公开(公告)号：US07994864B2

公开(公告)日：2011-08-09

申请号：US12637102

申请日：2009-12-14

Applicant: Hung-I Chen ,  Yen-Hsun Hsu ,  Sung-Han Wen ,  Wei-Cheng Tang

Inventor： Hung-I Chen ,  Yen-Hsun Hsu ,  Sung-Han Wen ,  Wei-Cheng Tang

IPC: H03F3/04

CPC classification number: H03F3/185 ,  H03F1/0211 ,  H03F3/45475 ,  H03F3/68 ,  H03F2200/03 ,  H03F2200/408

Abstract: A DC-coupled audio out unit is provided, including at least one regulator and at least one audio amplifier. The regulator is coupled to at least one power terminal of the audio amplifier.

Abstract translation: 提供了一个DC耦合音频输出单元，包括至少一个调节器和至少一个音频放大器。 调节器耦合到音频放大器的至少一个电源端子。

公开(公告)号：US07888172B2

公开(公告)日：2011-02-15

申请号：US12330790

申请日：2008-12-09

Applicant: Cheng-Tang Huang

Inventor： Cheng-Tang Huang

IPC: H01L21/00 ,  H01L21/469

CPC classification number: H01L24/19 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18162 ,  Y10S438/977 ,  H01L2224/82 ,  H01L2224/83

Abstract: A chip package structure is provided, includes a chip that having a plurality of pads and an adhesive layer on the back side; an encapsulated structure is covered around the four sides of the chip to expose the pads, and the through holes is formed within the encapsulated structure; a patterned first protective layer is formed on the portion surface of encapsulated structure, the portion of active surface of the chips, and the pads of the chip and the through holes are to be exposed; a metal layer is formed on the portion surface of the patterned first protective layer and formed to electrically connect the pads and to fill with the through holes; the patterned second protective layer is formed on the patterned first protective layer and the portion of metal layer, and the portion surface of metal layer is to be exposed; a patterned UBM layer is formed on the exposed surface of the metal layer and the portion surface of the patterned second protective layer; and the conductive elements is formed on the patterned UBM layer and electrically connect to the metal layer.

Abstract translation: 提供了一种芯片封装结构，包括：具有多个焊盘的芯片和在背面上的粘合剂层; 封装结构被覆盖在芯片的四边周围以露出焊盘，并且在封装结构内形成通孔; 图案化的第一保护层形成在封装结构的部分表面上，芯片的有源表面的部分以及芯片的焊盘和通孔的露出; 在图案化的第一保护层的部分表面上形成金属层，以形成电连接焊盘并填充通孔; 图案化的第二保护层形成在图案化的第一保护层和金属层的一部分上，并且金属层的部分表面将被暴露; 图案化的UBM层形成在金属层的暴露表面和图案化的第二保护层的部分表面上; 并且导电元件形成在图案化的UBM层上并电连接到金属层。

公开(公告)号：US20100214778A1

公开(公告)日：2010-08-26

申请号：US12389383

申请日：2009-02-20

Applicant: Cheng-Tang Chen

Inventor： Cheng-Tang Chen

IPC: F21V8/00

CPC classification number: F21S6/003 ,  F21Y2115/10 ,  G02B6/001

Abstract: The table lamp contains a lamp base and an extension tube plugged vertically into the lamp base. A curved transparent light tube is attached along its entire length to a parallel and also curved back cover. The combination is joined to a top end of the extension tube. Two light generation assemblies are provided at the two ends of the light tube, respectively, each sequentially composed of a lens, a lens ring, a light emitting diode, a power circuit, a heat dissipation plate, and a heat dissipation element. The light from the light emitting diodes is projected into the light tube and, with a reflection layer along the inner wall of the light tube, the light is uniformly reflected towards the area beneath the table lamp.

Abstract translation: 台灯包含一个灯座和一个垂直插入灯座的延长管。 弯曲的透明光管沿其整个长度附接到平行且也是弯曲的后盖。 该组合件连接到延伸管的顶端。 分别在光管的两端分别设置两个发光组件，每个发光组件依次由透镜，透镜环，发光二极管，电源电路，散热板和散热元件组成。 来自发光二极管的光被投射到光管中，并且沿着光管的内壁的反射层将光均匀地反射到台灯下方的区域。

公开(公告)号：US20080185716A1

公开(公告)日：2008-08-07

申请号：US11836146

申请日：2007-08-09

Applicant: Cheng-Tang Huang

Inventor： Cheng-Tang Huang

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L24/11 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/10126 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1191 ,  H01L2224/13007 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/05552

Abstract: A manufacturing method of a bump structure having a reinforcement member is disclosed. First, a substrate including pads and a passivation layer is provided. The passivation layer has first openings, and each first opening exposes a portion of the corresponding pad respectively. Next, an under ball metal (UBM) material layer is formed on the substrate to cover the passivation layer and the pads exposed by the passivation layer. Bumps are formed on the UBM material layer and the lower surface of each bump is smaller than that of the opening. Each reinforcement member formed on the UBM material layer around each bump contacts with each bump, and the material of the reinforcement member is a polymer. The UBM material layer is patterned to form UBM layers and the lower surface of each UBM layer is larger than that of each corresponding opening. Hence, the bump has a planar upper surface.

