公开(公告)号：US07385472B1

公开(公告)日：2008-06-10

申请号：US11427208

申请日：2006-06-28

申请人： Stuart D. Downes

发明人： Stuart D. Downes

IPC分类号： H01F5/00

CPC分类号： H05K3/429 ,  H05K3/06 ,  H05K2201/2072 ,  H05K2203/1184

摘要： A printed circuit board having interstitial vias. The printed circuit board has a plurality of overlying electrical conductors disposed within an inner region of the printed circuit board. The overlying electrical conductors are separated by dielectric material. The printed circuit board has an aperture passing through a portion of the plurality of overlying electrical conductors printed circuit board. The overlying electrical conductors have ends with recesses therein. An electrical conductive via passes through the aperture with distal portions of the via projecting into the recesses.

摘要翻译： 具有间隙通孔的印刷电路板。 印刷电路板具有布置在印刷电路板的内部区域内的多个上覆电导体。 上覆的电导体被电介质材料分开。 印刷电路板具有通过多个上覆电导体印刷电路板的一部分的孔。 上覆电导体的端部具有凹槽。 导电通孔穿过孔，通孔的远端突出到凹槽中。

公开(公告)号：US07252100B1

公开(公告)日：2007-08-07

申请号：US10402514

申请日：2003-03-28

申请人： Stuart D. Downes ,  Deborah Fragoza ,  Eric Ren ,  Thomas E. Knight

发明人： Stuart D. Downes ,  Deborah Fragoza ,  Eric Ren ,  Thomas E. Knight

IPC分类号： B08B3/00

CPC分类号： H05K3/26 ,  H05K3/0097 ,  H05K2201/042 ,  H05K2203/0743 ,  H05K2203/1518

摘要： A circuit board processing system includes a wash tank configured to contain cleaning fluid, and a positioning subsystem configured to immerse a set of circuit boards into the wash tank. The system further includes a flow control subsystem having (i) a first set of nozzles disposed within the wash tank, (ii) a second set of nozzles disposed within the wash tank, and (iii) a controller. The controller is configured to direct the cleaning fluid through the first set of nozzles to provide a flow of the cleaning fluid in a first direction relative to the set of circuit boards. The controller is further configured to direct the cleaning fluid through a second set of nozzles to provide a flow of the cleaning fluid in a second direction relative to the set of circuit boards after providing the flow of the cleaning fluid in the first direction.

摘要翻译： 电路板处理系统包括配置成容纳清洁流体的洗涤槽和配置成将一组电路板浸入洗涤槽中的定位子系统。 该系统还包括流控制子系统，其具有（i）设置在洗涤槽内的第一组喷嘴，（ii）设置在洗涤槽内的第二组喷嘴，和（iii）控制器。 控制器被配置为引导清洁流体穿过第一组喷嘴以提供相对于该组电路板的第一方向上的清洁流体的流动。 控制器进一步构造成引导清洁流体通过第二组喷嘴，以在提供清洁流体沿第一方向的流动之后，相对于该组电路板在第二方向上提供清洁流体的流动。

公开(公告)号：US06637641B1

公开(公告)日：2003-10-28

申请号：US10139500

申请日：2002-05-06

申请人： Stuart D. Downes ,  Jin Liang

发明人： Stuart D. Downes ,  Jin Liang

IPC分类号： B23K308

CPC分类号： B23K1/203 ,  B23K2101/42 ,  H05K3/26 ,  H05K3/3489 ,  H05K2203/0126 ,  H05K2203/0143 ,  H05K2203/025

摘要： A circuit board manufacturing system has a paste source, a circuit board processing apparatus, and a controller. The circuit board processing apparatus includes a carrier configured to receive a circuit board having (i) a section of circuit board material and (ii) virgin metallic surface mount pads supported by the section of circuit board material. The circuit board processing apparatus further includes a paste distribution assembly coupled to the carrier and to the paste source. The paste distribution assembly is configured to dispose a paste from the paste source onto a surface of the circuit board. The carrier further includes a surfacing assembly coupled to the carrier. The surfacing assembly is configured to move the paste over the surface of the circuit board to remove a portion of each virgin metallic surface mount pad. The controller is configured to selectively start and stop operations of the paste distribution and surfacing assemblies.

