公开(公告)号：US20120248418A1

公开(公告)日：2012-10-04

申请号：US13337971

申请日：2011-12-27

Applicant: Sang-Dae KIM ,  Sung-Hoon CHOI ,  Seok-Jong LEE ,  Kyu-II HAN ,  Byung-soo KIM ,  Eun-Jung PARK ,  Young-Dock CHO ,  Hong-Je YUN ,  Tae-II KUM ,  Gwi-Jeong CHO

Inventor： Sang-Dae KIM ,  Sung-Hoon CHOI ,  Seok-Jong LEE ,  Kyu-II HAN ,  Byung-soo KIM ,  Eun-Jung PARK ,  Young-Dock CHO ,  Hong-Je YUN ,  Tae-II KUM ,  Gwi-Jeong CHO

IPC: H01L51/52

CPC classification number: H01L51/5231 ,  H01L27/3244

Abstract: An organic electroluminescent display device includes a first substrate including a display region including a plurality of pixel regions; a first electrode in each pixel region; an organic light emitting layer on the first electrode; a second electrode on the organic light emitting layer and in the display region, wherein the second electrode includes a first metal material having a first wt %, a first work function, and a first sheet resistance, and a second metal material having a second wt % less than the first wt %, a second work function less than the first work function, and a second sheet resistance greater than the first sheet resistance.

Abstract translation: 一种有机电致发光显示装置包括：第一基板，包括包括多个像素区域的显示区域; 每个像素区域中的第一电极; 在第一电极上的有机发光层; 在所述有机发光层和所述显示区域中的第二电极，其中所述第二电极包括具有第一重量％，第一功函数和第一薄层电阻的第一金属材料和具有第二重量％ 小于第一重量％，小于第一功函数的第二功函数，以及大于第一薄层电阻的第二薄层电阻。

公开(公告)号：US20090311560A1

公开(公告)日：2009-12-17

申请号：US12283459

申请日：2008-09-11

Applicant: Keun Je Lee ,  Kook II Han

Inventor： Keun Je Lee ,  Kook II Han

IPC: H01M8/04

CPC classification number: H01M8/04126 ,  B60L50/72 ,  B60L58/33 ,  H01M8/04798 ,  H01M8/18 ,  H01M2250/20 ,  Y02E60/528 ,  Y02T90/32 ,  Y02T90/34

Abstract: The present invention provides a method for reverse activation of a fuel cell, which can improve fuel cell performance by performing a first fuel cell activation process and then performing a second fuel cell activation process in which a hydrogen inlet and a hydrogen outlet of the fuel cell are shifted to an air (or oxygen) inlet and an air (or oxygen) outlet of the fuel cell.

Abstract translation: 本发明提供了一种燃料电池的反向激活方法，其可以通过执行第一燃料电池激活过程并且然后执行第二燃料电池激活过程来改善燃料电池性能，其中燃料电池的氢气入口和氢气出口 被转移到燃料电池的空气（或氧气）入口和空气（或氧气）出口。

公开(公告)号：US20090242965A1

公开(公告)日：2009-10-01

申请号：US12309959

申请日：2007-09-20

Applicant: Byung Gook Park ,  II Han Park

Inventor： Byung Gook Park ,  II Han Park

IPC: H01L29/792

CPC classification number: H01L27/115 ,  H01L27/11568

Abstract: A memory cell device having a vertical channel and a double gate structure is provided. More specifically, a memory cell device having a vertical channel and a double gate structure is characterized by having a pillar active region with a predetermined height, which is including a first semiconductor layer forming a first source/drain region, a second semiconductor layer being placed under the first semiconductor layer with a predetermined distance and forming a second source/drain region, and a third semiconductor layer forming a body region and a channel region between the first semiconductor layer and the second semiconductor layer, and therefore, there is no need for unnecessary contacts when it is used as a unit cell for any type of memory array, not to speak of NOR type flash memory array. And the present invention makes to program/erase more effectively and increase the read speed and the amount of sensing current.

Abstract translation: 提供具有垂直通道和双栅极结构的存储单元器件。 更具体地说，具有垂直沟道和双栅极结构的存储单元器件的特征在于具有预定高度的柱状有源区，其包括形成第一源极/漏极区的第一半导体层，放置第二半导体层的第二半导体层 在第一半导体层之下具有预定距离并形成第二源极/漏极区域，以及形成第一半导体层和第二半导体层之间的体区域和沟道区域的第三半导体层，因此不需要 当它被用作任何类型的存储器阵列的单位单元时，不用说NOR型闪存阵列就是不必要的接触。 并且本发明使得更有效地编程/擦除并增加读取速度和感测电流的量。

公开(公告)号：US07432552B2

公开(公告)日：2008-10-07

申请号：US11423696

申请日：2006-06-12

Applicant: Byung-Gook Park ,  Tae-Hoon Kim ,  II-Han Park

Inventor： Byung-Gook Park ,  Tae-Hoon Kim ,  II-Han Park

IPC: H01L27/01

CPC classification number: H01L29/78615

Abstract: A body biasing structure of devices connected in series on an SOI substrate is provided. According to some embodiments, the shallow junction of common source/drain regions enables all devices to bias by only one body contact on an SOI substrate like a conventional bulk MOSFET, and the floating body effect on an SOI substrate can be prevented.

