公开(公告)号：US20130153418A1

公开(公告)日：2013-06-20

申请号：US13443902

申请日：2012-04-11

申请人： Lung-Tai Chen ,  Chin-Sheng Chang ,  Jing-Yuan Lin ,  Chun-Hsun Chu

发明人： Lung-Tai Chen ,  Chin-Sheng Chang ,  Jing-Yuan Lin ,  Chun-Hsun Chu

IPC分类号： G01N27/30 ,  B32B37/14 ,  B32B37/02

CPC分类号： B81C1/00293 ,  B81C2203/0145 ,  B81C2203/019 ,  G01D11/26

摘要： A sensing device is provided. A suction port of a chamber is sealed by using a gas sealing layer with a gas sealing filter. The gas sealing filter has a plurality of one-way passes. The one-way passes have a width in a range of several nanometers to several hundred nanometers. A gas molecular exhausts to the outside of the chamber through the one-way passes. Owing to preventing the material of gas sealing layer from flowing into the chamber by the gas sealing filter, superior sealing performance is achieved as compared to those adopting solder or sealing material, thereby facilitating control of the condition in the chamber.

摘要翻译： 提供感测装置。 通过使用具有气体密封过滤器的气体密封层来密封腔室的吸入口。 气体密封过滤器具有多个单程通道。 单向通道的宽度在几纳米到几百纳米的范围内。 气体分子通过单程通过排气到室外。 由于通过气体密封过滤器防止气体密封层的材料流入室，与使用焊料或密封材料的密封性相比，实现了优异的密封性能，从而有助于控制室内的状态。

公开(公告)号：US07791181B2

公开(公告)日：2010-09-07

申请号：US12014636

申请日：2008-01-15

申请人： Lung-Tai Chen ,  Chun-Hsun Chu

发明人： Lung-Tai Chen ,  Chun-Hsun Chu

IPC分类号： H01L23/495

CPC分类号： G01L19/141 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C2203/0154 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

摘要： A device structure with preformed ring includes a sensor chip and a ring disposed and surrounded on periphery of sensitive area of an active surface thereof. The device structure with preformed ring may batchly bind and electrically connect to a carrier by a way of two-dimension array, and then a packaging process is performed. During the packaging process, the top portion of the ring can be used to against the inner side of a packaging mold, so as to stop the packaging material covering the device at outside of the ring and stick with the ring. Therefore, an opening is formed on the sensitive area surface of the device. Depending on the ring, the extra process for eliminating the packaging material on the sensitive area surface can be avoided in the conventional process.

摘要翻译： 具有预成型环的装置结构包括传感器芯片和设置并围绕其活性表面的敏感区域的周围的环。 具有预制环的装置结构可以通过二维阵列的方式分批地结合和电连接到载体，然后进行包装处理。 在包装过程中，环的顶部可以用于抵靠包装模具的内侧，以便在环的外侧停止包裹该装置的包装材料并且与环一起粘着。 因此，在装置的敏感区域表面上形成开口。 根据环，在常规方法中可以避免用于消除敏感区域表面上的包装材料的额外处理。

公开(公告)号：US20090121299A1

公开(公告)日：2009-05-14

申请号：US12073392

申请日：2008-03-05

申请人： Lung-Tai Chen ,  Chun-Hsun Chu ,  Tzong-Che Ho ,  Bor-Chen Tsai

发明人： Lung-Tai Chen ,  Chun-Hsun Chu ,  Tzong-Che Ho ,  Bor-Chen Tsai

IPC分类号： H01L29/00 ,  H01L21/00

CPC分类号： B81C1/00793 ,  B81B7/0054 ,  B81B2201/0292 ,  B81B2207/07 ,  B81C1/00182 ,  B81C2201/053 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/13023 ,  H01L2924/1461 ,  H01L2924/00

摘要： A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer.

摘要翻译： 描述了晶片级感测封装及其制造工艺。 该过程包括提供具有感测芯片的晶片，其中每个感测芯片具有感测区域和焊盘; 在晶片表面上形成应力释放层; 在应力释放层上包覆光致抗蚀剂层; 图案化光致抗蚀剂层以暴露垫和应力释放层的一部分，而不暴露感测区域的开口区域; 在由光致抗蚀剂层暴露的应力释放层的部分上形成再分布焊盘的导电金属层; 去除光致抗蚀剂层; 在所述应力释放层和所述导电金属层上形成再包覆光致抗蚀剂层; 在再分布的焊盘区域上方的再包层光致抗蚀剂层中形成孔; 以及在所述孔中形成导电凸块以电连接到所述导电金属层。