摘要翻译： 电路板制造系统具有糊源，电路板处理装置和控制器。 电路板处理装置包括：载体，被配置为接收具有（i）电路板材料部分的电路板和（ii）由电路板材料部分支撑的原始金属表面安装焊盘。 电路板处理装置还包括耦合到载体和糊源的糊剂分配组件。 糊剂分配组件被配置为将糊料从糊剂源设置到电路板的表面上。 载体还包括耦合到载体的表面组件。 表面组件被配置为将糊料移动到电路板的表面上以去除每个原始金属表面安装垫的一部分。 控制器被配置为选择性地启动和停止粘合剂分布和堆焊组件的操作。

公开(公告)号：US06429645B1

公开(公告)日：2002-08-06

申请号：US09608287

申请日：2000-06-30

申请人： Stuart D. Downes

发明人： Stuart D. Downes

IPC分类号： G01R3102

CPC分类号： G01R35/00

摘要： A verification gauge for verifying the operation of an inspection system for inspecting the leads of an electronic package, particularly a ball grid array. The gauge has a predetermined mechanical relationship to a mechanical parameter of the leads of the electronic package so that when the inspection system is used to inspect the gauge, a reading will indicate whether the inspection system is properly set up for the mechanical parameter. The gauge may be configured to substantially emulate the structural configuration, including the particular size, shape and lead pattern, of the electronic package. The gauge may be used to verify the calibration or the predefined limit of the inspection system for the mechanical parameter, including lead coplanarity, lead pitch, missing lead and lead deformation parameters.

摘要翻译： 一种用于验证用于检查电子封装，特别是球栅阵列的引线的检查系统的操作的验证计。 仪表与电子封装的引线的机械参数具有预定的机械关系，因此当使用检查系统检查仪表时，读数将指示检查系统是否适当地设置机械参数。 计量器可以被配置为基本上模拟包括电子封装的特定尺寸，形状和引线图案的结构配置。 该量规可用于验证机械参数的校准或预定义的检测系统极限，包括引线共面性，引线间距，缺少引线和引线变形参数。

公开(公告)号：US06800545B2

公开(公告)日：2004-10-05

申请号：US10261727

申请日：2002-10-01

申请人： Stuart D. Downes

发明人： Stuart D. Downes

IPC分类号： H01L2144

CPC分类号： H01R12/585 ,  H01R43/0256 ,  H05K3/3447 ,  H05K3/3452 ,  H05K13/04 ,  H05K2201/10704 ,  H05K2201/10818 ,  H05K2201/10856 ,  H05K2201/10984 ,  H05K2203/0415 ,  H05K2203/0557

摘要： The invention is directed to techniques for forming a soldered connection using a pin having a channel. The channel enables the pin to form a secure connection with a via (e.g., by facilitating gas percolation out of the via hole during soldering to improve solder flow, by holding solder prior to pin insertion and soldering, or by facilitating accurate pin bending to hold solder or a pin insert prior to pin insertion and soldering) to improve connection system reliability and increase manufacturing yields. In one arrangement, the pin has a surface which includes (i) a first surface area, (ii) a second surface area that is substantially parallel to the first surface area, and (iii) a channel surface area which defines a channel that extends from the first surface area toward the second surface area. To form a soldered connection, the pin is inserted into a cavity defined by a via of a connecting member (e.g., a circuit board), in a direction that is parallel to a central axis of the via. The pin is then soldered to the via to establish an electrical pathway between the pin and the via. Depending on the particular arrangement, the channel generally facilitates the introduction of solder into the cavity of the via. Accordingly, the cavity dimension of the via can be smaller than that required for vias of a conventional reflow soldering approach (i.e., less than 100% of the maximum pin cross-section as for a conventional reflow soldering approach). Hence, the invention is suitable for use in high-density, micro-soldered connection arrangements (e.g., in situations with vias closer together than in the conventional reflow soldering approach).

摘要翻译： 本发明涉及使用具有通道的销形成焊接连接​​的技术。 该通道使引脚与通孔形成牢固的连接（例如，通过在焊接期间促进气体渗透出通孔，以改善焊料流动，通过在引脚插入和焊接之前保持焊料，或通过促进精确的引脚弯曲来保持 焊接或插针插入，然后插入和焊接），以提高连接系统的可靠性并提高制造产量。 在一种布置中，销具有表面，其包括（i）第一表面区域，（ii）基本上平行于第一表面区域的第二表面区域，以及（iii）限定延伸的通道的通道表面区域 从第一表面区域朝向第二表面区域。 为了形成焊接连接​​，销在与通孔的中心轴平行的方向插入到由连接构件（例如电路板）的通孔限定的空腔中。 然后将引脚焊接到通孔，以在引脚和通孔之间建立电路径。 根据具体的布置，通道通常有助于将焊料引入到通孔的空腔中。 因此，通孔的腔体尺寸可以小于常规回流焊接方法的通孔所需的腔体尺寸（即，对于传统的回流焊接方法，其小于最大引脚横截面的100％）。 因此，本发明适用于高密度，微焊接的连接装置（例如，在通孔比常规回流焊接方法更靠近的情况下）。

