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11.发明授权公开(公告)号：US11608455B2
公开(公告)日：2023-03-21
申请号：US16680547
申请日：2019-11-12
发明人： Kazutaka Honda , Koichi Chabana , Keishi Ono , Akira Nagai
IPC分类号： H01L23/00 , H01L25/065 , C09J11/06 , C09J201/00 , H01L25/07 , H01L25/18 , C09J163/00 , C09J11/04
摘要： Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.
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公开(公告)号：US11605818B2
公开(公告)日：2023-03-14
申请号：US16611983
申请日：2018-01-29
发明人： Motohiro Isaka , Hideyuki Tsuchiya , Kento Hoshi , Tsutomu Satoh , Keita Suga
IPC分类号： H01M4/587 , H01M10/0525 , H01M4/02
摘要： An anode material for a lithium ion secondary battery including a carbon material satisfying the following (1) to (3), (6), and (7): (1) an average particle size (D50) is 22 μm or less, (2) D90/D10 of particle sizes is 2.2 or less, (3) a linseed oil absorption amount is 50 mL/100 g or less, (6) a portion of the carbon material with a sphericity of from 0.6 to 0.8 and a particle size of from 10 μm to 20 μm is 5% by number or more, and (7) a portion of the carbon material with the sphericity of 0.7 or less and a particle size of 10 μm or less is 0.3% by number or less.
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公开(公告)号：US11483936B2
公开(公告)日：2022-10-25
申请号：US16762041
申请日：2018-11-08
发明人： Hideo Nakako , Yoshinori Ejiri , Dai Ishikawa , Chie Sugama , Yuki Kawana , Motohiro Negishi , Yuichi Yanaka
摘要： Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I): (M1−M2)/M1×100≥1.0 (I) [in Formula (I), M1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M2 represents a non-volatile content in the joining material.]
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公开(公告)号：US11377546B2
公开(公告)日：2022-07-05
申请号：US16318726
申请日：2017-07-18
发明人： Takao Tanigawa , Tetsuroh Irino , Minoru Kakitani , Kouji Morita
IPC分类号： C08L39/04 , B32B15/08 , C08J5/18 , H05K1/03 , C08K5/3415 , C08L35/00 , B32B27/34 , C08L101/00
摘要： The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.
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公开(公告)号：US11355469B2
公开(公告)日：2022-06-07
申请号：US16957568
申请日：2018-12-27
IPC分类号： H01L23/00
摘要： One aspect of the invention is a method of manufacturing a connection structure, including disposing an adhesive layer between a first electronic member including a first substrate and a first electrode formed on the first substrate and a second electronic member including a second substrate and a second electrode formed on the second substrate, and pressure-bonding the first electronic member and the second electronic member via the adhesive layer such that the first electrode and the second electrode are electrically connected to each other, wherein the first electronic member further including an insulating layer formed on a side of the first electrode opposite to the first substrate, and the adhesive layer including: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and having a non-conductive core and a conductive layer provided on the core.
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公开(公告)号：US11352523B2
公开(公告)日：2022-06-07
申请号：US16981573
申请日：2019-03-20
IPC分类号： C09G1/02 , H01L21/304 , H01L21/3105 , B24B37/04 , C09K13/06 , B24B1/00 , C09G1/06 , H01L21/306 , C09K3/14 , C09G1/04 , C09G1/00 , H01L21/321
摘要： According to an aspect of the present invention, there is provided a polishing liquid containing abrasive grains, a hydroxy acid, a polyol, at least one zwitterionic compound selected from the group consisting of an aminocarboxylic acid and an aminosulfonic acid, and a liquid medium, in which a zeta potential of the abrasive grains is positive, an isoelectric point of the aminocarboxylic acid is smaller than 7.0, and pKa of the aminosulfonic acid is larger than 0.
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公开(公告)号：US11214660B2
公开(公告)日：2022-01-04
申请号：US16486188
申请日：2018-02-19
发明人： Yuma Yoshida , Yuichi Shimayama , Yukio Nakamura , Shinji Tsuchikawa , Katsuhiko Nawate , Shintaro Hashimoto
摘要： The present invention relates to a prepreg including a fiber base material layer containing a fiber base material, a first resin layer formed on one surface of the fiber base material layer, and a second resin layer formed on the other surface of the fiber base material layer, wherein the first resin layer is a layer obtained through layer formation of a resin composition (I) containing, as a main component of resin components, an epoxy resin (A), and the second resin layer is a layer obtained through layer formation of a resin composition (II) containing, as a main component of resin components, an amine compound (B) having at least two primary amino groups in one molecule thereof and a maleimide compound (C) having at least two N-substituted maleimide groups in one molecule thereof; a laminated sheet obtained by using the prepreg; a printed wiring board; a coreless board; a semiconductor package; and a method of producing a coreless board.
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公开(公告)号：US11208525B2
公开(公告)日：2021-12-28
申请号：US16400073
申请日：2019-05-01
摘要： An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
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公开(公告)号：US20210351157A1
公开(公告)日：2021-11-11
申请号：US16757798
申请日：2018-10-23
发明人： Motohiro NEGISHI , Hideo NAKAKO , Yuki KAWANA , Dai ISHIKAWA , Chie SUGAMA , Yoshinori EJIRI
摘要： This member connection method includes a printing step. In the printing step, a coating film-formed region in which the coating film is formed, and a coating film non-formed region in which the coating film is not formed are formed in the print pattern, and the coating film-formed region is divided into a plurality of concentric regions and a plurality of radial regions by means of a plurality of line-shaped regions provided so as to connect various points, which are separated apart from one another in the marginal part of the connection region.
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公开(公告)号：US11149164B2
公开(公告)日：2021-10-19
申请号：US16341764
申请日：2017-09-26
发明人： Yuma Takeuchi , Hisato Takahashi , Yoshihito Inaba
IPC分类号： H01L23/22 , C09D163/00 , C09D7/61 , H01L21/56 , H01L23/29 , H01L23/31 , C08G59/50 , C08L63/00 , C08K3/00
摘要： A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.
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