公开(公告)号：US07577115B2

公开(公告)日：2009-08-18

申请号：US11285943

申请日：2005-11-23

Applicant: Woo Jin Jang

Inventor： Woo Jin Jang

IPC: H04B7/216

CPC classification number: H04B1/70735 ,  H04B1/70752 ,  H04B1/7083 ,  H04B2201/70707

Abstract: Provided are an apparatus and a method for acquiring a code group that is used for a mobile communication terminal to acquire a scrambling code for identification of a base station. The present invention compares a part of slot values in code groups of the secondary synchronization channel transmitted to a mobile communication terminal from a base station with a part of code groups already known and, when there is a code group having a value higher than a predetermined value, reads code groups having the same pattern as that of the code group having a value higher than the predetermined value, which are previously stored in a predetermined storage. Then, the present invention excludes the read code groups from operations to reduce the quantity of unnecessary operations.

Abstract translation: 提供了一种用于获取用于移动通信终端获取用于识别基站的扰码的代码组的装置和方法。 本发明将从基站发送到移动通信终端的辅同步信道的码组中的时隙值的一部分与已知的一部分码组进行比较，并且当存在具有高于预定的值的码组时 值，读取具有与预先存储在预定存储器中的具有高于预定值的值的代码组相同模式的代码组。 然后，本发明将读取的代码组从操作中排除以减少不必要的操作的数量。

公开(公告)号：US20080012592A1

公开(公告)日：2008-01-17

申请号：US11760847

申请日：2007-06-11

Applicant: Yoon-gyu SONG ,  Woo-jin JANG

Inventor： Yoon-gyu SONG ,  Woo-jin JANG

IPC: G01R31/02 ,  H01R12/14

CPC classification number: G01R1/0466 ,  G01R1/0483 ,  H01L2224/16225 ,  H01L2924/1627

Abstract: A socket for testing a semiconductor package comprises two or more rubbers. Each rubber includes a chip-package contact portion configured to electrically connect with a chip package placed on the rubber and electrical wirings configured to electrically connect with the chip-package contact portion and having external contact ends configured to electrically connect with external electrical connections. The socket also comprises two or more guides configured to receive the chip package therein, the two or more guides including electrical wirings having external contact ends that are configured to be electrically connected with external electrical connections and a socket frame configured to hold the two or more rubbers and the two or more guides, wherein the rubbers correspond in number to the guides, and the rubbers and the guides are alternately stacked so that one rubber is located at a lowermost portion in a holding space of the socket frame.

Abstract translation: 用于测试半导体封装的插座包括两个或更多个橡胶。 每个橡胶包括芯片封装接触部分，其被配置为与放置在橡胶上的芯片封装电连接，并且电配线被配置为与芯片封装接触部分电连接并具有被配置为与外部电连接电连接的外部接触端。 插座还包括两个或多个引导件，其被配置为在其中容纳芯片封装，两个或多个引导件包括具有外部接触端的电线，该外部接触端被配置为与外部电连接电连接，并且插座框架被配置为保持两个或多个 橡胶和两个或更多个引导件，其中橡胶的数量与引导件相对应，并且橡胶和引导件交替地堆叠，使得一个橡胶位于插座框架的保持空间中的最下部。

公开(公告)号：US20070210450A1

公开(公告)日：2007-09-13

申请号：US11708496

申请日：2007-02-21

Applicant: Woo-Jin Jang ,  Kwang-Myeon Park

Inventor： Woo-Jin Jang ,  Kwang-Myeon Park

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L2224/0361 ,  H01L2224/03622 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/1147 ,  H01L2224/11912 ,  H01L2224/13007 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/05552 ,  H01L2924/013

Abstract: A bump may be formed by forming a diffusion barrier layer pattern over a substrate having a conductive pad; forming a seed layer over the substrate having the diffusion barrier layer pattern and the conductive pad; forming a conductive bump over the seed layer; and patterning the seed layer using the conductive bump as an etching mask.

Abstract translation: 可以通过在具有导电焊盘的衬底上形成扩散阻挡层图案来形成凸块; 在具有扩散阻挡层图案和导电焊盘的衬底上形成晶种层; 在种子层上形成导电凸块; 并使用导电凸块作为蚀刻掩模来图案化种子层。

公开(公告)号：US20060140155A1

公开(公告)日：2006-06-29

申请号：US11321239

申请日：2005-12-29

Applicant: Woo-Jin Jang ,  Hong-Woo Lee

Inventor： Woo-Jin Jang ,  Hong-Woo Lee

IPC: H04B7/216

CPC classification number: H04B1/70735

Abstract: Disclosed herein are a method and apparatus for acquiring a code group in an asynchronous Wideband Code Division Multiple Access (WCDMA) system. A primary synchronization channel search unit achieves primary synchronization channel slot timing synchronization. Then, the 1-1 search unit and 1-2 search unit of a secondary synchronization channel receive secondary synchronization channels from first and second antennas, respectively, start correlation operations between some of the slots of the received channels and code group candidates, and transmit information about candidates having values exceeding a predetermined threshold value to a determination unit. The determination unit transmits the received information about candidates to a second search unit of the secondary synchronization channel. The second search unit of the secondary synchronization channel calculates correlation characteristics based on the received information about candidates and selects a code group candidate having a highest correlation characteristic.