公开(公告)号：US06716072B1

公开(公告)日：2004-04-06

申请号：US10184495

申请日：2002-06-27

申请人： Stuart D. Downes

发明人： Stuart D. Downes

IPC分类号： H01R448

CPC分类号： H01R43/0256 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2203/0415

摘要： A pin solders to a circuit board. The pin includes a soldering portion which is configured to solder to a via of the circuit board and an engagement portion which is configured to engage with a circuit board component. The soldering portion has a circular cross-section and a soldering portion diameter. Similarly, the engagement portion has a circular cross-section and an engagement portion diameter. The soldering portion diameter is substantially narrower than the engagement portion diameter. Accordingly, the soldering portion can solder to relatively narrow circuit board via having a small anti-pad, and the thicker engagement portion can provide suitable strength for positioning the circuit board component in a reliable manner.

摘要翻译： 针脚焊接到电路板。 该引脚包括被配置为焊接到电路板的通孔的焊接部分和配置成与电路板部件接合的接合部分。 焊接部分具有圆形横截面和焊接部分直径。 类似地，接合部分具有圆形横截面和接合部分直径。 焊接部直径基本上比接合部直径窄。 因此，焊接部可以通过具有小的防焊盘而焊接到相对窄的电路板，并且较厚的接合部分可以提供用于可靠地定位电路板部件的合适的强度。

公开(公告)号：US06552277B1

公开(公告)日：2003-04-22

申请号：US09658764

申请日：2000-09-08

申请人： Stuart D. Downes

发明人： Stuart D. Downes

IPC分类号： H01R1204

CPC分类号： H01R12/58 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/1084 ,  H05K2201/10871 ,  H05K2203/1178

摘要： The invention is directed to techniques for forming a connection between a pin and a circuit board using a pin having protruding portions and grooved surfaces that extend between the protruding portions. The protruding portions (i) prevent the pin from inadvertently slipping through a via of the circuit board, and (ii) maintains the pin's proper position relative to the circuit board via. The grooved surfaces enable gas to vent from a cavity in the via during the solder process thus enabling solder to flow within the via and form a reliable and robust solder joint between the pin and the circuit board via. In one arrangement, the protruding portions and grooved surfaces are at both ends of the pin enabling the pin to be soldered between two circuit board sections. In one arrangement, the pin is simultaneously soldered to both circuit board sections. In another arrangement, the pin is initially soldered to one circuit board section, and subsequently soldered to another circuit board section. In either arrangement, the protruding portions of the pin, and in some arrangements close tolerances between the pin and the via, facilitate positioning of the pin in its proper location and the additional surface area provided by the grooved surfaces and the protruding portions (i.e., wetted metallic surfaces having a high affinity for solder) retain solder in the via cavities of the circuit board sections in order to form healthy solder joints. Accordingly, the invention is suitable for use in connecting multiple circuit board sections together at opposite ends of a pin.

摘要翻译： 本发明涉及使用具有在突出部分之间延伸的突出部分和凹槽表面的销来形成销和电路板之间的连接的技术。 突出部分（i）防止销不经意地滑过电路板的通孔，并且（ii）保持销相对于电路板通孔的适当位置。 沟槽表面使得气体在焊接过程期间能够从通孔中的空腔排出，从而使得焊料能够在通孔内流动，并在销和电路板通孔之间形成可靠且牢固的焊接接头。 在一种布置中，突出部分和沟槽表面位于销的两端，使得销能够焊接在两个电路板部分之间。 在一种布置中，引脚同时焊接到两个电路板部分。 在另一种布置中，该引脚最初被焊接到一个电路板部分，并随后焊接到另一个电路板部分。 在任何一种布置中，销的突出部分和在销和通孔之间的一些布置中的公差很容易将销定位在其正确的位置以及由凹槽表面和突出部分（即， 对焊料具有高亲和力的润湿金属表面）将焊料保留在电路板部分的通孔中，以形成健康的焊点。 因此，本发明适用于在引脚的相对端部处将多个电路板部分连接在一起。

