公开(公告)号：US11441022B2

公开(公告)日：2022-09-13

申请号：US16339743

申请日：2017-10-04

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Akira Nagai ,  Tsuyoshi Morimoto ,  Teiichi Inada

IPC: C08L23/08 ,  C08J5/18 ,  C08K5/01 ,  C08K5/09 ,  C08L23/12 ,  C09K5/06

Abstract: In one aspect, the present invention is a resin member comprising a copolymer of ethylene and an olefin having 3 or more carbon atoms, a straight-chain saturated hydrocarbon compound, and a gelling agent.

公开(公告)号：US10734350B2

公开(公告)日：2020-08-04

申请号：US16099753

申请日：2017-04-10

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Kazutaka Honda ,  Koichi Chabana ,  Makoto Satou ,  Akira Nagai

IPC: H01L23/00 ,  C09J163/00 ,  C09J201/00 ,  C09J11/06 ,  H01L21/56 ,  C09J7/30 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00

Abstract: There is disclosed a method for manufacturing a semiconductor device comprising a semiconductor chip having a connection portion and a wiring circuit board having a connection portion, the respective connection portions being electrically connected to each other, or a semiconductor device comprising a plurality of semiconductor chips having connection portions, the respective connection portions being electrically connected to each other. The connection portions consist of metal. The above described method comprises: (a) a first step of press-bonding the semiconductor chip and the wiring circuit board or the semiconductor chips to each other so that the respective connection portions are in contact with each other with a semiconductor adhesive interposed therebetween, at a temperature lower than a melting point of the metal of the connection portion, to obtain a temporarily connected body; (b) a second step of sealing at least a part of the temporarily connected body with a sealing resin to obtain a sealed temporarily connected body; and (c) a third step of heating the sealed temporarily connected body at a temperature equal to or higher than the melting point of the metal of the connection portion, to obtain a sealed connected body.

公开(公告)号：US09425120B2

公开(公告)日：2016-08-23

申请号：US14380455

申请日：2013-02-22

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Kazutaka Honda ,  Akira Nagai ,  Makoto Satou

IPC: H01L23/48 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  C09J11/06 ,  C09J201/00 ,  C08L63/00 ,  C08G59/38 ,  H01L21/56 ,  H01L25/065 ,  B23K35/02 ,  C08K5/09 ,  C09J163/00 ,  C09J163/04

CPC classification number: H01L23/293 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/0244 ,  B23K2101/40 ,  C08G59/38 ,  C08K5/09 ,  C08L63/00 ,  C09J11/06 ,  C09J163/00 ,  C09J163/04 ,  C09J201/00 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/05552

Abstract: A manufacturing method for a semiconductor device in which connection portions of a semiconductor chip are electrically connected to connection portions of a wiring circuit substrate or a semiconductor device in which connection portions of a plurality of semiconductor chips are electrically connected to each other, the method comprising a step of sealing at least part of the connection portions with an adhesive for a semiconductor comprising a compound having a group represented by the following formula (1): wherein R1 represents an electron-donating group.

Abstract translation: 一种半导体器件的制造方法，其中半导体芯片的连接部分电连接到其中多个半导体芯片的连接部分彼此电连接的布线电路衬底或半导体器件的连接部分，该方法包括 用包含具有由下式（1）表示的基团的化合物的半导体用粘合剂密封连接部分的至少一部分的步骤：其中R1表示给电子基团。

公开(公告)号：US20150014842A1

公开(公告)日：2015-01-15

申请号：US14380461

申请日：2013-02-22

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Kazutaka Honda ,  Akira Nagai ,  Makoto Satou

IPC: H01L21/56 ,  C09J163/00 ,  H01L23/00

CPC classification number: H01L21/56 ,  B23K35/3612 ,  B23K35/3618 ,  C08K5/092 ,  C09J11/06 ,  C09J163/00 ,  C09J2463/00 ,  H01L21/563 ,  H01L23/293 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L2021/60 ,  H01L2224/03825 ,  H01L2224/0401 ,  H01L2224/051 ,  H01L2224/05111 ,  H01L2224/05116 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05575 ,  H01L2224/0558 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11825 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13575 ,  H01L2224/1358 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/271 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/27848 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/81895 ,  H01L2224/81907 ,  H01L2224/831 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/9205 ,  H01L2224/9211 ,  H01L2224/92122 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/06 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/16145 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01029 ,  H01L2224/11

Abstract: A manufacturing method for a semiconductor device in which connection portions of a semiconductor chip are electrically connected to connection portions of a wiring circuit substrate or a semiconductor device in which connection portions of a plurality of semiconductor chips are electrically connected to each other, the method comprising a step of encapsulating at least part of the connection portions with an adhesive for a semiconductor containing a compound having a group represented by the following formula (1-1) or (1-2): wherein R1 represents an electron-donating group; and a plurality of R1 may be identical or different from each other.

Abstract translation: 一种半导体器件的制造方法，其中半导体芯片的连接部分电连接到其中多个半导体芯片的连接部分彼此电连接的布线电路衬底或半导体器件的连接部分，该方法包括 使用含有具有下式（1-1）或（1-2）表示的基团的化合物的半导体用粘合剂封装至少一部分连接部的步骤：其中R1表示给电子基团; 并且多个R1可以彼此相同或不同。

公开(公告)号：US11535782B2

公开(公告)日：2022-12-27

申请号：US16339755

申请日：2016-10-07

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Akira Nagai ,  Tsuyoshi Morimoto ,  Teiichi Inada

IPC: C09K5/06 ,  B32B15/085 ,  B32B15/20 ,  C08F210/16 ,  C08K5/01 ,  F28D20/00

Abstract: In one aspect, the present invention provides a resin member comprising a copolymer of ethylene and an olefin having 3 or more carbon atoms, and a straight-chain saturated hydrocarbon compound.