Abstract translation: 提供了在SOI衬底上串联连接的器件的体偏置结构。 根据一些实施例，公共源极/漏极区的浅结使得所有器件只能像SOI传统体MOSFET在SOI衬底上仅偏移一个体接触，并且可以防止在SOI衬底上的浮体效应。

公开(公告)号：US20060278991A1

公开(公告)日：2006-12-14

申请号：US11311349

申请日：2005-12-20

Applicant: Yong-Chai Kwon ,  Kang-Wook Lee ,  Keum-Hee Ma ,  Seong-II Han

Inventor： Yong-Chai Kwon ,  Kang-Wook Lee ,  Keum-Hee Ma ,  Seong-II Han

IPC: H01L23/52

CPC classification number: H01L21/563 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29011 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A stack circuit member may include a first circuit member and a second circuit member. The first and the second circuit members may be electrically and mechanically connected together using a thermocompression bonding method. A photosensitive polymer layer may be interposed between the first circuit member and the second circuit member. A gap fill process and an electrical connection process may be performed at the same time.

Abstract translation: 堆叠电路构件可以包括第一电路构件和第二电路构件。 第一和第二电路构件可以使用热压接法将电气和机械连接在一起。 感光性聚合物层可以设置在第一电路部件和第二电路部件之间。 间隙填充处理和电连接处理可​​以同时进行。

公开(公告)号：US20130059210A1

公开(公告)日：2013-03-07

申请号：US13462147

申请日：2012-05-02

Applicant: Jung-Yi YU ,  Woo-Cheol SHIN ,  Sang-II HAN ,  Mi-Hyun LEE ,  Tae-Hyun BAE

Inventor： Jung-Yi YU ,  Woo-Cheol SHIN ,  Sang-II HAN ,  Mi-Hyun LEE ,  Tae-Hyun BAE

IPC: H01M10/26

CPC classification number: H01M4/13 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/0567 ,  H01M10/0569

Abstract: An electrolyte for a rechargeable lithium battery and rechargeable lithium battery including the same is provided. The electrolyte includes a film-forming compound; a lithium salt; and an organic solvent.

Abstract translation: 提供了一种用于可充电锂电池的电解质和包括其的可再充电锂电池。 电解质包括成膜化合物; 锂盐; 和有机溶剂。

公开(公告)号：US20130017461A1

公开(公告)日：2013-01-17

申请号：US13339732

申请日：2011-12-29

Applicant: Sang-II HAN ,  Kah-Young SONG ,  Hee-Tak KIM ,  Sung-Yong CHO ,  Tae-Yoon KIM ,  Myoung-Ki MIN ,  Geun-Seok CHAI

Inventor： Sang-II HAN ,  Kah-Young SONG ,  Hee-Tak KIM ,  Sung-Yong CHO ,  Tae-Yoon KIM ,  Myoung-Ki MIN ,  Geun-Seok CHAI

IPC: H01M4/86 ,  H01M8/06 ,  H01M8/10 ,  B82Y30/00

CPC classification number: H01M4/8605 ,  B82Y30/00 ,  H01M4/9083 ,  H01M4/926 ,  H01M8/0612 ,  H01M8/1007 ,  Y02E60/521

Abstract: An electrode for a fuel cell is disclosed. The electrode may include an electrode substrate with a conductive substrate, carbon particles, and a catalyst layer disposed on the electrode substrate. The electrode substrate may include a pore having an average diameter of about 20 μm to about 40 μm and porosity of about 30 volume % to about 80 volume % based on the total volume of the electrode substrate. A membrane-electrode assembly including the electrode and a fuel cell system including the membrane electrode assembly are also disclosed.

Abstract translation: 公开了一种用于燃料电池的电极。 电极可以包括具有导电基板的电极基板，碳颗粒和设置在电极基板上的催化剂层。 电极基板可以包括基于电极基板的总体积的平均直径为约20μm至约40μm的孔，并且孔隙率为约30体积％至约80体积％。 还公开了一种包括电极的膜 - 电极组件和包括膜电极组件的燃料电池系统。

公开(公告)号：US20080318363A1

公开(公告)日：2008-12-25

申请号：US12213857

申请日：2008-06-25

Applicant: Yong-Chai Kwon ,  Kang-Wook Lee ,  Keum-Hee Ma ,  Seong-II Han

Inventor： Yong-Chai Kwon ,  Kang-Wook Lee ,  Keum-Hee Ma ,  Seong-II Han

IPC: H01L21/00

CPC classification number: H01L21/563 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29011 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A stack circuit member may include a first circuit member and a second circuit member. The first and the second circuit members may be electrically and mechanically connected together using a thermocompression bonding method. A photosensitive polymer layer may be interposed between the first circuit member and the second circuit member. A gap fill process and an electrical connection process may be performed at the same time.