公开(公告)号：US06483041B1

公开(公告)日：2002-11-19

申请号：US09438245

申请日：1999-11-12

申请人： Stuart D. Downes

发明人： Stuart D. Downes

IPC分类号： H05K116

CPC分类号： H01R12/585 ,  H01R43/0256 ,  H05K3/3447 ,  H05K3/3452 ,  H05K13/04 ,  H05K2201/10704 ,  H05K2201/10818 ,  H05K2201/10856 ,  H05K2201/10984 ,  H05K2203/0415 ,  H05K2203/0557

摘要： The invention is directed to techniques for forming a soldered connection using a pin having a channel. The channel enables the pin to form a secure connection with a via (e.g., by facilitating gas percolation out of the via hole during soldering to improve solder flow, by holding solder prior to pin insertion and soldering, or by facilitating accurate pin bending to hold solder or a pin insert prior to pin insertion and soldering) to improve connection system reliability and increase manufacturing yields. In one arrangement, the pin has a surface which includes (i) a first surface area, (ii) a second surface area that is substantially parallel to the first surface area, and (iii) a channel surface area which defines a channel that extends from the first surface area toward the second surface area. To form a soldered connection, the pin is inserted into a cavity defined by a via of a connecting member (e.g., a circuit board), in a direction that is parallel to a central axis of the via. The pin is then soldered to the via to establish an electrical pathway between the pin and the via. Depending on the particular arrangement, the channel generally facilitates the introduction of solder into the cavity of the via. Accordingly, the cavity dimension of the via can be smaller than that required for vias of a conventional reflow soldering approach (i.e., less than 100% of the maximum pin cross-section as for a conventional reflow soldering approach). Hence, the invention is suitable for use in high-density, micro-soldered connection arrangements (e.g., in situations with vias closer together than in the conventional reflow soldering approach).

摘要翻译： 本发明涉及使用具有通道的销形成焊接连接​​的技术。 该通道使引脚与通孔形成牢固的连接（例如，通过在焊接期间促进气体渗透出通孔，以改善焊料流动，通过在引脚插入和焊接之前保持焊料，或通过促进精确的引脚弯曲来保持 焊接或插针插入，然后插入和焊接），以提高连接系统的可靠性并提高制造产量。 在一种布置中，销具有表面，其包括（i）第一表面区域，（ii）基本上平行于第一表面区域的第二表面区域，以及（iii）限定扩展的通道的通道表面区域 从第一表面区域朝向第二表面区域。 为了形成焊接连接​​，销在与通孔的中心轴平行的方向插入到由连接构件（例如电路板）的通孔限定的空腔中。 然后将引脚焊接到通孔，以在引脚和通孔之间建立电路径。 根据具体的布置，通道通常有助于将焊料引入到通孔的空腔中。 因此，通孔的腔体尺寸可以小于常规回流焊接方法的通孔所需的腔体尺寸（即，对于传统的回流焊接方法，其小于最大引脚横截面的100％）。 因此，本发明适用于高密度，微焊接的连接装置（例如，在通孔比常规回流焊接方法更靠近的情况下）。

公开(公告)号：US06386435B1

公开(公告)日：2002-05-14

申请号：US09636360

申请日：2000-08-11

申请人： Stuart D. Downes

发明人： Stuart D. Downes

IPC分类号： B23K3102

CPC分类号： B23K3/0638 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/0949 ,  H05K2201/10734 ,  H05K2203/0545 ,  Y02P70/613

摘要： The invention is directed to techniques for distributing solder paste using a tool that defines a solder paste aperture having a non-circular cross-sectional shape. When the non-circular shape coincides with a pad and at least a portion of a stringer leading to the pad during a solder paste distribution process, solder paste is deposited over the pad and the stringer portion. Since solder paste now resides on the stringer portion, solder is not drawn from the pad toward the stringer portion during the soldering process as with some conventional situations. Rather, solder within the solder paste that resides on the stringer portion tends to adhere to the stringer portion, while some of the solder volume over the stringer pulls back to join the solder over the pad due to surface tension of the solder. The end result is a robust solder joint between the pad and corresponding component contact. Furthermore, the non-circular shape of the aperture allows for apertures that are larger in size than apertures for stencils that do not implement conventional overprinting approaches thus reducing the likelihood of clogging. One arrangement of the invention is directed to a solder paste distribution system having a base, a tool holder coupled to the base, and a solder paste distribution tool coupled to the tool holder. The solder paste distribution tool includes a support member that couples to the tool holder, a distribution member that defines a solder paste aperture having a non-circular cross-sectional shape, and a fastener that secures the distribution member to the support member.