Abstract translation: 公开了一种具有加强件的凸块结构的制造方法。 首先，提供包括焊盘和钝化层的衬底。 钝化层具有第一开口，并且每个第一开口分别暴露相应衬垫的一部分。 接下来，在衬底上形成底部球金属（UBM）材料层以覆盖钝化层和由钝化层暴露的焊盘。 在UBM材料层上形成凸起，并且每个凸起的下表面小于开口的下表面。 形成在每个凸块周围的UBM材料层上的每个加强构件与每个凸块接触，并且加强构件的材料是聚合物。 将UBM材料层图案化以形成UBM层，并且每个UBM层的下表面大于每个相应开口的下表面。 因此，凸块具有平坦的上表面。

公开(公告)号：US07403539B1

公开(公告)日：2008-07-22

申请号：US10268156

申请日：2002-10-09

Applicant: Hsiao-Cheng Tang ,  Yungping Hsu ,  Guorong Hu ,  Weishi Feng

Inventor： Hsiao-Cheng Tang ,  Yungping Hsu ,  Guorong Hu ,  Weishi Feng

IPC: H04L12/413 ,  H04L12/28

CPC classification number: H04B17/00 ,  H04B1/707 ,  H04W24/00 ,  H04W74/08

Abstract: Techniques for and apparatus capable of implementing packet detection and signal recognition in wireless communications systems are disclosed. In particular, the disclosed techniques and apparatus incorporate at least one of relative energy detection operable on assessment of a relative energy threshold for an inbound signal borne across an RF channel, carrier sense operable upon on assessment of at least one of a peak-to-sidelobe ratio and peak-to-peak distance defined by the inbound signal, and comparison operable upon demodulated data corresponding to the inbound signal as compared to predetermined preamble data. Clear channel assessment is performed based on determinations undertaken by one or more of the aforementioned relative energy detection, carrier sense and comparison operations.

Abstract translation: 公开了能够在无线通信系统中实现分组检测和信号识别的技术和装置。 具体地，所公开的技术和装置包括相对能量检测中的至少一个，其可操作用于对横跨RF信道承载的入站信号的相对能量阈值的评估，所述载波检测可在通过评估峰 - 旁瓣比和由峰值到峰值的距离，并且与对应于入站信号的解调数据进行比较，与预定的前导码数据相比较。 基于由上述相对能量检测，载波检测和比较操作中的一个或多个进行的确定来执行清除信道评估。

公开(公告)号：US07290919B2

公开(公告)日：2007-11-06

申请号：US11409302

申请日：2006-04-21

Applicant: Cheng-tang Pan ,  Ching-hua Su ,  Han-chang Cheng ,  Chih-liang Pan

Inventor： Cheng-tang Pan ,  Ching-hua Su ,  Han-chang Cheng ,  Chih-liang Pan

IPC: F21V7/04

CPC classification number: G02B6/0053 ,  G02B3/0018 ,  G02B3/0056

Abstract: A backlight module includes a light source, a light guide plate for guiding light from the light source, and a brightness enhancement film having a plurality of spherical surface microlenses for gathering light from the light guide plate. In contrast to traditional prism sheets, the brightness enhancement film having the plurality of spherical surface microlenses have better efficiency of light-gathering.

Abstract translation: 背光模块包括光源，用于引导来自光源的光的导光板，以及具有多个用于聚集来自导光板的光的球面微透镜的亮度增强膜。 与传统的棱镜片相比，具有多个球面微透镜的亮度增强膜具有更好的聚光效率。

公开(公告)号：US07230008B2

公开(公告)日：2007-06-12

申请号：US10923594

申请日：2004-08-20

Applicant: Richard Jiao ,  Gabor Butora ,  Stephen D. Goble ,  Deodialsingh Guiadeen ,  Sander G. Mills ,  Gregori Morriello ,  Alexander Pasternak ,  Cheng Tang ,  Lihu Yang ,  Changyou Zhou ,  Shankaran Kothandaraman ,  Christopher Moyes

Inventor： Richard Jiao ,  Gabor Butora ,  Stephen D. Goble ,  Deodialsingh Guiadeen ,  Sander G. Mills ,  Gregori Morriello ,  Alexander Pasternak ,  Cheng Tang ,  Lihu Yang ,  Changyou Zhou ,  Shankaran Kothandaraman ,  Christopher Moyes

IPC: A61K31/47 ,  C07D471/02

CPC classification number: A61K31/4375

Abstract: The present invention is directed to methods for treating, preventing, ameliorating, controlling or reducing the risk of an inflammatory or immunoregulatory disorder or disease, which method comprises the administration to a patient of an effective amount of the compound of formula I: (wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, X, n and the dashed line are defined herein) which are useful as modulators of chemokine receptor activity. In particular, these compounds are useful as modulators of the chemokine receptor CCR-2.

