公开(公告)号：US07989280B2

公开(公告)日：2011-08-02

申请号：US12338839

申请日：2008-12-18

Applicant: Justin K. Brask ,  Suman Datta ,  Mark L. Doczy ,  James M. Blackwell ,  Matthew V. Metz ,  Jack T. Kavalieros ,  Robert S. Chau

Inventor： Justin K. Brask ,  Suman Datta ,  Mark L. Doczy ,  James M. Blackwell ,  Matthew V. Metz ,  Jack T. Kavalieros ,  Robert S. Chau

IPC: H01L21/336

CPC classification number: H01L21/314 ,  H01L21/02178 ,  H01L21/02181 ,  H01L21/0228 ,  H01L21/28008 ,  H01L21/3141 ,  H01L21/31616 ,  H01L21/31645 ,  H01L29/2003 ,  H01L29/495 ,  H01L29/513 ,  H01L29/517 ,  H01L29/66462 ,  H01L29/7784

Abstract: A Group III-V Semiconductor device and method of fabrication is described. A high-k dielectric is interfaced to a confinement region by a chalcogenide region.

Abstract translation: 描述了III-V族半导体器件及其制造方法。 高k电介质通过硫族化物区域连接到约束区域。

公开(公告)号：US20110156174A1

公开(公告)日：2011-06-30

申请号：US13044356

申请日：2011-03-09

Applicant: Gilbert Dewey ,  Mark L. Doczy ,  Suman Datta ,  Justin K. Brask ,  Matthew V. Metz

Inventor： Gilbert Dewey ,  Mark L. Doczy ,  Suman Datta ,  Justin K. Brask ,  Matthew V. Metz

IPC: H01L29/78

CPC classification number: H01L29/513 ,  H01L21/28088 ,  H01L21/28194 ,  H01L21/823828 ,  H01L21/823857 ,  H01L29/4966 ,  H01L29/517 ,  H01L29/665 ,  H01L29/66545 ,  H01L29/6659 ,  H01L29/66795 ,  H01L29/78

Abstract: A method of manufacturing a semiconductor device and a novel semiconductor device are disclosed herein. An exemplary method includes sputtering a capping layer in-situ on a gate dielectric layer, before any high temperature processing steps are performed.

Abstract translation: 本文公开了半导体器件和新型半导体器件的制造方法。 示例性的方法包括在执行任何高温处理步骤之前，在栅介质层上原位溅射覆盖层。

公开(公告)号：US07968957B2

公开(公告)日：2011-06-28

申请号：US12893983

申请日：2010-09-29

Applicant: Anand Murthy ,  Boyan Boyanov ,  Suman Datta ,  Brian S. Doyle ,  Been-Yih Jin ,  Shaofeng Yu ,  Robert Chau

Inventor： Anand Murthy ,  Boyan Boyanov ,  Suman Datta ,  Brian S. Doyle ,  Been-Yih Jin ,  Shaofeng Yu ,  Robert Chau

IPC: H01L21/00

CPC classification number: H01L29/1054 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823842 ,  H01L21/823857 ,  H01L29/66636 ,  H01L29/7842 ,  H01L29/7848

Abstract: Various embodiments of the invention relate to a PMOS device having a transistor channel of silicon germanium material on a substrate, a gate dielectric having a dielectric constant greater than that of silicon dioxide on the channel, a gate electrode conductor material having a work function in a range between a valence energy band edge and a conductor energy band edge for silicon on the gate dielectric, and a gate electrode semiconductor material on the gate electrode conductor material.