公开(公告)号：US5903052A

公开(公告)日：1999-05-11

申请号：US75879

申请日：1998-05-12

申请人： Lung-Tai Chen ,  Ping-Huang Chiang ,  Yu-Kon Chou ,  Chien-Chi Chao

发明人： Lung-Tai Chen ,  Ping-Huang Chiang ,  Yu-Kon Chou ,  Chien-Chi Chao

IPC分类号： H01L23/24 ,  H01L23/367 ,  H01L23/498 ,  H05K3/34 ,  H01L23/495 ,  H01L23/12

CPC分类号： H05K3/341 ,  H01L23/24 ,  H01L23/367 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/0373 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2203/1178 ,  Y02P70/613

摘要： The present invention includes a substrate having a first opening. A heat spreader is attached on the bottom surface of the substrate. The bottom side surface of the heat spreader has trench pattern. The trench pattern includes a plurality of connecting cavities and a plurality of trenches. The chip is mounted on the top side surface of the heat spreader. A supporting member is formed on the top side surface of the substrate. The space among the substrate, the chip, the heat spreader and the supporting member is encapsulated by encapsulating material. The preformed solder balls are mounted on the bottom side surface of the substrate.

摘要翻译： 本发明包括具有第一开口的基板。 散热器附着在基板的底面上。 散热器的底面具有沟槽图案。 沟槽图案包括多个连接腔和多个沟槽。 芯片安装在散热器的顶面。 支撑构件形成在基板的顶侧表面上。 衬底，芯片，散热器和支撑构件之间的空间被封装材料封装。 预制的焊球安装在基板的底侧表面上。

公开(公告)号：US08693711B2

公开(公告)日：2014-04-08

申请号：US12643417

申请日：2009-12-21

申请人： Tzong-Che Ho ,  Lung-Tai Chen ,  Yao-Jung Lee ,  Chao-Ta Huang ,  Li-Chi Pan ,  Yu-Sheng Hsieh

发明人： Tzong-Che Ho ,  Lung-Tai Chen ,  Yao-Jung Lee ,  Chao-Ta Huang ,  Li-Chi Pan ,  Yu-Sheng Hsieh

IPC分类号： H04R25/00

CPC分类号： H01G5/011 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

摘要： A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.

摘要翻译： 公开了一种电容式换能器和制造方法。 所述电容式换能器包括基板，安装在所述基板上的第一电极，具有通孔和所述通孔旁边的空腔的盖，穿过所述通孔安装在所述盖上的第二电极。 第二电极响应于通过通孔施加到其上的压力波动而变形，并与第一电极一起限定为电容器。 电容器包括具有压力波动的电容变量，并且空腔限定用于可变形的第二电极的后室。

公开(公告)号：US20120154068A1

公开(公告)日：2012-06-21

申请号：US13115112

申请日：2011-05-25

申请人： Yu-Wen Hsu ,  Lung-Tai Chen ,  Tzung-Ching Lee ,  Chao-Ta Huang

发明人： Yu-Wen Hsu ,  Lung-Tai Chen ,  Tzung-Ching Lee ,  Chao-Ta Huang

IPC分类号： H03B5/32 ,  H01L21/822

CPC分类号： H03H9/0547 ,  H03H3/02

摘要： A crystal oscillator includes a cover, a crystal blank and an Integrated Circuit (IC) chip. The cover has a surface, a cavity formed in the surface, a plurality of conductive contacts and a conductive sealing ring. The conductive contacts are disposed on the surface, and the conductive sealing ring is disposed on the surface and surrounds the conductive contacts. The IC chip is connected to the conductive contacts and the conductive sealing ring, and forms a hermetic chamber with the cover and the conductive sealing ring. The crystal blank is located in the hermetic chamber, and is electrically connected to the IC chip. Furthermore, a method for manufacturing a crystal oscillator is also provided.

摘要翻译： 晶体振荡器包括盖，晶体空白和集成电路（IC）芯片。 盖具有表面，形成在表面中的空腔，多个导电触点和导电密封环。 导电触点设置在表面上，并且导电密封环设置在表面上并且围绕导电触点。 IC芯片连接到导电触点和导电密封环，并与盖和导电密封环形成密封室。 晶体坯料位于密封室中，并与IC芯片电连接。 此外，还提供了一种用于制造晶体振荡器的方法。

公开(公告)号：US20110297434A1

公开(公告)日：2011-12-08

申请号：US13111960

申请日：2011-05-20

申请人： Lung-Tai Chen ,  Tzong-Che Ho ,  Li-Chi Pan ,  Yu-Wen Fan

发明人： Lung-Tai Chen ,  Tzong-Che Ho ,  Li-Chi Pan ,  Yu-Wen Fan

IPC分类号： H05K1/02

CPC分类号： H01L41/0533 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/16152 ,  H01L2924/00014

摘要： A vacuum hermetic organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.

