Abstract:
Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device may be a complementary device including a p-type oxide TFT and an n-type oxide TFT. The semiconductor device may be a logic device such as an inverter, a NAND device, or a NOR device.
Abstract:
A self-calibrating temperature sensor and a method thereof are provided. The self-calibrating temperature sensor may include a reference voltage generator to generate a reference voltage based on temperature, a digital-to-analog converter to convert a first digital signal into an analog sensing voltage, a comparator to compare the reference voltage with the analog sensing voltage, and to generate a comparison result signal, a digital signal generator to generate and update the first digital signal based on the comparison result signal, a first storage circuit to store the first digital signal based on a first temperature, a data output unit to output data corresponding to a second temperature based on the first digital signal and a second digital signal output from the first storage circuit.
Abstract:
A memory device has a global input/output line pair configured for data transfer. The memory device includes a sense amplifier, a detecting unit and a detect control signal generating unit. The sense amplifier is coupled to the global input/output line pair. The detecting unit detects a potential difference between the global input/output line pair. The detect control signal generating unit disables an operation of the sense amplifier and precharges the global input/output line pair to a predetermined voltage. A precharge operation of a memory device may be performed at a higher speed so that a high speed operation of the memory device may be achieved. In addition, the operating time of the sense amplifier may be decreased so that the power consumption of the memory device may be reduced.
Abstract:
A dynamic random access memory device having reduced power consumption and a refresh cycle method. The memory device includes a monitoring address storage unit storing multiple monitoring addresses, an error correction code (ECC) engine detecting whether or not an error occurs in monitoring bits corresponding to the monitoring addresses, and a refresh cycle determining circuit adjusting a self refresh cycle depending on whether or not an error occurs in the monitoring bits.
Abstract:
A duty cycle correction circuit for use in a semiconductor device, which synchronizes with an external clock and corrects a duty cycle, is provided. The duty cycle correction circuit includes a modulator of an inverter structure having at least one or more transistors. The modulator receives a control signal through a source terminal and a bulk of any one of the transistors and corrects a duty cycle in response to an external clock signal. The duty cycle correction circuit also includes a driver that converts an output signal of the modulator into a full swing level and outputs the converted output signal of the modulator, and a feedback loop that generates the control signal in response to an output signal of the driver.
Abstract:
A DAC circuit can include a plurality of current source circuits configured to operate responsive to respective different bias voltage signals and respective true and complementary binary digit signals.
Abstract:
In a semiconductor device having a ferroelectric capacitor and manufacturing method thereof, a spacer comprising a low dielectric material is formed on the side surfaces of a plurality of lower electrodes separated into each cell unit, and a ferroelectric film is formed on the lower electrodes whereon the low dielectric material spacer is formed, and an upper electrode is formed on the ferroelectric film, to thereby prevent an error which may be caused between the adjacent lower electrodes.
Abstract:
A capacitor for a semiconductor memory device employs a tantalum pentoxide film as a dielectric film. The dielectric film is made from tantalum pentoxide film doped with silicon over a first electrode. A second electrode is then formed over the dielectric film. Accordingly, in the method for manufacturing the device, although the dielectric constant of the dielectric film is somewhat lower than the conventional pure tantalum pentoxide film due to the silicon doped within the tantalum pentoxide film, leakage current is reduced and breakdown voltage is increased. Therefore, the dielectric film according to the present invention exhibits excellent electrical characteristics and high reliability.
Abstract:
A memory core of a resistive type memory device includes at least a first resistive type memory cell coupled to a bit-line, a first resistance to voltage converter and a bit-line sense amplifier. The first resistance to voltage converter is coupled to the bit-line at a first node. The first resistance to voltage converter converts a resistance of the first resistive type memory cell to a corresponding voltage based on a read column selection signal. The bit-line sense amplifier is coupled to the bit-line at the first node and is coupled to a complementary bit-line at a second node. The bit-line sense amplifier senses and amplifies a voltage difference of the bit-line and the complementary bit-line in response to a sensing control signal.
Abstract:
A resistive memory device may include a resistive cell array and an on-chip resistance measurement circuit. The resistive cell array may include a plurality of resistive memory cells. The on-chip resistance measurement circuit may be configured to generate a first current and a second current greater or less than the first current based on a cell current corresponding to a cell resistance of a first memory cell of the resistive memory cells, and to generate first and second digital signals based on the first and second current, respectively.