Abstract translation: 本发明的各种实施例涉及在衬底上具有硅锗材料的晶体管沟道的PMOS器件，介电常数大于沟道上的二氧化硅的介电常数的栅极电介质，具有功函数的栅电极导体材料 在栅极电介质上的硅的价态能带边缘和导体能带边缘之间的范围，以及栅电极导体材料上的栅电极半导体材料。

公开(公告)号：US07915694B2

公开(公告)日：2011-03-29

申请号：US12354702

申请日：2009-01-15

Applicant: Gilbert Dewey ,  Mark L. Doczy ,  Suman Datta ,  Justin K. Brask ,  Matthew V. Metz

Inventor： Gilbert Dewey ,  Mark L. Doczy ,  Suman Datta ,  Justin K. Brask ,  Matthew V. Metz

IPC: H01L29/78

CPC classification number: H01L29/513 ,  H01L21/28088 ,  H01L21/28194 ,  H01L21/823828 ,  H01L21/823857 ,  H01L29/4966 ,  H01L29/517 ,  H01L29/665 ,  H01L29/66545 ,  H01L29/6659 ,  H01L29/66795 ,  H01L29/78

Abstract: A method of manufacturing a semiconductor device and a novel semiconductor device are disclosed herein. An exemplary method includes sputtering a capping layer in-situ on a gate dielectric layer, before any high temperature processing steps are performed.

Abstract translation: 本文公开了半导体器件和新型半导体器件的制造方法。 示例性的方法包括在执行任何高温处理步骤之前，在栅介质层上原位溅射覆盖层。

公开(公告)号：US07902014B2

公开(公告)日：2011-03-08

申请号：US11649545

申请日：2007-01-03

Applicant: Brian S. Doyle ,  Been-Yih Jin ,  Jack T. Kavalieros ,  Suman Datta ,  Justin K. Brask ,  Robert S. Chau

Inventor： Brian S. Doyle ,  Been-Yih Jin ,  Jack T. Kavalieros ,  Suman Datta ,  Justin K. Brask ,  Robert S. Chau

IPC: H01L21/8234

CPC classification number: H01L21/845 ,  H01L21/823807 ,  H01L21/823821 ,  H01L21/823878 ,  H01L27/1211 ,  H01L29/0673 ,  H01L29/068 ,  H01L29/1054 ,  H01L29/66439 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/785

Abstract: Described herein are a device utilizing a gate electrode material with a single work function for both the pMOS and nMOS transistors where the magnitude of the transistor threshold voltages is modified by semiconductor band engineering and article made thereby. Further described herein are methods of fabricating a device formed of complementary (pMOS and nMOS) transistors having semiconductor channel regions which have been band gap engineered to achieve a low threshold voltage.

Abstract translation: 这里描述了利用具有单功函数的栅电极材料的器件，用于pMOS和nMOS晶体管，其中晶体管阈值电压的幅度由半导体带工程和由此制成的制品修改。 本文进一步描述的是制造由互补（pMOS和nMOS）晶体管形成的器件的方法，该晶体管具有被设计成能够实现低阈值电压的带隙的半导体沟道区。

公开(公告)号：US20110020987A1

公开(公告)日：2011-01-27

申请号：US12893753

申请日：2010-09-29

Applicant: Scott A. Hareland ,  Robert S. Chau ,  Brian S. Doyle ,  Rafael Rios ,  Tom Linton ,  Suman Datta

Inventor： Scott A. Hareland ,  Robert S. Chau ,  Brian S. Doyle ,  Rafael Rios ,  Tom Linton ,  Suman Datta

IPC: H01L21/336 ,  H01L21/762

CPC classification number: H01L29/785 ,  H01L29/42384 ,  H01L29/42392 ,  H01L29/66545 ,  H01L29/66772 ,  H01L29/66795

Abstract: A nonplanar semiconductor device and its method of fabrication is described. The nonplanar semiconductor device includes a semiconductor body having a top surface opposite a bottom surface formed above an insulating substrate wherein the semiconductor body has a pair laterally opposite sidewalls. A gate dielectric is formed on the top surface of the semiconductor body on the laterally opposite sidewalls of the semiconductor body and on at least a portion of the bottom surface of semiconductor body. A gate electrode is formed on the gate dielectric, on the top surface of the semiconductor body and adjacent to the gate dielectric on the laterally opposite sidewalls of semiconductor body and beneath the gate dielectric on the bottom surface of the semiconductor body. A pair source/drain regions are formed in the semiconductor body on opposite sides of the gate electrode.

