EMISSION SYSTEM, APPARATUS, AND METHOD
    13.
    发明申请
    EMISSION SYSTEM, APPARATUS, AND METHOD 审中-公开
    排放系统,装置和方法

    公开(公告)号:US20100146968A1

    公开(公告)日:2010-06-17

    申请号:US12333886

    申请日:2008-12-12

    Abstract: A system, apparatus, and method for exhaust gas recirculation (EGR) is disclosed. The EGR apparatus includes an EGR circuit having an input configured to receive an exhaust gas from an engine exhaust port, an output configured to return the exhaust gas to an intake port of the engine, and an EGR path configured to circulate the exhaust gas between the input and the output. The EGR apparatus also includes an EGR compressor connected to the EGR circuit in the EGR path downstream of the input and EGR compressor configured to compress the exhaust gas for circulation to the output. The EGR apparatus further includes a valve system positioned in the EGR circuit and upstream of the EGR compressor to selectively cut off a flow of the exhaust gas to the EGR compressor and selectively inject ambient air into the EGR path.

    Abstract translation: 公开了一种用于废气再循环(EGR)的系统,装置和方法。 EGR装置包括:EGR回路,其具有被配置为接收来自发动机排气口的废气的输入,被配置为将排气返回到发动机的进气口的输出;以及EGR路径,其被配置为使废气在 输入和输出。 EGR装置还包括连接到EGR路径的EGR压缩机,该EGR回路在输入和EGR压缩机的下游被配置为压缩废气以循环到输出端。 EGR装置还包括位于EGR回路中和EGR压缩机上游的阀系统,以选择性地切断排放到EGR压缩机的排气流并选择性地将环境空气注入到EGR通路中。

    Slurry-less chemical-mechanical polishing
    14.
    发明授权
    Slurry-less chemical-mechanical polishing 有权
    无浆化学机械抛光

    公开(公告)号:US06569769B1

    公开(公告)日:2003-05-27

    申请号:US09702311

    申请日:2000-10-31

    CPC classification number: H01L21/31053

    Abstract: The invention provides slurry-less chemical-mechanical polishing processes which are effective in planarizing oxide materials, especially siliceous oxides, even where the starting oxide layer has significant topographical variation. The processes of the invention are preferably characterized by the use of a fixed abrasive polishing element and by use of an aqueous liquid medium containing a polyelectrolyte for at least a portion of the polishing process involving reduction in the amount of topographic variation (height differential) across the oxide material on the substrate. The method reduces or eliminates the transfer of topographic variations to levels below the desired planarization level. The processes enable elimination of special endpoint detection techniques. The processes are also especially suitable for polishing interlevel dielectrics.

    Abstract translation: 本发明提供无浆化学机械抛光方法,其有效平坦化氧化物材料,特别是硅氧化物,即使起始氧化物层具有显着的形貌变化。 本发明的方法优选的特征在于使用固定的研磨抛光元件,并且通过使用含有聚电解质的含水液体介质,用于抛光过程的至少一部分,包括减少跨越的地形变化量(高差) 衬底上的氧化物材料。 该方法减少或消除了地形变化的转移到低于期望的平坦化水平的水平。 这些过程能够消除特殊的端点检测技术。 该工艺也特别适用于抛光层间电介质。

    SYSTEM AND METHOD FOR WASTE HEAT RECOVERY IN EXHAUST GAS RECIRCULATION
    17.
    发明申请
    SYSTEM AND METHOD FOR WASTE HEAT RECOVERY IN EXHAUST GAS RECIRCULATION 审中-公开
    废气回收废气回收系统及方法

    公开(公告)号:US20110209473A1

    公开(公告)日:2011-09-01

    申请号:US12713275

    申请日:2010-02-26

    Abstract: A system and method for waste heat recovery in exhaust gas recirculation is disclosed. The system includes an engine having an intake manifold and an exhaust manifold, an exhaust conduit connected to the exhaust manifold, and a turbocharger having a turbine and a compressor, the turbine being connected to the exhaust conduit to receive a portion of the exhaust gas from the exhaust manifold. The system also includes an EGR system connected to the exhaust conduit to receive a portion of the exhaust gas, with the EGR system including an EGR conduit that is connected to the exhaust conduit to receive a portion of the exhaust gas, a heat exchanger connected to the EGR conduit and being configured to extract heat from the exhaust gas, and a waste heat recovery system connected to the heat exchanger and configured to capture the heat extracted by the heat exchanger.