Abstract translation: 本发明涉及用于治疗，预防，改善，控制或降低炎性或免疫调节性疾病或疾病风险的方法，该方法包括向患者施用有效量的式I化合物：（其中R R 1，R 2，R 3，R 4，R 5，R 5，R 5， R 6，R 7，R 8，R 9，R 10，X 10， ，n和虚线在本文中定义），其可用作趋化因子受体活性的调节剂。 特别地，这些化合物可用作趋化因子受体CCR-2的调节剂。

公开(公告)号：US20060103648A1

公开(公告)日：2006-05-18

申请号：US10990003

申请日：2004-11-16

Applicant: Cheng-Tang Wu ,  Yong Guo

Inventor： Cheng-Tang Wu ,  Yong Guo

IPC: G06T17/20 ,  G06T15/30

CPC classification number: G06F17/5018

Abstract: A method, system and computer program product pertained to engineering analysis of a general three-dimensional (3-D) shell structure using the mesh-free technique is disclosed. The structural responses are solved with mesh-free technique after the 3-D shell structure is mapped to a two-dimensional plane. According to one aspect, the present invention is a method for mesh-free analysis of a general three-dimensional shell structure, the method comprises: defining the general shell structure as a physical domain represented by a plurality of nodes in a three-dimensional space, creating a plurality of projected nodes by mapping the plurality of nodes in the three-dimensional space onto a two-dimensional plane, assigning a plurality of domain of influences, one for each of the plurality of projected nodes, and calculating a solution of the physical domain using a set of mathematical approximations pertaining to each of the plurality of projected nodes.

公开(公告)号：US06861676B2

公开(公告)日：2005-03-01

申请号：US09983827

申请日：2001-10-26

Applicant: Cheng-Tang Pan ,  Hung-Yi Lin ,  Wu-Tung Chuan

Inventor： Cheng-Tang Pan ,  Hung-Yi Lin ,  Wu-Tung Chuan

IPC: H01L27/32 ,  H01L51/56 ,  H01L39/227

CPC classification number: H01L51/56 ,  H01L27/3281

Abstract: The present invention provides a fabricating process for forming a flexible substrate, including the steps of: providing the substrate which is composed of a top plate and a bottom plate, and then a positive electrode layer and a organic electro-luminescence (EL) are formed in sequence on the bottom plate; after that, a same axial downward patterned template is pressed onto the bottom plate for “micro-patterning”, and thus the positive electrode layer and the organic electro-luminescence (EL) layer on the bottom plate are patterned in the same axial; providing a top plate, on which a metal layer as a negative electrode is formed; similarly, a same axial upper patterned template is pressed onto the top plate for “micro-patterning”, and thus the metal layer on the top plate is patterned in the same axial; finally, superimposing the top plate on the bottom plate so that the axis of patterned positive electrode layer and patterned organic EL layer crisscross with the axis of patterned metal layer to construct a chessboard-like structure.

Abstract translation: 本发明提供一种用于形成柔性基板的制造方法，包括以下步骤：提供由顶板和底板构成的基板，然后形成正极层和有机电致发光（EL） 顺序在底板上; 之后，将相同的轴向向下图案化的模板压在底板上进行“微图案化”，从而将底板上的正电极层和有机电致发光（EL）层在同一轴向上图案化; 提供顶板，其上形成作为负极的金属层; 类似地，将相同的轴向上部图案化模板压在顶板上用于“微图案化”，因此顶板上的金属层以相同的轴向图案化; 最后，将顶板叠加在底板上，使得图案化的正极层和图案化的有机EL层的轴线与图案化金属层的轴线交叉以构成棋盘状结构。

公开(公告)号：US06627363B1

公开(公告)日：2003-09-30

申请号：US10196977

申请日：2002-07-17

Applicant: Vincent Wen ,  Tung-Yaw Kang ,  Chih-Sheng Chen ,  Jun-Hsien Chiou ,  Tsun-Cheng Tang

Inventor： Vincent Wen ,  Tung-Yaw Kang ,  Chih-Sheng Chen ,  Jun-Hsien Chiou ,  Tsun-Cheng Tang

IPC: G03F900

CPC classification number: G03F1/74

Abstract: The present invention relates to a method of removing halos resulting from focused ion beam (FIB) repair of clear defects on reticles. The halos are formed during carbon deposition on clear defects. An exposure with 172 nm VUV radiation is used to vaporize the carbon compounds in the halo. MSM measurements of the space width adjacent to the repair site are compared to space widths between similar features in areas that are clear of halos. The radiation and measurement is repeated until the % variation between said space widths is

Abstract translation: 本发明涉及一种去除由于聚焦离子束（FIB）修复掩模版上明显缺陷引起的晕轮的方法。 在清除缺陷的碳沉积期间形成光晕。 使用172nm VUV辐射的曝光来蒸发卤素中的碳化合物。 将与修复部位相邻的空间宽度的MSM测量值与远离光环的区域中的相似特征之间的空间宽度进行比较。 重复辐射和测量，直到所述空间宽度之间的％变化小于2％。 重复清洁和MSM测量步骤，直到与修复位置相邻的空间宽度在未受影响区域的空间宽度的2％以内。 这种方法避免了昂贵的返工，并且通过邻近修复部位的基板恢复到不受光晕影响的基板区域的值。