Abstract translation: 描述了非平面半导体器件及其制造方法。 非平面半导体器件包括半导体本体，该半导体本体具有与形成在绝缘基板上方的底表面相对的顶表面，其中半导体本体具有一对横向相对的侧壁。 在半导体本体的横向相对的侧壁和半导体本体的底表面的至少一部分上的半导体本体的顶表面上形成栅极电介质。 栅极电极形成在半导体本体的顶表面上并与半导体本体的横向相对的侧壁上的栅电介质相邻并位于半导体本体的底表面上的栅电介质之下的栅电介质上。 在栅电极的相对侧的半导体本体中形成一对源/漏区。

公开(公告)号：US20100327261A1

公开(公告)日：2010-12-30

申请号：US12876922

申请日：2010-09-07

Applicant: Mantu K. Hudait ,  Suman Datta ,  Jack T. Kavalieros ,  Peter G. Tolchinsky

Inventor： Mantu K. Hudait ,  Suman Datta ,  Jack T. Kavalieros ,  Peter G. Tolchinsky

IPC: H01L29/775 ,  H01L29/20

CPC classification number: H01L29/7782 ,  H01L21/02381 ,  H01L21/02433 ,  H01L21/02463 ,  H01L21/02505 ,  H01L21/02546 ,  H01L21/02573 ,  H01L21/0262 ,  H01L29/267 ,  H01L29/66431

Abstract: The present disclosure provides an apparatus and method for implementing a high hole mobility p-channel Germanium (“Ge”) transistor structure on a Silicon (“Si”) substrate. One exemplary apparatus may include a buffer layer including a GaAs nucleation layer, a first GaAs buffer layer, and a second GaAs buffer layer. The exemplary apparatus may further include a bottom barrier on the second GaAs buffer layer and having a band gap greater than 1.1 eV, a Ge active channel layer on the bottom barrier and having a valence band offset relative to the bottom barrier that is greater than 0.3 eV, and an AlAs top barrier on the Ge active channel layer wherein the AlAs top barrier has a band gap greater than 1.1 eV. Of course, many alternatives, variations and modifications are possible without departing from this embodiment.

Abstract translation: 本公开提供了一种在硅（“Si”）衬底上实现高空穴迁移率p沟道锗（“Ge”）晶体管结构的装置和方法。 一个示例性装置可以包括包括GaAs成核层，第一GaAs缓冲层和第二GaAs缓冲层的缓冲层。 该示例性装置还可以包括第二GaAs缓冲层上的底部阻挡层，并具有大于1.1eV的带隙，底部势垒上的Ge活性通道层，并且相对于底部势垒的价带偏移大于0.3 eV和Ge活性通道层上的AlAs顶部势垒，其中AlAs顶部势垒具有大于1.1eV的带隙。 当然，在不脱离本实施例的情况下，可以进行许多替代，变化和修改。

公开(公告)号：US07825400B2

公开(公告)日：2010-11-02

申请号：US11450745

申请日：2006-06-09

Applicant: Suman Datta ,  Jack T. Kavalieros ,  Been-Yih Jin

Inventor： Suman Datta ,  Jack T. Kavalieros ,  Been-Yih Jin

IPC: H01L29/06 ,  H01L31/072 ,  H01L31/109 ,  H01L31/0328 ,  H01L31/0336

CPC classification number: H01L29/1033 ,  H01L29/0673 ,  H01L29/201 ,  H01L29/205 ,  H01L29/41725 ,  H01L29/66431 ,  H01L29/66545 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/66787 ,  H01L29/775 ,  H01L29/78 ,  H01L29/785

Abstract: A method to form a strain-inducing semiconductor region is described. In one embodiment, formation of a strain-inducing semiconductor region laterally adjacent to a crystalline substrate results in a uniaxial strain imparted to the crystalline substrate, providing a strained crystalline substrate. In another embodiment, a semiconductor region with a crystalline lattice of one or more species of charge-neutral lattice-forming atoms imparts a strain to a crystalline substrate, wherein the lattice constant of the semiconductor region is different from that of the crystalline substrate, and wherein all species of charge-neutral lattice-forming atoms of the semiconductor region are contained in the crystalline substrate.