    Abstract translation: 公开了废气再循环中废热回收的系统和方法。 该系统包括具有进气歧管和排气歧管的发动机,连接到排气歧管的排气管,以及具有涡轮机和压缩机的涡轮增压器,所述涡轮机连接到排气管道,以将废气的一部分从 排气歧管。 该系统还包括连接到排气管道以接收废气的一部分的EGR系统,其中EGR系统包括连接到排气管道以接收废气的一部分的EGR导管,连接到 所述EGR导管被构造成从所述废气中提取热量;以及废热回收系统,其连接到所述热交换器并且构造成捕获由所述热交换器抽取的热量。

    COMPRESSED AIR ENERGY STORAGE SYSTEM WITH REVERSIBLE COMPRESSOR-EXPANDER UNIT
    18.
    发明申请
    COMPRESSED AIR ENERGY STORAGE SYSTEM WITH REVERSIBLE COMPRESSOR-EXPANDER UNIT 审中-公开
    具有可逆压缩机扩展单元的压缩空气能量储存系统

    公开(公告)号:US20110094212A1

    公开(公告)日:2011-04-28

    申请号:US12607262

    申请日:2009-10-28

    CPC classification number: F02C1/02 F02C6/16 H02J15/006 Y02E60/15

    Abstract: A system and method for compressing and expanding air in a compressed air energy storage (CAES) system is disclosed. A CAES system is provided that is alternately operable in a compression mode and an expansion mode and includes therein a motor-generator unit and a drive shaft connected to the motor-generator unit that is configured to transmit rotational power to and from the motor-generator unit. The CAES system also includes at least one reversible compressor-expander unit coupled to the drive shaft and configured to selectively compress and expand air, and an air storage unit connected to the reversible compressor-expander unit and configured to store compressed air received therefrom, with the at least one reversible compressor-expander unit compressing air during the compression mode and expanding air during the expansion mode.

    Abstract translation: 公开了一种用于在压缩空气能量存储(CAES)系统中压缩和膨胀空气的系统和方法。 提供CAES系统,其可以在压缩模式和膨胀模式下交替地操作,并且其中包括电动发电机单元和连接到电动发电机单元的驱动轴,该电动发电机单元被配置为向电动发电机 单元。 CAES系统还包括耦合到驱动轴并被配置为选择性地压缩和膨胀空气的至少一个可逆压缩机 - 膨胀器单元,以及连接到可逆压缩机 - 膨胀器单元并被构造成存储从其接收的压缩空气的空气存储单元, 所述至少一个可逆压缩机 - 膨胀器单元在压缩模式期间压缩空气并且在膨胀模式期间膨胀空气。

    Polyelectrolyte dispensing polishing pad
    19.
    发明申请
    Polyelectrolyte dispensing polishing pad 失效
    聚电解质抛光垫

    公开(公告)号:US20050153643A1

    公开(公告)日:2005-07-14

    申请号:US10996669

    申请日:2004-11-24

    CPC classification number: B24B37/245 B24D3/34 H01L21/31053 H01L21/3212

    Abstract: A polyelectrolyte dispensing polishing pad, a process for its production and a method of polishing, e.g., chemical mechanical polishing (CMP), a substrate such as a semiconductor wafer, are provided. The pad is usable for CMP planarization of an oxide or metal layer on the wafer. The pad has a polishing layer of erodible binder material containing uniformly distributed therein both abrasive particles and a water soluble ionizable electrolyte substance such as a polyelectrolyte, such that during polishing the binder material incrementally erodes and the abrasive particles and electrolyte substance is incrementally release into direct contact with the substrate. The electrolyte substance inhibits CMP removal of silicon nitride, e.g., as a stop layer, under an upper oxide or metal layer, such that the upper layer is selectively polished and the CMP stops on the stop layer leaving the latter intact.

    Abstract translation: 提供聚电解质分配抛光垫,其制造方法和抛光方法,例如化学机械抛光(CMP),诸如半导体晶片的基板。 衬垫可用于晶片上的氧化物或金属层的CMP平坦化。 该垫具有含有均匀分布在其中的磨蚀性颗粒和水溶性可电离电解质物质如聚电解质的可侵蚀粘合剂材料的抛光层,使得在抛光期间粘合剂材料逐渐侵蚀,并且研磨颗粒和电解质物质逐渐释放到直接 与基板接触。 该电解质物质抑制了在上部氧化物或金属层下的作为停止层的氮化硅的CMP去除,使得上层被选择性地抛光,并且CMP停止在停止层上,使其保持不变。

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