摘要翻译： 本发明涉及使用限定具有非圆形横截面形状的焊膏孔的工具来分配焊膏的技术。 当非圆形形状与焊盘和在焊膏分配过程中通向焊盘的桁条的至少一部分重合时，焊膏沉积在焊盘和桁条部分上。 由于焊膏现在位于纵梁部分上，因此在焊接过程中焊料不会从焊盘朝向纵梁部分拉出，如同一些常规情况。 相反，驻留在纵梁部分的焊膏中的焊料倾向于粘附到纵梁部分，同时由于焊料的表面张力，在纵梁上方的焊料体积中的一些焊料体积回拉以将焊料焊接在焊盘上。 最终结果是焊盘和相应的部件接触之间的牢固的焊接接头。 此外，孔的非圆形形状允许尺寸大于不实施常规套印方法的模板的孔的孔，从而降低堵塞的可能性。 本发明的一种布置涉及一种焊膏分配系统，其具有底座，连接到基座的工具架以及耦合到工具架的焊膏分配工具。 焊膏分配工具包括耦合到工具架的支撑构件，限定具有非圆形横截面形状的焊膏孔的分配构件和将分配构件固定到支撑构件的紧固件。

公开(公告)号：US06347734B1

公开(公告)日：2002-02-19

申请号：US09536194

申请日：2000-03-27

申请人： Stuart D. Downes

发明人： Stuart D. Downes

IPC分类号： B23K3102

CPC分类号： B23K1/012 ,  B23K1/0016 ,  B23K3/04 ,  B23K3/085 ,  H05K3/3436 ,  H05K3/3494

摘要： The invention is directed to techniques for installing a module on a circuit board by simultaneously heating a perimeter portion of the module, and bringing an inner portion of the module to temperature that is lower than that of the perimeter portion. Heating the perimeter portion of the module melts solder disposed between contact members of the module and corresponding contact members of the circuit board in order to form solder connections. Bringing the inner portion of the module to temperature that is lower than that of the perimeter portion reduces the likelihood of causing heat-related damage to the module itself. One arrangement of the invention is directed to a module installation system for installing a module on a circuit board. The module has a perimeter portion and an inner portion. The module installation system includes a heating source, a cooling source, and a nozzle coupled to the heating and cooling sources. The nozzle is configured to simultaneously heat the perimeter portion of the module, and cool the inner portion of the module in order to install the module on the circuit board. Accordingly, contact members around the perimeter portion of the module can form solder connections with the circuit board while cooling of the inner portion of the module protects the inner portion from heat-related damage. For example, if the module is an MCM, solder joints connecting MCM components at the inner portion to the MCM board will be less likely to reflow and cause a failure. In a preferred arrangement, the heating source provides a first fluid (i.e., a gas or a liquid), and the cooling source provides a second fluid. In one arrangement, the nozzle applies the first fluid to an area adjacent the perimeter portion of the module, and the second fluid to an area adjacent the inner portion of the module.

摘要翻译： 本发明涉及通过同时加热模块的周边部分并使模块的内部部分温度低于周边部分的温度来将模块安装在电路板上的技术。 加热模块的周边部分会熔化设置在模块的触点构件和电路板的相应接触构件之间的焊料，以形成焊料连接。 使模块的内部部分温度低于周边部分的温度降低了对模块本身造成与热量相关的损坏的可能性。 本发明的一个方案涉及用于在电路板上安装模块的模块安装系统。 模块具有周边部分和内部部分。 模块安装系统包括加热源，冷却源和联接到加热和冷却源的喷嘴。 喷嘴被配置为同时加热模块的周边部分，并且冷却模块的内部部分，以将模块安装在电路板上。 因此，围绕模块的周边部分的接触构件可以与电路板形成焊接连接​​，同时模块的内部部分的冷却保护内部免受热损坏。 例如，如果模块是MCM，则将MCM部件连接到MCM板的焊接接头将不太可能回流并导致故障。 在优选的布置中，加热源提供第一流体（即，气体或液体），并且冷却源提供第二流体。 在一种布置中，喷嘴将第一流体施加到与模块的周边部分相邻的区域，并将第二流体施加到与模块的内部部分相邻的区域。