公开(公告)号：US11352466B2

公开(公告)日：2022-06-07

申请号：US16612120

申请日：2018-05-10

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Naoki Furukawa ,  Akira Nagai ,  Tsuyoshi Morimoto ,  Keiko Kizawa ,  Nozomi Matsubara

IPC: C08L33/08 ,  C08J3/24 ,  C08F220/18 ,  C08F220/32 ,  C08K5/3445 ,  C08L33/10

Abstract: An aspect of the present invention is a resin composition comprising: an acrylic resin; and a curing agent, wherein the acrylic resin is a resin obtained by polymerizing monomer components comprising a first monomer represented by the following formula (1): wherein R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 12 to 30 carbon atoms, and a second monomer copolymerizable with the first monomer and having a reactive group capable of reacting with the curing agent.

公开(公告)号：US10669454B2

公开(公告)日：2020-06-02

申请号：US15770792

申请日：2016-10-26

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Kazutaka Honda ,  Koichi Chabana ,  Keishi Ono ,  Akira Nagai

IPC: H01L25/065 ,  C09J163/00 ,  C09J11/06 ,  C09J201/00 ,  H01L25/07 ,  H01L25/18 ,  H01L23/00 ,  C09J11/04

Abstract: Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.

公开(公告)号：US10224311B2

公开(公告)日：2019-03-05

申请号：US15532898

申请日：2015-12-03

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Kazutaka Honda ,  Akira Nagai ,  Makoto Satou ,  Koichi Chabana ,  Keishi Ono

IPC: H01L21/02 ,  H01L23/00 ,  H01L25/065 ,  C09J201/00 ,  H01L23/29 ,  H01L23/31 ,  H01L25/07 ,  H01L25/18 ,  C09D4/06

Abstract: A semiconductor adhesive used for sealing connection portions of a semiconductor device, wherein: in the semiconductor device, the connection portion of a semiconductor chip and the connection portion of a wiring circuit substrate are electrically connected to each other or the connection portions of a plurality of semiconductor chips are electrically connected to each other; the semiconductor adhesive comprises a (meth)acrylic compound and a curing agent; and when the semiconductor adhesive is kept at 200° C. for 5 seconds, a curing reaction rate thereof is 80% or more.

公开(公告)号：US09803111B2

公开(公告)日：2017-10-31

申请号：US14379961

申请日：2012-10-01

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Kazutaka Honda ,  Akira Nagai ,  Makoto Satou

IPC: H01L23/48 ,  H01L21/16 ,  C09J11/06 ,  B23K35/36 ,  B23K35/362 ,  H01L25/065 ,  H05K3/30 ,  H01L23/29 ,  H01L21/56 ,  C09J163/00 ,  C08K5/092 ,  H01L23/00 ,  H05K3/34

CPC classification number: C09J11/06 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  C08K5/092 ,  C09J163/00 ,  H01L21/563 ,  H01L23/295 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/03825 ,  H01L2224/0401 ,  H01L2224/051 ,  H01L2224/05111 ,  H01L2224/05116 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05575 ,  H01L2224/0558 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11825 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13575 ,  H01L2224/1358 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/271 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/27848 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73104 ,  H01L2224/81011 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81895 ,  H01L2224/81907 ,  H01L2224/831 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/9205 ,  H01L2224/92122 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0367 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/8385 ,  H01L2924/00 ,  C08L63/00 ,  H01L2224/27 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01029 ,  H01L2224/11 ,  H01L2924/0001

Abstract: An adhesive for a semiconductor, comprising an epoxy resin, a curing agent, and a compound having a group represented by the following formula (1): wherein R1 represents an electron-donating group.

公开(公告)号：US20150035175A1

公开(公告)日：2015-02-05

申请号：US14380466

申请日：2012-10-01

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Kazutaka Honda ,  Akira Nagai ,  Makoto Satou

IPC: H01L23/29 ,  H01L21/56 ,  C08K5/092 ,  H01L23/00 ,  C09J163/00 ,  C09J11/06

CPC classification number: H01L23/293 ,  C08K5/092 ,  C09J11/06 ,  C09J163/00 ,  H01L21/56 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/03825 ,  H01L2224/0401 ,  H01L2224/051 ,  H01L2224/05111 ,  H01L2224/05116 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05575 ,  H01L2224/0558 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11825 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13575 ,  H01L2224/1358 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/271 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/27848 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73104 ,  H01L2224/81011 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81895 ,  H01L2224/81907 ,  H01L2224/831 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8349 ,  H01L2224/83862 ,  H01L2224/9205 ,  H01L2224/92122 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/10253 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0367 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01029 ,  H01L2224/11

Abstract: An adhesive for a semiconductor, containing an epoxy resin, a curing agent, and a fluxing agent comprising a compound having a group represented by the following formula (1-1) or (1-2): wherein R1 represents an electron-donating group; and a plurality of R1 may be identical or different from each other.

Abstract translation: 一种包含环氧树脂，固化剂和助熔剂的半导体用粘合剂，其包含具有下式（1-1）或（1-2）表示的基团的化合物：其中R1表示给电子基团 ; 并且多个R1可以彼此相同或不同。