Abstract translation: 描述形成应变诱导半导体区域的方法。 在一个实施方案中，形成横向邻近晶体衬底的应变诱导半导体区域导致赋予晶体衬底的单轴应变，从而提供应变的晶体衬底。 在另一个实施方案中，具有一种或多种电荷 - 中性晶格形成原子的晶格的半导体区域向晶体衬底赋予应变，其中半导体区域的晶格常数与晶体衬底的晶格常数不同，以及 其中所述半导体区域的电荷 - 中性晶格形成原子的所有种类都包含在所述晶体衬底中。

公开(公告)号：US07736956B2

公开(公告)日：2010-06-15

申请号：US12079587

申请日：2008-03-26

Applicant: Suman Datta ,  Justin K. Brask ,  Jack Kavalieros ,  Brian S. Doyle ,  Gilbert Dewey ,  Mark L. Doczy ,  Robert S. Chau

Inventor： Suman Datta ,  Justin K. Brask ,  Jack Kavalieros ,  Brian S. Doyle ,  Gilbert Dewey ,  Mark L. Doczy ,  Robert S. Chau

IPC: H01L29/72

CPC classification number: H01L29/42376 ,  H01L21/28114 ,  H01L29/42384 ,  H01L29/495 ,  H01L29/517 ,  H01L29/66772 ,  H01L29/66795 ,  H01L29/785 ,  H01L29/78654

Abstract: Embodiments of the invention provide a device with a metal gate, a high-k gate dielectric layer, source/drain extensions a distance beneath the metal gate, and lateral undercuts in the sides of the metal gate.

Abstract translation: 本发明的实施例提供一种具有金属栅极，高k栅极电介质层，金属栅极下方距离的源极/漏极延伸部以及金属栅极侧面中的横向底切的器件。

公开(公告)号：US07629643B2

公开(公告)日：2009-12-08

申请号：US11948414

申请日：2007-11-30

Applicant: Ravi Pillarisetty ,  Suman Datta ,  Jack T. Kavalieros ,  Brian S. Doyle

Inventor： Ravi Pillarisetty ,  Suman Datta ,  Jack T. Kavalieros ,  Brian S. Doyle

IPC: H01L27/108

CPC classification number: H01L27/1104 ,  H01L27/0207 ,  H01L27/11 ,  H01L29/785

Abstract: Independent n-tips for multi-gate transistors are generally described. In one example, an apparatus includes a semiconductor fin, one or more multi-gate pull down (PD) devices coupled with the semiconductor fin, the one or more PD devices having an n-tip dopant concentration in the semiconductor fin material adjacent to the one or more PD devices, and one or more multi-gate pass gate (PG) devices coupled with the semiconductor fin, the one or more PG devices having an n-tip dopant concentration in the semiconductor fin material adjacent to the one or more PG devices, wherein the n-tip dopant concentration for the PG device is lower than the n-tip dopant concentration for the PD device.

Abstract translation: 通常描述多栅极晶体管的独立n尖端。 在一个示例中，设备包括半导体鳍片，与半导体鳍片耦合的一个或多个多栅极下拉（PD）器件，所述一个或多个PD器件在与半导体鳍片材料相邻的半导体鳍片材料中具有n尖端掺杂剂浓度 一个或多个PD器件，以及与半导体鳍片耦合的一个或多个多栅极通过栅极（PG）器件，所述一个或多个PG器件在与所述一个或多个PG相邻的半导体鳍片材料中具有n尖端掺杂剂浓度 器件，其中PG器件的n尖掺杂剂浓度低于PD器件的n尖掺杂剂浓度。