Multi-layer storage node, resistive random access memory device including a multi-layer storage node and methods of manufacturing the same
    14.
    发明授权
    Multi-layer storage node, resistive random access memory device including a multi-layer storage node and methods of manufacturing the same 有权
    多层存储节点,包括多层存储节点的电阻随机存取存储器及其制造方法

    公开(公告)号:US08106394B2

    公开(公告)日:2012-01-31

    申请号:US12314835

    申请日:2008-12-17

    Abstract: A multi-layer storage node, resistive random access memory device and methods of manufacturing the same are provided. The resistive random access memory device includes a switching structure and a storage node connected to the switching structure. The storage node includes a lower electrode, a first layer, a second layer, and an upper electrode that may be sequentially stacked. The first layer may be formed on the lower electrode and includes at least one of oxygen (O), sulfur (S), selenium (Se), tellurium (Te) and combinations thereof. The second layer may be formed on the first layer and includes at least one of copper (Cu), silver (Ag) and combinations thereof. The second layer may be formed of a material having an oxidizing power less than that of the first layer. The upper electrode may be formed on the second layer.

    Abstract translation: 提供了多层存储节点,电阻随机存取存储器件及其制造方法。 电阻式随机存取存储器件包括连接到开关结构的开关结构和存储节点。 存储节点包括可以顺序堆叠的下电极,第一层,第二层和上电极。 第一层可以形成在下电极上,并且包括氧(O),硫(S),硒(Se),碲(Te)及其组合中的至少一种。 第二层可以形成在第一层上,并且包括铜(Cu),银(Ag)及其组合中的至少一种。 第二层可以由具有小于第一层的氧化能力的材料形成。 上电极可以形成在第二层上。

    Resistive random access memory device
    15.
    发明授权
    Resistive random access memory device 有权
    电阻随机存取存储器件

    公开(公告)号:US08035095B2

    公开(公告)日:2011-10-11

    申请号:US12007013

    申请日:2008-01-04

    CPC classification number: G11C13/0007 G11C2213/32 G11C2213/51 G11C2213/79

    Abstract: Provided is a resistive random access memory device that includes a storage node connected to a switching device. The resistive random access memory device includes a first electrode, a resistance variable layer, and a second electrode which are sequentially stacked, wherein a diffusion blocking layer is formed between the first electrode and the resistance variable layer or between the resistance variable layer or/and the second electrode.

    Abstract translation: 提供了一种电阻随机存取存储器件,其包括连接到开关器件的存储节点。 电阻式随机存取存储器件包括依次堆叠的第一电极,电阻变化层和第二电极,其中在第一电极和电阻变化层之间或电阻变化层之间或/或电阻变化层之间形成扩散阻挡层 第二电极。

    Stack-type image sensor
    17.
    发明申请
    Stack-type image sensor 有权
    堆叠型图像传感器

    公开(公告)号:US20110204461A1

    公开(公告)日:2011-08-25

    申请号:US12923273

    申请日:2010-09-13

    Applicant: Jung-hyun Lee

    Inventor: Jung-hyun Lee

    CPC classification number: H01L27/14647 H01L27/14621

    Abstract: Example embodiments are directed to a stack-type image sensor including resistance change elements. The stack-type image sensor includes at least two light-sensing layers that detect different color light stacked on different layers. The stack-type image sensor may not require a size of a unit pixel that detects a light color to be less than 1 μm in order to generate a high resolution color image. As such, resolution saturation may be avoided.

    Abstract translation: 示例性实施例涉及包括电阻变化元件的堆叠型图像传感器。 堆叠型图像传感器包括至少两个检测层叠在不同层上的不同颜色光的感光层。 为了生成高分辨率彩色图像,堆叠型图像传感器可能不需要检测光颜色小于1μm的单位像素的尺寸。 因此,可以避免分辨率饱和。

    Method of manufacturing stack-type capacitor and semiconductor memory device having the stack-type capacitor
    19.
    发明授权
    Method of manufacturing stack-type capacitor and semiconductor memory device having the stack-type capacitor 有权
    具有堆叠型电容器的堆叠型电容器和半导体存储器件的制造方法

    公开(公告)号:US07875525B2

    公开(公告)日:2011-01-25

    申请号:US12289966

    申请日:2008-11-07

    CPC classification number: H01L28/65 H01L27/10852 H01L28/75 H01L28/91

    Abstract: A stack-type capacitor includes a lower electrode, a dielectric layer formed on the lower electrode, and an upper electrode formed on the dielectric layer, wherein the lower electrode includes a first metal layer having a cylindrical shape and a second metal layer filled in the first metal layer. In the capacitor, an amount of oxygen included in the lower electrode is decreased to suppress oxidation of a TiN layer. Thus, a stable stack-type capacitor may be formed, which increases greatly the performance of highly integrated DRAMs.

    Abstract translation: 堆叠型电容器包括下电极,形成在下电极上的电介质层和形成在电介质层上的上电极,其中下电极包括具有圆柱形状的第一金属层和填充在第二金属层中的第二金属层 第一金属层。 在电容器中,下部电极中包含的氧的量减少以抑制TiN层的氧化。 因此,可以形成稳定的堆叠型电容器,这大大增加了高度集成的DRAM的性能。

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