Abstract translation: 本文公开了一种用于在异步宽带码分多址（WCDMA）系统中获取码组的方法和装置。 主同步信道搜索单元实现主同步信道时隙定时同步。 然后，次同步信道的1-1搜索单元和1-2搜索单元分别从第一和第二天线接收辅同步信道，开始接收信道的一些时隙和码组候选之间的相关操作，并发送 关于具有超过预定阈值的值的候选的信息给确定单元。 确定单元将接收到的关于候选的信息发送到辅同步信道的第二搜索单元。 次同步信道的第二搜索单元基于所接收的关于候选的信息计算相关特性，并选择具有最高相关特性的码组候选。

公开(公告)号：US20110080902A1

公开(公告)日：2011-04-07

申请号：US12965387

申请日：2010-12-10

Applicant: Woo Jin JANG

Inventor： Woo Jin JANG

IPC: H04B7/208

CPC classification number: H04L27/2656 ,  H04B1/70752 ,  H04B1/70775 ,  H04B2201/70707 ,  H04L7/043 ,  H04L27/2675

Abstract: A preamble acquisition apparatus includes a first PN code generation unit for generating a first PN code having a bit string, a first correlation calculation unit for correlating a received frequency domain preamble signal with the first PN code within a first correlation range to generate a first correlation value, a first correlation value comparison unit for comparing the first correlation value with a first threshold value, a second PN code generation unit for generating a second PN code, a second correlation calculation unit for correlating the received frequency domain preamble signal with the second PN code within a second correlation range to generate a second correlation value, and a preamble acquisition determination unit for comparing the second correlation value with a second threshold value to determine whether to acquire the preamble. The bit values of the first PN code are located in the second PN code.

Abstract translation: 前导码获取装置包括：第一PN码产生单元，用于产生具有比特串的第一PN码;第一相关计算单元，用于将接收到的频域前导信号与第一相关范围内的第一PN码相关，以产生第一相关 第一相关值比较单元，用于将第一相关值与第一阈值进行比较;第二PN码产生单元，用于产生第二PN码;第二相关计算单元，用于将接收到的频域前导信号与第二PN 代码在第二相关范围内产生第二相关值，以及前导码获取确定单元，用于将第二相关值与第二阈值进行比较，以确定是否获取前导码。 第一PN码的位值位于第二PN码中。

公开(公告)号：US07879720B2

公开(公告)日：2011-02-01

申请号：US12241744

申请日：2008-09-30

Applicant: Woo Jin Jang ,  Sung Dong Cho ,  Hyung Woo Kim ,  Bum Ki Moon

Inventor： Woo Jin Jang ,  Sung Dong Cho ,  Hyung Woo Kim ,  Bum Ki Moon

IPC: H01L23/52 ,  H01L21/768

CPC classification number: H01L21/76804 ,  H01L21/76805 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/76844 ,  H01L21/76847 ,  H01L21/76849 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods of forming electrical interconnects include forming a copper pattern on a semiconductor substrate and then forming an electrically insulating capping layer on the copper pattern and an interlayer insulating layer on the electrically insulating capping layer. A contact hole is then formed, which extends through the interlayer insulating layer and the electrically insulating capping layer and exposes an upper surface of the copper pattern. An electroless plating step is then performed to form a copper pattern extension onto the exposed upper surface of the copper pattern. The copper pattern extension may have a thickness that is less than a thickness of the electrically insulating capping layer, which may be formed as a SiCN layer.

Abstract translation: 形成电互连的方法包括在半导体衬底上形成铜图案，然后在铜图案上形成电绝缘覆盖层，以及在电绝缘覆盖层上形成层间绝缘层。 然后形成接触孔，其延伸穿过层间绝缘层和电绝缘覆盖层并暴露铜图案的上表面。 然后执行化学镀步骤以在铜图案的暴露的上表面上形成铜图案延伸。 铜图案延伸部的厚度可以小于可以形成为SiCN层的电绝缘覆盖层的厚度。

公开(公告)号：US20070253472A1

公开(公告)日：2007-11-01

申请号：US11694243

申请日：2007-03-30

Applicant: Woo Jin JANG

Inventor： Woo Jin JANG

IPC: H04B1/707 ,  H04L27/28

CPC classification number: H04L27/2656 ,  H04B1/70752 ,  H04B1/70775 ,  H04B2201/70707 ,  H04L7/043 ,  H04L27/2675

Abstract: A preamble acquisition apparatus includes a first PN code generation unit for generating a first PN code having a bit string, a first correlation calculation unit for correlating a received frequency domain preamble signal with the first PN code within a first correlation range to generate a first correlation value, a first correlation value comparison unit for comparing the first correlation value with a first threshold value, a second PN code generation unit for generating a second PN code, a second correlation calculation unit for correlating the received frequency domain preamble signal with the second PN code within a second correlation range to generate a second correlation value, and a preamble acquisition determination unit for comparing the second correlation value with a second threshold value to determine whether to acquire the preamble. The bit values of the first PN code are located in the second PN code.