Abstract translation: 堆叠电路构件可以包括第一电路构件和第二电路构件。 第一和第二电路构件可以使用热压接法将电气和机械连接在一起。 感光性聚合物层可以设置在第一电路部件和第二电路部件之间。 间隙填充处理和电连接处理可​​以同时进行。

公开(公告)号：US07459774B2

公开(公告)日：2008-12-02

申请号：US11436851

申请日：2006-05-18

Applicant: Yong-Chai Kwon ,  Kang-Wook Lee ,  Keum-Hee Ma ,  Seong-II Han

Inventor： Yong-Chai Kwon ,  Kang-Wook Lee ,  Keum-Hee Ma ,  Seong-II Han

IPC: H01L23/02

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/31 ,  H01L24/83 ,  H01L24/90 ,  H01L24/94 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/02311 ,  H01L2224/02321 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/08112 ,  H01L2224/13009 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/81141 ,  H01L2224/83136 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05552

Abstract: In a stacked chip configuration, and manufacturing methods thereof, the gap between a lower and an upper chip is filled completely using a relatively simple process that eliminates voids between the lower and upper chips and the cracking and delamination problems associated with such voids. The present invention is applicable to both chip-level bonding and wafer-level bonding approaches. A photosensitive polymer layer is applied to a first chip, or wafer, prior to stacking the chips or stacking the wafers. The photosensitive polymer layer is partially cured, so that the photosensitive polymer layer is made to be structurally stable, while retaining its adhesive properties. The second chip, or wafer, is stacked, aligned, and bonded to the first chip, or wafer, and the photosensitive polymer layer is then cured to fully bond the first and second chips, or wafers. In this manner, adhesion between chips/wafers is greatly improved, while providing complete gap fill. In addition, mechanical reliability is improved, alleviating the problems associated with cracking and delamination, and leading to an improvement in device yield and device reliability.

Abstract translation: 在堆叠式芯片构造及其制造方法中，使用消除下部和上部切屑之间的空隙以及与这种空隙相关的裂纹和分层问题的相对简单的工艺，完全填充下部和上部切屑之间的间隙。 本发明可应用于芯片级接合和晶片级接合方式。 在堆叠芯片或堆叠晶片之前，将光敏聚合物层施加到第一芯片或晶片。 感光性聚合物层被部分固化，使得光敏聚合物层在结构上稳定，同时保持其粘合性能。 第二芯片或晶片被堆叠，对准并且结合到第一芯片或晶片，然后使光敏聚合物层固化以完全结合第一和​​第二芯片或晶片。 以这种方式，在提供完全的间隙填充的同时，大大提高了芯片/晶片之间的粘附。 此外，机械可靠性得到改善，减轻了与开裂和分层相关的问题，从而提高了设备​​的产量和设备的可靠性。

公开(公告)号：US08995461B2

公开(公告)日：2015-03-31

申请号：US13363391

申请日：2012-02-01

Applicant: Shu Du ,  Anand G. Dabak ,  Xiaolin Lu ,  II Han Kim

Inventor： Shu Du ,  Anand G. Dabak ,  Xiaolin Lu ,  II Han Kim

IPC: H04B3/54 ,  H04L12/10

CPC classification number: H04B3/54 ,  H04B3/544 ,  H04B2203/5408 ,  H04B2203/5466 ,  H04B2203/5495 ,  H04L7/00 ,  H04L12/10 ,  H04L43/0823

Abstract: Systems and methods for channel selection in power line communications (PLC) are described. In some embodiments, a method may include defining a plurality of frames, each frame having a plurality of time slots. The method may also include assembling a pair of beacon and bandscan packets within each of time slot of each frame. The method may further include sequentially transmitting each of the frames over a corresponding one of a plurality of different frequency bands. In some implementations, each bandscan packet may include a slot index indicating a position of its time slot within its respective frame and/or a band index indicating one of the plurality of different frequency bands. In response to having transmitted the plurality of frames, the method may include receiving one or more packets indicating a selection of one or more of the plurality of different frequency bands to be used in subsequent communications.

Abstract translation: 描述了电力线通信（PLC）中通道选择的系统和方法。 在一些实施例中，方法可以包括定义多个帧，每个帧具有多个时隙。 该方法还可以包括在每帧的每个时隙内组合一对信标和带扫描分组。 该方法还可以包括在多个不同频带中的相应一个上顺序发送每个帧。 在一些实现中，每个带扫描分组可以包括指示其在其各自帧内的时隙的位置的时隙索引和/或指示多个不同频带之一的频带索引。 响应于已经发送了多个帧，该方法可以包括接收一个或多个分组，指示将在后续通信中使用的多个不同频带中的一个或多个的选择。