公开(公告)号：US09445212B2

公开(公告)日：2016-09-13

申请号：US12050368

申请日：2008-03-18

申请人： Lung-Tai Chen ,  Chun-Hsun Chu ,  Wood-Hi Cheng

发明人： Lung-Tai Chen ,  Chun-Hsun Chu ,  Wood-Hi Cheng

IPC分类号： H04R9/08 ,  H04R31/00 ,  H04R19/01

CPC分类号： H04R31/00 ,  H04R19/016

摘要： A micro-electro-mechanical system (MEMS) microphone module and a manufacturing process thereof are described. A thickness of a transparent temporary cover plate temporarily disposed in a conventional plastic package structure is adjusted. After a mold for a plastic protector is formed, an UV ray is utilized to irradiate the mold to reduce adherence on the temporary cover plate and a back surface of the MEMS acoustic wave sensing chip. Then, the temporary cover plate is removed, and the left space left is the main source for the back-volume of the MEMS microphone. Finally, a tag is covered on the plastic protector, so as to define the whole back-volume and form a closed back-volume. In the above-mentioned process, the size of the back-volume is the same as an area of the whole MEMS microphone chip. In addition, the back-volume can be defined.

摘要翻译： 微机电系统（MEMS）麦克风模块及其制造过程被描述。 临时设置在传统的塑料封装结构中的透明临时盖板的厚度被调节。 在形成用于塑料保护器的模具之后，使用紫外线照射模具以减少临时盖板和MEMS声波感测芯片的背面的粘附。 然后，移除临时盖板，剩下的剩余空间是用于MEMS麦克风的后部体积的主要来源。 最后，在塑料保护器上覆盖一个标签，以便定义整个后部体积并形成封闭的后部体积。 在上述处理中，背面体积的大小与整个MEMS麦克风芯片的面积相同。 此外，可以定义后卷。

公开(公告)号：US20130099331A1

公开(公告)日：2013-04-25

申请号：US13327681

申请日：2011-12-15

申请人： Lung-Tai Chen ,  Shih-Chieh Lin ,  Yu-Wen Hsu

发明人： Lung-Tai Chen ,  Shih-Chieh Lin ,  Yu-Wen Hsu

IPC分类号： H01L29/66 ,  H01L21/02

CPC分类号： B81B7/007 ,  B81B2207/097 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure and a process for a microelectromechanical system (MEMS)-based sensor are provided. The structure for a MEMS-based sensor includes a substrate chip. A first insulating layer covers a top surface of the substrate chip. A device layer is disposed on a top surface of the first insulating layer. The device layer includes a periphery region and a sensor component region. The periphery region and a sensor component region have an air trench therebetween. The component region includes an anchor component and a moveable component. A second insulating layer is disposed on a top surface of the device layer, bridging the periphery region and a portion of the anchor component. A conductive pattern is disposed on the second insulating layer, electrically connecting to the anchor component.

摘要翻译： 提供了一种用于基于微机电系统（MEMS）的传感器的结构和工艺。 基于MEMS的传感器的结构包括衬底芯片。 第一绝缘层覆盖衬底芯片的顶表面。 器件层设置在第一绝缘层的顶表面上。 器件层包括外围区域和传感器部件区域。 周边区域和传感器部件区域之间具有空气沟槽。 组件区域包括锚构件和可移动构件。 第二绝缘层设置在器件层的顶表面上，桥接外围区域和锚固部件的一部分。 导电图案设置在第二绝缘层上，与导电组件电连接。

公开(公告)号：US20110018075A1

公开(公告)日：2011-01-27

申请号：US12572277

申请日：2009-10-02

申请人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Sheah Chen ,  Jing-Yuan Lin ,  Li-Chi Pan ,  Tzong-Che Ho

发明人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Sheah Chen ,  Jing-Yuan Lin ,  Li-Chi Pan ,  Tzong-Che Ho

IPC分类号： H01L29/84 ,  H01L23/02

CPC分类号： B81B7/007 ,  B81B2201/0292 ,  B81B2207/093 ,  H01L2224/16225

摘要： A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.

