ,  C22C26/00 ,  B32B15/04 ,  H01L23/373 ,  C22C1/04 ,  C22C1/05 ,  C22C5/06 ,  C23C18/32 ,  H01L21/48 ,  B32B19/00 ,  B32B15/16 ,  B32B19/04 ,  B22F7/02

CPC classification number: C23C18/1651 ,  B32B15/04 ,  B32B15/043 ,  B32B15/16 ,  B32B19/00 ,  B32B19/041 ,  C22C1/0466 ,  C22C1/05 ,  C22C5/06 ,  C22C26/00 ,  C23C18/1637 ,  C23C18/1803 ,  C23C18/1827 ,  C23C18/1844 ,  C23C18/1879 ,  C23C18/32 ,  C23C18/50 ,  H01L21/4871 ,  H01L23/3732 ,  H01L23/3736 ,  B22F7/02 ,  B22F2998/10 ,  B22F2999/00 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/28 ,  Y10T428/12493 ,  Y10T428/12535 ,  Y10T428/12625 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12944 ,  Y10T428/12993 ,  B22F2999/00 ,  B22F7/02 ,  C22C1/05 ,  C22C26/00 ,  C22C1/0466 ,  B22F2998/10 ,  B22F7/02 ,  B22F2003/247 ,  B22F2003/244 ,  B22F2003/242

Abstract: A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm.

公开(公告)号：US20230058175A1

公开(公告)日：2023-02-23

申请号：US17793375

申请日：2020-12-22

Applicant: A.L.M.T. Corp.

Inventor： Hiroki YAMADA ,  Makoto YUKAWA

IPC: B23B27/20 ,  B23B27/00

Abstract: A single-crystal diamond cutting tool is provided with a flank and a rake face, a cutting edge being provided at a boundary between the flank and the rake face, an inclined surface being provided at a location distant from the cutting edge, the inclined surface being contiguous to the rake face and inclined at 0.05 degrees or more and 80 degrees or less with respect to the rake face, the rake face having a roughness Ra of 1 µm or less, the cutting edge being provided with a chamfered surface or round honing having a width of 1 µm or less, the cutting edge having projections and depressions having a width of 100 nm or less and smaller than that of the chamfered surface or round honing.

公开(公告)号：US20210381782A1

公开(公告)日：2021-12-09

申请号：US17285508

申请日：2019-08-30

Applicant: Sumitomo Electric Industries, Ltd. ,  A.L.M.T. Corp.

Inventor： Ryota MATSUGI ,  Isao IWAYAMA ,  Chieko TANAKA ,  Hideaki MORIGAMI

IPC: F28F21/08 ,  H01L23/373 ,  B23K35/30 ,  C22C5/08 ,  C22C26/00

Abstract: A composite member having an excellent heat resistance is provided. The composite member includes: a substrate composed of a composite material including a non-metal phase and a metal phase; and a metal layer that covers at least a portion of a surface of the substrate, wherein a metal included in each of the metal phase and the metal layer is mainly composed of Ag, and a ratio of a content of Cu to a total content of Ag and Cu in a boundary region of the metal layer with the substrate is less than or equal to 20 atomic %.

公开(公告)号：US11072008B2

公开(公告)日：2021-07-27

申请号：US15771591

申请日：2016-10-19

Applicant: Sumitomo Electric Industries, Ltd. ,  A.L.M.T. Corp.

Inventor： Hitoshi Sumiya ,  Takeshi Sato ,  Makoto Yukawa ,  Bunya Suemitsu

IPC: B21C3/02 ,  C01B32/25 ,  C22C26/00

Abstract: A wear-resistant tool includes composite polycrystalline diamond as a core, the composite polycrystalline diamond being composed of polycrystalline diamond in which particulate diamond is directly bonded and non diamond carbon. The polycrystalline diamond in the composite polycrystalline diamond is three-dimensionally continuous in composite polycrystal and primary particles have an average particle size from 10 to 500 nm.