公开(公告)号：US10737365B2

公开(公告)日：2020-08-11

申请号：US15513477

申请日：2015-10-02

Applicant: SHIN-ETSU HANDOTAI CO., LTD. ,  FUJIKOSHI MACHINERY CORP.

Inventor： Michito Sato ,  Yosuke Kanai

IPC: B24B37/34 ,  F16M11/10 ,  F16M11/42 ,  B24B37/24 ,  B62B3/02 ,  H01L21/677 ,  H01L21/687 ,  H01L21/304 ,  A47B3/10 ,  B24B37/04

Abstract: A turn table transport carriage configured to carry a turn table removed from a polishing apparatus or turn table which is to be disposed to the polishing apparatus, turn table transport carriage including a turn table holding section configured to hold the turn table, support base which supports the turn table holding section from a lower side, elevating mechanism which moves up and down the turn table holding section, and inclination mechanism which inclines the turn table holding section holding the turn table, the turn table transport carriage being characterized by enabling carrying the turn table in a state where the turn table holding section holding the turn table is inclined by the inclination mechanism. Consequently, there is provided the turn table transport carriage which has a narrow width at the time of carrying the turn table and can reduce a width of a passage for carrying the turntable.

公开(公告)号：US10532442B2

公开(公告)日：2020-01-14

申请号：US15512957

申请日：2015-09-25

Applicant: SHIN-ETSU HANDOTAI CO., LTD. ,  FUJIKOSHI MACHINERY CORP.

Inventor： Michito Sato ,  Junichi Ueno ,  Kaoru Ishii ,  Hiromi Kishida ,  Yuya Nakanishi ,  Ryosuke Yoda ,  Yosuke Kanai

IPC: B24B37/34 ,  B24B27/00 ,  B24B25/00 ,  B24B37/04 ,  B24B53/017 ,  H01L21/304

Abstract: A polishing apparatus which is an index system polishing apparatus which includes a polishing head for holding a wafer, a plurality of turn tables to which polishing pads for polishing the wafer are attached, and a loading/unloading stage for loading the wafer to the polishing head or unloading the wafer from the polishing head, and which polishes the wafer while switching the turn tables to be used for polishing the wafer held at the polishing head by causing the polishing head to perform rotation movement, the polishing apparatus including a turn table upward and downward movement mechanism which allows the turn table to move upward and downward. With this polishing apparatus, it is possible to reduce an amount of displacement caused when moment load is applied on the polishing head during polishing.

公开(公告)号：US10449655B2

公开(公告)日：2019-10-22

申请号：US15860794

申请日：2018-01-03

Applicant: Fujikoshi Machinery Corp. ,  Kanazawa Institute of Technology

Inventor： Kazutaka Shibuya ,  Yoshio Nakamura ,  Michio Uneda ,  Kenichi Ishikawa

IPC: B24B53/017 ,  B24B37/10 ,  B24B49/12

Abstract: The polishing apparatus comprises: a dressing section for dressing a polishing pad; a measuring section for measuring a surface property of the polishing pad; a polishing result measuring section for measuring a polishing result of a work; a storing section for storing correlation data between dressing condition data for dressing the polishing pad, surface property of the polishing pad and polishing results, which are learned by an artificial intelligence; and an input section for inputting an object polishing result. The artificial intelligence performs a first arithmetic process, in which the surface property of the polishing pad corresponding to the object polishing result is inversely estimated on the basis of the correlation data, and a second arithmetic process, in which the corresponding dressing condition is derived on the basis of the surface property of the polishing pad inversely estimated.

公开(公告)号：US20170304991A1

公开(公告)日：2017-10-26

申请号：US15513477

申请日：2015-10-02

Applicant: SHIN-ETSU HANDOTAI CO., LTD. ,  FUJIKOSHI MACHINERY CORP.