摘要翻译： 感测装置包括具有上表面的基底，传感器构件，至少外部导电线和驻环构件。 传感器构件，外部导电线和支架构件在上表面上。 传感器构件位于上表面的中央区域，并且立环构件围绕传感器构件。 站立环构件和传感器构件通过至少一个外部导线电连接。

公开(公告)号：US09343651B2

公开(公告)日：2016-05-17

申请号：US13490480

申请日：2012-06-07

申请人： Lung-Tai Chen ,  Tzong-Che Ho ,  Li-Chi Pan ,  Yu-Wen Fan

发明人： Lung-Tai Chen ,  Tzong-Che Ho ,  Li-Chi Pan ,  Yu-Wen Fan

IPC分类号： H01L23/02 ,  H01L23/12 ,  H01L23/053 ,  H01L23/14 ,  H01L23/00 ,  H01L23/34 ,  H01L41/053 ,  H03H9/05 ,  H03H9/10

CPC分类号： H01L41/0533 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H03H9/0509 ,  H03H9/1014 ,  H01L2924/00014 ,  H01L2924/00

摘要： An organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and a sealing metal layer. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and includes at least a conductive layer and a sealing ring. The sealing ring is a closed ring. The sealing metal layer is located on the sealing ring, wherein a material of the sealing metal layer includes AgSn and is lead-free.

摘要翻译： 提供有机包装载体。 有机包装载体包括有机基板，导电电路层和密封金属层。 有机基板具有第一表面。 导电电路层位于第一表面上并且至少包括导电层和密封环。 密封环是封闭环。 密封金属层位于密封环上，其中密封金属层的材料包括AgSn并且是无铅的。

公开(公告)号：US09133018B2

公开(公告)日：2015-09-15

申请号：US12572277

申请日：2009-10-02

申请人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Sheah Chen ,  Jing-Yuan Lin ,  Li-Chi Pan ,  Tzong-Che Ho

发明人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Sheah Chen ,  Jing-Yuan Lin ,  Li-Chi Pan ,  Tzong-Che Ho

IPC分类号： B81B7/00

CPC分类号： B81B7/007 ,  B81B2201/0292 ,  B81B2207/093 ,  H01L2224/16225

摘要： A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.

摘要翻译： 感测装置包括具有上表面的基底，传感器构件，至少外部导电线和驻环构件。 传感器构件，外部导电线和支架构件在上表面上。 传感器构件位于上表面的中央区域，并且立环构件围绕传感器构件。 站立环构件和传感器构件通过至少一个外部导线电连接。

公开(公告)号：US08643125B2

公开(公告)日：2014-02-04

申请号：US13327681

申请日：2011-12-15

申请人： Lung-Tai Chen ,  Shih-Chieh Lin ,  Yu-Wen Hsu

发明人： Lung-Tai Chen ,  Shih-Chieh Lin ,  Yu-Wen Hsu

IPC分类号： H01L29/78

CPC分类号： B81B7/007 ,  B81B2207/097 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure and a process for a microelectromechanical system (MEMS)-based sensor are provided. The structure for a MEMS-based sensor includes a substrate chip. A first insulating layer covers a top surface of the substrate chip. A device layer is disposed on a top surface of the first insulating layer. The device layer includes a periphery region and a sensor component region. The periphery region and a sensor component region have an air trench therebetween. The component region includes an anchor component and a moveable component. A second insulating layer is disposed on a top surface of the device layer, bridging the periphery region and a portion of the anchor component. A conductive pattern is disposed on the second insulating layer, electrically connecting to the anchor component.

摘要翻译： 提供了一种用于基于微机电系统（MEMS）的传感器的结构和工艺。 基于MEMS的传感器的结构包括衬底芯片。 第一绝缘层覆盖衬底芯片的顶表面。 器件层设置在第一绝缘层的顶表面上。 器件层包括外围区域和传感器部件区域。 周边区域和传感器部件区域之间具有空气沟槽。 组件区域包括锚构件和可移动构件。 第二绝缘层设置在器件层的顶表面上，桥接外围区域和锚固部件的一部分。 导电图案设置在第二绝缘层上，与导电组件电连接。

公开(公告)号：US08421543B2

公开(公告)日：2013-04-16

申请号：US13115112

申请日：2011-05-25

申请人： Yu-Wen Hsu ,  Lung-Tai Chen ,  Tzung-Ching Lee ,  Chao-Ta Huang

发明人： Yu-Wen Hsu ,  Lung-Tai Chen ,  Tzung-Ching Lee ,  Chao-Ta Huang

IPC分类号： H03B1/00 ,  H03B5/32 ,  H01L41/053

CPC分类号： H03H9/0547 ,  H03H3/02

摘要： A crystal oscillator includes a cover, a crystal blank and an Integrated Circuit (IC) chip. The cover has a surface, a cavity formed in the surface, a plurality of conductive contacts and a conductive sealing ring. The conductive contacts are disposed on the surface, and the conductive sealing ring is disposed on the surface and surrounds the conductive contacts. The IC chip is connected to the conductive contacts and the conductive sealing ring, and forms a hermetic chamber with the cover and the conductive sealing ring. The crystal blank is located in the hermetic chamber, and is electrically connected to the IC chip. Furthermore, a method for manufacturing a crystal oscillator is also provided.