Abstract translation: 前导码获取装置包括：第一PN码产生单元，用于产生具有比特串的第一PN码;第一相关计算单元，用于将接收到的频域前导信号与第一相关范围内的第一PN码相关，以产生第一相关 第一相关值比较单元，用于将第一相关值与第一阈值进行比较;第二PN码产生单元，用于产生第二PN码;第二相关计算单元，用于将接收到的频域前导信号与第二PN 代码在第二相关范围内产生第二相关值，以及前导码获取确定单元，用于将第二相关值与第二阈值进行比较，以确定是否获取前导码。 第一PN码的位值位于第二PN码中。

公开(公告)号：US20060055037A1

公开(公告)日：2006-03-16

申请号：US11226797

申请日：2005-09-14

Applicant: Hyung-keun Park ,  Woo-jin Jang ,  Young-ho Kim ,  Tae-sung Moon

Inventor： Hyung-keun Park ,  Woo-jin Jang ,  Young-ho Kim ,  Tae-sung Moon

IPC: H01L23/48

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A microelectronic device chip including a hybrid Au bump in which foreign materials are not generated in a probe tip in an electrical die sorting (EDS) test is provided. The microelectronic device chip includes a chip pad which is connected to a microelectronic device formed on a substrate and on which the microelectronic device is brought into electrical contact with the outside of the chip. Further, the microelectronic device chip includes a bump which is formed on the chip pad and made up of a composite layer including two or more layers.

Abstract translation: 提供了一种包括在电模分类（EDS）测试中在探针尖端中不产生异物的混合Au凸块的微电子器件芯片。 微电子器件芯片包括芯片焊盘，其连接到形成在衬底上的微电子器件，并且微电子器件与芯片的外部电接触。 此外，微电子器件芯片包括形成在芯片焊盘上并由包括两层或更多层的复合层构成的凸块。

公开(公告)号：US08371551B2

公开(公告)日：2013-02-12

申请号：US12865834

申请日：2008-12-30

Applicant: Woo-Jin Jang

Inventor： Woo-Jin Jang

IPC: F25D23/00 ,  F16M13/00

CPC classification number: F25D23/00 ,  F25D2323/0011

Abstract: An apparatus for adjusting the level of a refrigerator includes: a main body; a guide groove formed to be level in a forward/backward direction of the main body; a movement unit inserted in the guide groove and moving in the direction in which the main body is inclined; a contact point part formed at one of both ends of the guide groove and selectively connected to the movement unit; and a notifying unit informing about whether or not the contact point part is connected. When the refrigerator is installed, an installation technician can recognize whether or not the refrigerator is installed to be level regardless of a skilled degree of the installation technician, so the installation time can be shortened and a service satisfaction of consumers can be increased.

Abstract translation: 一种用于调节冰箱水平的装置，包括：主体; 导向槽，其形成为在主体的前后方向上平坦; 移动单元，其插入所述引导槽并沿所述主体倾斜的方向移动; 接触点部分，其形成在所述引导槽的两端之一并且选择性地连接到所述移动单元; 以及通知单元，通知接点部分是否连接。 当安装冰箱时，无论安装技术人员的熟练程度如何，安装技术人员都可以识别冰箱的安装是否水平，因此可以缩短安装时间并且可以提高消费者的服务满意度。

公开(公告)号：US08272703B2

公开(公告)日：2012-09-25

申请号：US12061541

申请日：2008-04-02

Applicant: Woo Jin Jang

Inventor： Woo Jin Jang

IPC: A47B97/00

CPC classification number: F25D23/02 ,  F25D2323/023 ,  Y10T29/49

Abstract: Provided is a home-bar door and a method of manufacturing the home-bar door. The home-bar door includes a first case, an insulating plate, and a second case. The first case forms a portion of an exterior of the home-bar door, and the insulating plate is disposed in the first case as a separate component. The second case is configured to be coupled to the first case to cover the insulating plate and form the exterior of the home-bar door. Therefore, since the first and second cases can be coupled to each other after disposing the insulating plate between the first and second cases, the home-bar door can be efficiently manufactured and have good quality.

Abstract translation: 提供家庭酒吧门和制造家庭酒吧门的方法。 家庭门包括第一壳体，绝缘板和第二壳体。 第一种情况形成家庭门的外部的一部分，并且绝缘板作为单独的部件设置在第一壳体中。 第二壳体被配置为联接到第一壳体以覆盖绝缘板并形成家庭门的外部。 因此，由于第一壳体和第二壳体可以在将绝缘板设置在第一壳体和第二壳体之间而彼此耦合，所以可以有效地制造家用门门并且具有良好的质量。