Inventor： Michito SATO ,  Yosuke KANAI

IPC: B24B37/34 ,  F16M11/42 ,  F16M11/10 ,  H01L21/304 ,  B24B37/04

Abstract: A turn table transport carriage configured to carry a turn table removed from a polishing apparatus or turn table which is to be disposed to the polishing apparatus, turn table transport carriage including a turn table holding section configured to hold the turn table, support base which supports the turn table holding section from a lower side, elevating mechanism which moves up and down the turn table holding section, and inclination mechanism which inclines the turn table holding section holding the turn table, the turn table transport carriage being characterized by enabling carrying the turn table in a state where the turn table holding section holding the turn table is inclined by the inclination mechanism. Consequently, there is provided the turn table transport carriage which has a narrow width at the time of carrying the turn table and can reduce a width of a passage for carrying the turntable.

公开(公告)号：US20170301573A1

公开(公告)日：2017-10-19

申请号：US15470441

申请日：2017-03-27

Applicant: Fujikoshi Machinery Corp.

Inventor： Kazutaka SHIBUYA ,  Yoshio NAKAMURA

IPC: H01L21/67 ,  B24B57/02 ,  B24B37/04 ,  H01J37/32

CPC classification number: H01L21/67219 ,  B24B37/04 ,  B24B57/02 ,  H01J37/3244 ,  H01J37/3255 ,  H01J37/32568 ,  H01J2237/334 ,  H01L21/6708

Abstract: A nozzle according to the invention includes a liquid flow passage through which a liquid flows, a gas flow passage through which a gas flows, the gas flow passage communicating with the liquid flow passage and feeding the gas to the liquid flow passage, and a plasma generating mechanism for generating plasma in the gas fed from the gas flow passage to the liquid flow passage, in which the plasma generating mechanism includes a first electrode provided so as to be exposed to an inside of the liquid flow passage, a second electrode provided so as not to be exposed to the inside of the liquid flow passage and so as to be exposed to an inside of the gas flow passage, and a power source for applying a predetermined voltage across the first electrode and the second electrode, and in which the liquid with which the gas including the generated plasma is mixed as bubbles having a predetermined diameter is spouted.

公开(公告)号：US20150262833A1

公开(公告)日：2015-09-17

申请号：US14637546

申请日：2015-03-04

Applicant: FUJIKOSHI MACHINERY CORP.

Inventor： Kazutaka SHIBUYA ,  Yoshio NAKAMURA

IPC: H01L21/306 ,  C23F1/12 ,  C23F1/14 ,  H01L21/67 ,  C23F1/08

CPC classification number: B24B37/04 ,  B24B57/02 ,  C23F1/08 ,  C23F1/12 ,  C23F1/14 ,  H01J37/32055 ,  H01J37/32073 ,  H01J37/32348 ,  H01L21/02024 ,  H01L21/30625 ,  H01L21/67075 ,  H01L21/67092 ,  H01L29/1602 ,  H01L29/1608 ,  H01L29/2003

Abstract: The method of the present invention is capable of polishing a high hardness work at high polishing efficiency. The method comprises the steps of: pressing a surface of the work onto a polishing part of a rotating polishing plate; and supplying slurry while performing the pressing step. The method is characterized in that an activated gas, which has been activated by gas discharge, is turned into bubbles and mixed into the slurry.

Abstract translation: 本发明的方法能够以高抛光效率抛光高硬度的工件。 该方法包括以下步骤：将工件的表面压在旋转的抛光板的抛光部分上; 并在进行压制步骤时供给浆料。 该方法的特征在于，已经通过气体排出而活化的活性气体变成气泡并混合到浆料中。

公开(公告)号：US20040194937A1

公开(公告)日：2004-10-07

申请号：US10825744

申请日：2004-04-16

Applicant: Fujikoshi Machinery Corp.

Inventor： Yoshio Nakamura ,  Yoshio Otsuka

IPC: F28D007/10

CPC classification number: F28D7/106 ,  B24B57/02 ,  F28F21/04 ,  Y10S165/905 ,  Y10T29/4935 ,  Y10T29/49361 ,  Y10T29/5176

Abstract: A method for adjusting temperature of a machining liquid, e.g., slurry, etching liquid, by passing the machining liquid through a heat exchanger. The heat exchanger, which adjusts the temperature of the machining liquid, includes a ceramic heat exchanging tube which is made by baking silicon carbide (SiC).