摘要翻译： 晶体振荡器包括盖，晶体空白和集成电路（IC）芯片。 盖具有表面，形成在表面中的空腔，多个导电触点和导电密封环。 导电触点设置在表面上，并且导电密封环设置在表面上并且围绕导电触点。 IC芯片连接到导电触点和导电密封环，并与盖和导电密封环形成密封室。 晶体坯料位于密封室中，并与IC芯片电连接。 此外，还提供了一种用于制造晶体振荡器的方法。

公开(公告)号：US20120260747A1

公开(公告)日：2012-10-18

申请号：US13154426

申请日：2011-06-06

申请人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Tzong-Che Ho ,  Li-Chi Pan

发明人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Tzong-Che Ho ,  Li-Chi Pan

IPC分类号： G01N1/00

CPC分类号： B81C1/00293 ,  B81C2203/0118 ,  G01D11/245 ,  G01L19/0092 ,  G01L19/147 ,  G01P1/023 ,  H01L23/315 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.

摘要翻译： 感测装置可以设置有各种条件的密封和开放式室，用于通过堆叠多个基板来容纳不同类型的感测结构部件，其中密封室的状态取决于在基板接合过程中采取的条件。 由于通过基板密封密封室的通道，与使用焊料或密封材料的密封室相比，实现了优异的密封性能，因此可以精细地控制密封室的状态。

公开(公告)号：US5695109A

公开(公告)日：1997-12-09

申请号：US562007

申请日：1995-11-22

申请人： Ping-Huang Chiang ,  Lung-Tai Chen ,  Yu-Kon Chou

发明人： Ping-Huang Chiang ,  Lung-Tai Chen ,  Yu-Kon Chou

IPC分类号： B23K35/02 ,  B23K35/14 ,  H05K3/34 ,  H05K3/40

CPC分类号： H05K3/3436 ,  B23K35/0222 ,  B23K35/025 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K3/3484 ,  H05K3/4069 ,  Y02P70/613

摘要： An integrated circuit (IC) package includes solder paste inter-layer and alignment apparatus 100 for applying and aligning solder paste 150 with corresponding solder pads 160 on the IC package carrier 200. The apparatus 100 includes a thin layer 100 which is composed of high-temperature-resistant, non-solder-wetting, and electrical-insulating materials. The apparatus further has a plurality of apertures 110, each disposed on and penetrating through the thin layer 100 for applying solder paste 150 therein and for aligning with the corresponding solder pads 160 on the IC package carrier 200. The apparatus 100 further includes a removable thin film tape 120 disposed on a bottom surface of the thin layer 100 for temporarily maintaining the solder paste 150 in the plurality of apertures 110.

摘要翻译： 集成电路（IC）封装包括焊膏层间和对准装置100，用于将焊膏150与IC封装载体200上的相应的焊盘160进行对准和对准。装置100包括薄层100， 耐温，非焊接润湿和电绝缘材料。 该设备还具有多个孔110，每个孔110设置在薄层100上并穿透薄层100，用于在其中施加焊膏150并与IC封装载体200上的对应焊盘160对准。装置100还包括可移除薄膜 薄膜带120设置在薄层100的底表面上，用于在多个孔110中暂时保持焊膏150。

公开(公告)号：US08763457B2

公开(公告)日：2014-07-01

申请号：US13154426

申请日：2011-06-06

申请人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Tzong-Che Ho ,  Li-Chi Pan

发明人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Tzong-Che Ho ,  Li-Chi Pan

IPC分类号： G01D11/24

CPC分类号： B81C1/00293 ,  B81C2203/0118 ,  G01D11/245 ,  G01L19/0092 ,  G01L19/147 ,  G01P1/023 ,  H01L23/315 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.

摘要翻译： 感测装置可以设置有各种条件的密封和开放式室，用于通过堆叠多个基板来容纳不同类型的感测结构部件，其中密封室的状态取决于在基板接合过程中采取的条件。 由于通过基板密封密封室的通道，与使用焊料或密封材料的密封室相比，实现了优异的密封性能，因此可以精细地控制密封室的状态。