摘要翻译： 提供真空密封有机包装载体。 有机包装载体包括有机基板，导电电路层和无机密封绝缘膜。 有机基板具有第一表面。 导电电路层位于第一表面上并暴露第一表面的一部分。 无机密封绝缘膜至少覆盖暴露的第一表面，以实现完全气密密封有机包装载体的效果。

公开(公告)号：US07973454B1

公开(公告)日：2011-07-05

申请号：US12850643

申请日：2010-08-05

申请人： Lung-Tai Chen ,  Tzong-Che Ho ,  Li-Chi Pan ,  Yu-Wen Fan

发明人： Lung-Tai Chen ,  Tzong-Che Ho ,  Li-Chi Pan ,  Yu-Wen Fan

IPC分类号： H01L41/053

CPC分类号： H01L41/0533 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/16152 ,  H01L2924/00014

摘要： A vacuum hermetic organic packaging carrier and a sensor device package are provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.

摘要翻译： 提供真空密封有机包装载体和传感器装置包装。 有机包装载体包括有机基板，导电电路层和无机密封绝缘膜。 有机基板具有第一表面。 导电电路层位于第一表面上并暴露第一表面的一部分。 无机密封绝缘膜至少覆盖暴露的第一表面，以实现完全气密密封有机包装载体的效果。

公开(公告)号：US20090129622A1

公开(公告)日：2009-05-21

申请号：US12050368

申请日：2008-03-18

申请人： Lung-Tai Chen ,  Chun-Hsun Chu ,  Wood-Hi Cheng

发明人： Lung-Tai Chen ,  Chun-Hsun Chu ,  Wood-Hi Cheng

IPC分类号： H04R11/04

CPC分类号： H04R31/00 ,  H04R19/016

摘要： A micro-electro-mechanical system (MEMS) microphone module and a manufacturing process thereof are described. A thickness of a transparent temporary cover plate temporarily disposed in a conventional plastic package structure is adjusted. After a mold for a plastic protector is formed, an UV ray is utilized to irradiate the mold to reduce adherence on the temporary cover plate and a back surface of the MEMS acoustic wave sensing chip. Then, the temporary cover plate is removed, and the left space left is the main source for the back-volume of the MEMS microphone. Finally, a tag is covered on the plastic protector, so as to define the whole back-volume and form a closed back-volume. In the above-mentioned process, the size of the back-volume is the same as an area of the whole MEMS microphone chip. In addition, the back-volume can be defined.

摘要翻译： 微机电系统（MEMS）麦克风模块及其制造过程被描述。 临时设置在传统的塑料封装结构中的透明临时盖板的厚度被调节。 在形成用于塑料保护器的模具之后，使用紫外线照射模具以减少临时盖板和MEMS声波感测芯片的背面的粘附。 然后，移除临时盖板，剩下的剩余空间是用于MEMS麦克风的后部体积的主要来源。 最后，在塑料保护器上覆盖一个标签，以便定义整个后部体积并形成封闭的后部体积。 在上述处理中，背面体积的大小与整个MEMS麦克风芯片的面积相同。 此外，可以定义后卷。

公开(公告)号：US20090020862A1

公开(公告)日：2009-01-22

申请号：US12014636

申请日：2008-01-15

申请人： Lung-Tai CHEN ,  Chun-Hsun CHU

发明人： Lung-Tai CHEN ,  Chun-Hsun CHU

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： G01L19/141 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C2203/0154 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

摘要： A device structure with preformed ring includes a sensor chip and a ring disposed and surrounded on periphery of sensitive area of an active surface thereof. The device structure with preformed ring may batchly bind and electrically connect to a carrier by a way of two-dimension array, and then a packaging process is performed. During the packaging process, the top portion of the ring can be used to against the inner side of a packaging mold, so as to stop the packaging material covering the device at outside of the ring and stick with the ring. Therefore, an opening is formed on the sensitive area surface of the device. Depending on the ring, the extra process for eliminating the packaging material on the sensitive area surface can be avoided in the conventional process.

摘要翻译： 具有预成型环的装置结构包括传感器芯片和设置并围绕其活性表面的敏感区域的周围的环。 具有预制环的装置结构可以通过二维阵列的方式分批地结合和电连接到载体，然后进行包装处理。 在包装过程中，环的顶部可以用于抵靠包装模具的内侧，以便在环的外侧停止包裹该装置的包装材料并且与环一起粘着。 因此，在装置的敏感区域表面上形成开口。 根据环，在常规方法中可以避免用于消除敏感区域表面上的包装材料的额外处理。