Abstract translation: 一种用于通过使加工液体通过热交换器来调节加工液体的温度的方法，例如浆料，蚀刻液体。 调节加工液温度的热交换器包括通过焙烧碳化硅（SiC）制成的陶瓷热交换管。

公开(公告)号：US20040082273A1

公开(公告)日：2004-04-29

申请号：US10691898

申请日：2003-10-23

Applicant: Fujikoshi Machinery Corp.

Inventor： Norihiko Moriya

IPC: B24B001/00

CPC classification number: B24B37/08 ,  B24B37/345

Abstract: The abrasive machine is capable of feeding a proper amount of slurry and preventing a work piece from sticking on an upper abrasive plate. The abrasive machine comprises: the upper abrasive plate abrading an upper face of the work piece and having a plurality of slurry holes for feeding the slurry to the work piece; a lower abrasive plate abrading a lower face of the work piece; a slurry feeding unit pressurizing and feeding the slurry; a plurality of slurry paths respectively connecting the slurry holes to the slurry feeding unit; a plurality of valve mechanisms respectively provided to the slurry paths so as to control flows of the slurry; and a control section for controlling the valve mechanisms.

Abstract translation: 研磨机能够输送适量的浆料并防止工件粘在上磨料板上。 研磨机包括：上磨料板研磨工件的上表面，并具有用于将浆料供给到工件的多个浆料孔; 研磨工件的下表面的下研磨板; 浆料供给单元，对浆料进行加压供给; 多个浆料路径，分别将浆料孔连接到浆料供给单元; 多个阀机构分别设置在浆料路径上，以便控制浆料的流动; 以及用于控制阀机构的控制部。

公开(公告)号：US20040043713A1

公开(公告)日：2004-03-04

申请号：US10648680

申请日：2003-08-25

Applicant: Fujikoshi Machinery Corp.

Inventor： Norihiko Moriya ,  Satoki Kanda ,  Takumi Kobayashi ,  Atsushi Kajikura

IPC: B24B007/00 ,  B24B009/00 ,  B24B005/00 ,  B24B029/00

CPC classification number: B24B37/08

Abstract: The polishing machine is capable of evenly applying a pressing force from an upper polishing plate to work pieces accommodated in through-holes of carriers. The polishing machine comprises: a plurality of the carriers provided around a center of gravity of an upper polishing plate and sandwiched between the polishing plates. Circular motion of the carriers, without revolving, are performed independently. Centers of gravity of the work pieces, which are held by the carriers, are simultaneously moved close to a center of gravity of the upper polishing plate and simultaneously moved away therefrom, and moving distances of the centers of gravity of the work pieces are equal.

公开(公告)号：US20030124862A1

公开(公告)日：2003-07-03

申请号：US10331070

申请日：2002-12-27

Applicant: Fujikoshi Machinery Corp.

Inventor： Noriko Miyairi ,  Yasuo Inada ,  Tsuyoshi Hasegawa ,  Yuji Terashima ,  Kenji Sakai ,  Tadahiro Kitamura ,  Takahiro Umeda

IPC: H01L021/302 ,  H01L021/461

CPC classification number: B24B37/30 ,  C09G1/02 ,  H01L21/3212 ,  H05K3/26 ,  H05K3/383 ,  H05K3/4644 ,  H05K2203/025 ,  H05K2203/121

Abstract: The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the substrate onto the polishing pad, with a backing pad, by a press head; relatively rotating the press head with respect to the polishing plate, with supplying polishing slurry onto the polishing pad. The backing pad is made of a material whose Asker C hardness is 75-95 and whose compressibility is 10% or less. The polishing slurry includes a chelating agent for chelating copper, an etching agent for etching the surface of copper layer, an oxidizing agent for oxidizing the surface of copper layer, and water.

Abstract translation: 抛光基板的铜层的方法能够提高原料去除率等。该方法包括以下步骤：将基板供给到具有面向抛光垫的铜层的抛光板的抛光垫上; 用衬垫将衬底用衬垫压入抛光垫上; 相对于抛光板相对地旋转压头，同时将抛光浆料供应到抛光垫上。 衬垫由Asker C硬度为75-95且压缩率为10％以下的材料制成。 抛光浆料包括用于螯合铜的螯合剂，用于蚀刻铜层表面的蚀刻剂，用于氧化铜层表面的氧化剂和水。